WO2020258172A1 - 振动传感器、音频设备和振动传感器的组装方法 - Google Patents

振动传感器、音频设备和振动传感器的组装方法 Download PDF

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Publication number
WO2020258172A1
WO2020258172A1 PCT/CN2019/093335 CN2019093335W WO2020258172A1 WO 2020258172 A1 WO2020258172 A1 WO 2020258172A1 CN 2019093335 W CN2019093335 W CN 2019093335W WO 2020258172 A1 WO2020258172 A1 WO 2020258172A1
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WIPO (PCT)
Prior art keywords
gasket
chip
vibration sensor
circuit board
elastic membrane
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Application number
PCT/CN2019/093335
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English (en)
French (fr)
Inventor
张金宇
Original Assignee
瑞声声学科技(深圳)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/093335 priority Critical patent/WO2020258172A1/zh
Priority to CN201910605987.2A priority patent/CN110351642B/zh
Priority to US16/986,208 priority patent/US20200408593A1/en
Publication of WO2020258172A1 publication Critical patent/WO2020258172A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the invention relates to the field of microphones, in particular to a vibration sensor, audio equipment and a method for assembling the vibration sensor.
  • the prior art vibration sensor generally includes a housing, a mounting board arranged in the housing, an elastic membrane attached to the upper side of the mounting board, and a MEMS chip mounted on the lower side of the mounting board and enclosed with the mounting board to form a front cavity.
  • the plate is provided with a through hole connecting the front cavity and the elastic membrane.
  • the object of the present invention is to provide a vibration sensor with a small height and high sensitivity.
  • a vibration sensor includes a cavity with an inner wall, a gasket, an elastic membrane and a MEMS chip with a back cavity arranged in the cavity, the gasket is arranged on the inner wall, and the elastic membrane is arranged on the On the side of the gasket facing away from the inner wall, the MEMS chip is provided on the side of the elastic membrane facing away from the gasket, and the side of the gasket facing the elastic membrane is provided with a recess A hole, the elastic film covers the concave hole and the elastic film is provided with a through hole.
  • the recessed hole penetrates from the side of the gasket facing the elastic membrane to the side of the gasket facing the inner wall.
  • the cavity includes a circuit board and a shell fixed on the circuit board, and the circuit board is formed as the inner wall.
  • the vibration sensor further includes an integrated circuit chip arranged in the cavity, and the integrated circuit chip is electrically connected to the circuit board and the MEMS chip for processing the vibration signal picked up by the MEMS chip .
  • the MEMS chip is a MEMS microphone chip or a MEMS pressure sensor chip.
  • An audio device including the vibration sensor described above.
  • a method for assembling a vibration sensor includes the following steps:
  • the gasket, the elastic membrane and the MEMS chip are transferred and installed into the cavity from the tooling.
  • a housing is installed on one side of the circuit board so that the gasket, the elastic membrane and the MEMS chip are contained in a cavity formed by the housing and the circuit board.
  • the assembly method further includes: mounting an integrated circuit chip on the top surface of the gasket;
  • the assembly further includes: connecting a first connection line between the integrated circuit chip and the MEMS chip;
  • the assembling method further includes:
  • a second connection line is connected between the integrated circuit chip and the circuit board.
  • the beneficial effects of the present invention are: a gasket is attached to the inner wall of the cavity, a concave hole is opened on the gasket, and an elastic film is attached to the inner wall of the gasket away from the cavity, the elastic film covers the concave hole and the elastic film is opened There are through holes connected with concave holes.
  • the back cavity of the MEMS chip communicates with the concave holes through the through hole, which improves the sensitivity of the vibration sensor.
  • the MEMS chip replaces the mass block, the volume of the front cavity is reduced and the height of the product is reduced. reduce.
  • Fig. 1 is a schematic structural diagram of a vibration sensor provided by an embodiment of the present invention
  • Figure 2 is an exploded view of the vibration sensor in Figure 1;
  • Figure 3 is a cross-sectional view along line A-A of Figure 1;
  • FIG. 4 is a partial flowchart of a method for assembling a vibration sensor according to an embodiment of the present invention
  • FIG. 5 is another partial flowchart of the method for assembling a vibration sensor according to an embodiment of the present invention.
  • Vibration sensor 100.
  • Cavity 1.
  • Gasket 2.
  • Elastic membrane 3.
  • MEMS chip 20.
  • Recessed hole 30. Through hole; 11.
  • Inner cavity; 40 Cavity; 5. integrated circuit chip; 6. tooling; 61, boss; 71, first connection line; 72, second connection line.
  • a vibration sensor 100 please refer to Figures 1 to 3, comprising a cavity 1 with an inner wall, a gasket 2, an elastic membrane 3, and a MEMS chip 4 with a back cavity provided in the cavity 1.
  • the pad The sheet 2 is provided on the inner wall, the elastic membrane 3 is provided on the side of the gasket 2 facing away from the inner wall, and the MEMS chip 4 is provided on the elastic membrane 3 facing away from the gasket
  • On the side surface of the gasket 2 the side surface of the gasket 2 facing the elastic membrane 3 is provided with a recessed hole 20, the elastic membrane 3 covers the recessed hole 20, and the elastic membrane 3 is provided with a penetrating elastic
  • the through hole 30 of the membrane 3 communicates with the recessed hole 20 and the back cavity 40.
  • the MEMS chip 4 is mounted on the upper side of the elastic membrane 3.
  • the MEMS chip 4 vibrates up and down with the elastic membrane 3, causing the volume change in the cavity 20 and the gas pressure in the cavity 20 Following the change, the changed pressure signal is picked up by the MEMS chip 4 and converted into an electrical signal.
  • the changed pressure signal is more easily picked up by the MEMS chip 4, which improves the sensitivity of the vibration sensor 100.
  • due to The MEMS chip 4 replaces the mass block, and the height of the product is reduced.
  • the concave hole 20 penetrates from the side of the gasket 2 facing the elastic membrane 3 to the side of the gasket 2 facing the inner wall. In this way, the gasket 2 is fully utilized, and the volume of the concave hole 20 is increased.
  • the cavity 1 includes a circuit board 11 and a housing 12 fixed on the circuit board 11, and the circuit board 11 is formed as the inner wall.
  • the housing 12 has an inner cavity 120, and the housing 12 is arranged outside the gasket 2, the elastic membrane 3 and the MEMS chip 4.
  • the circuit board 11 is fully utilized to reduce the size of the vibration sensor 100.
  • the inner cavity 120 of the housing 12 is formed as the rear cavity of the vibration sensor 100, and the concave hole 20 and the circuit board 11 are enclosed to form the front cavity of the vibration sensor 100.
  • Both the concave hole 20 and the through hole 30 are cylindrical, and preferably the central axes of the concave hole 20 and the through hole 30 are collinear.
  • the vibration sensor 100 further includes an integrated circuit chip 5 arranged in the cavity 1, and the integrated circuit chip 5 is electrically connected to the circuit board 11 and the MEMS chip 4 for processing The vibration signal picked up by the MEMS chip 4 is described.
  • the integrated circuit chip 5 can be arranged on the top surface of the pad 2 or on the top surface of the circuit board 11.
  • the MEMS chip 4 is a MEMS microphone chip or a MEMS pressure sensor chip.
  • the present invention also provides an audio device (not shown in the figure), including the vibration sensor 100 as described above.
  • Figure 5 is the step of connecting Figure 4, including the following steps:
  • the gasket 2, the elastic membrane 3 and the MEMS chip 4 are transferred from the tooling 6 into the cavity 1.
  • the boss 61 supports the elastic film 3, and when the MEMS chip is placed on the elastic film 3, the support of the boss 61 prevents the elastic film 3 from being deformed and ensures the structural stability during assembly.
  • the elastic film 3 is pasted on the gasket 2 by glue.
  • the MEMS chip 4 is arranged on the elastic membrane 3 by gluing.
  • the implementation of transferring the gasket 2, the elastic membrane 3 and the MEMS chip 4 from the tooling 6 into the cavity 1 is as follows:
  • a housing 12 is installed on one side of the circuit board 11 so that the gasket 2, the elastic membrane 3 and the MEMS chip 4 are contained in the cavity 1 formed by the housing 12 and the circuit board 11.
  • the assembly method further includes: arranging the integrated circuit chip 5 on the top surface of the gasket 2;
  • the assembly method further includes: connecting the integrated circuit chip 5 and the MEMS chip 4 to a first connection line 71;
  • the integrated circuit chip 5 is mounted on the gasket 6 by adhesive.
  • the integrated circuit chip is an ASIC chip.
  • a housing 12 is installed on one side of the circuit board 11 to cover the gasket 2, the elastic membrane 3 and the MEMS chip 4.
  • a housing 12 is mounted on one side of the circuit board 11 and the gasket 2, the elastic membrane 3 and the MEMS chip 4 are covered.
  • the tooling 6 with the boss 61 provides support to ensure the stability of the structure for mounting the elastic membrane 3 and the MEMS chip 4 Sex.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本发明提供了振动传感器、音频设备和振动传感器的组装方法，所述振动传感器包括具有内壁的腔体以及设于所述腔体内的垫片、弹性膜和具有背腔的MEMS芯片，所述垫片设于所述内壁上，所述弹性膜设于所述垫片之背对所述内壁的侧面上，所述MEMS芯片设于所述弹性膜之背对所述垫片的侧面上，所述垫片之朝向所述弹性膜的侧面上开设有凹孔，所述弹性膜覆盖所述凹孔且所述弹性膜上贯穿开设有通孔。本发明的振动传感器降低了产品的高度、提高了拾取振动信号的灵敏度。

Description

振动传感器、音频设备和振动传感器的组装方法 技术领域
本发明涉及麦克风领域，特别涉及一种振动传感器、音频设备和振动传感器的组装方法。
 背景技术
现有技术的振动传感器一般包括外壳、设于外壳内的安装板、贴设于安装板的上侧面的弹性膜和安装于安装板的下侧与安装板围合形成前腔的MEMS芯片，安装板上开设有连通前腔和弹性膜的通孔，当外界振动信号通过结构传导至振动传感器上时，质量块上下振动，引起前腔体积变化，前腔内气体压强随之发生变化，变化的压强信号被MEMS芯片拾取到，转化为电信号，但是现有技术的振动传感器存在高度较高且灵敏度低的问题。
因此，有必要提供一种能高度较小且灵敏度高的振动传感器。
 技术问题
本发明的目的在于提供一种高度较小且灵敏度高的振动传感器。
 技术解决方案
本发明的技术方案如下：
一种振动传感器，包括具有内壁的腔体以及设于所述腔体内的垫片、弹性膜和具有背腔的MEMS芯片，所述垫片设于所述内壁上，所述弹性膜设于所述垫片之背对所述内壁的侧面上，所述MEMS芯片设于所述弹性膜之背对所述垫片的侧面上，所述垫片之朝向所述弹性膜的侧面上开设有凹孔，所述弹性膜覆盖所述凹孔且所述弹性膜上贯穿开设有通孔。
进一步地，所述凹孔从所述垫片之朝向所述弹性膜的侧面朝向所述垫片之朝向所述内壁的侧面贯穿设置。
进一步地，所述腔体包括电路板及固定于所述电路板上的外壳，所述电路板形成为所述内壁。
进一步地，所述振动传感器还包括设于所述腔体内的集成电路芯片，所述集成电路芯片与所述电路板、所述MEMS芯片均电连接以用于处理所述MEMS芯片拾取的振动信号。
进一步地，所述MEMS芯片为MEMS麦克风芯片或者MEMS压力传感器芯片。
还提供一种音频设备，包括如上所述的振动传感器。
还提供一种振动传感器的组装方法，包括如下步骤：
将垫片安装于具有凸台的工装上，并使所述凸台卡插于凹孔内；
将弹性膜贴于所述垫片的顶面上且覆盖所述凹孔；
将MEMS芯片安装于所述弹性膜的顶面上；
将所述垫片、所述弹性膜和所述MEMS芯片从所述工装上转移安装至腔体内。
进一步地，将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至所述腔体内的实施方式为：
将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至电路板上，且所述电路板与所述垫片的底面贴合；
在所述电路板的一侧安装外壳以使所述垫片、弹性膜和所述MEMS芯片收容于由所述外壳和所述电路板构成的腔体内。
进一步地，在将所述垫片安装于所述工装之前，所述组装方法还包括：将集成电路芯片安装于所述垫片的顶面上；
在将所述MEMS芯片安装于所述弹性膜的顶面上之后，且在将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至所述腔体内之前，所述组装方法还包括：在所述集成电路芯片与所述MEMS芯片连接第一连接线；
在将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至电路板上之后，在所述集成电路芯片与所述电路板之间连接第二连接线。
优选地，在将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至电路板上之后，所述组装方法还包括：
将集成电路芯片安装于所述电路板的顶面上；
在所述集成电路芯片与所述MEMS芯片之间连接第一连接线；
在所述集成电路芯片与所述电路板之间连接第二连接线。
 有益效果
本发明的有益效果在于：在腔体的内壁上贴设垫片，在垫片上开凹孔，在垫片背离腔体的内壁面上贴弹性膜，弹性膜覆盖凹孔且弹性膜上开设有连通凹孔的通孔，MEMS芯片的背腔通过通孔与凹孔连通，提高了振动传感器的灵敏度，除此之外，由于MEMS芯片代替质量块，前腔的体积减小，产品的高度降低。
 附图说明
图1为本发明实施例提供的振动传感器的结构示意图；
图2为图1中振动传感器的爆炸图；
图3为图1沿A-A线的剖面图；
图4为本发明实施例提供的振动传感器的组装方法的部分流程图；
图5为本发明实施例提供的振动传感器的组装方法的另一部分流程图。
图中：
100、振动传感器；1、腔体；2、垫片；3、弹性膜；4、MEMS芯片；20、凹孔；30、通孔；11、电路板；12、外壳；120、内腔；40、凹腔；5、集成电路芯片；6、工装；61、凸台；71、第一连接线；72、第二连接线。
 本发明的实施方式
下面结合附图和实施方式对本发明作进一步说明。
一种振动传感器100，请参照图1-图3，包括具有内壁的腔体1以及设于所述腔体1内的垫片2、弹性膜3和具有背腔的MEMS芯片4，所述垫片2设于所述内壁上，所述弹性膜3设于所述垫片2之背对所述内壁的侧面上，所述MEMS芯片4设于所述弹性膜3的背对所述垫片2的侧面上，所述垫片2之朝向所述弹性膜3的侧面上开设有凹孔20，所述弹性膜3覆盖所述凹孔20且所述弹性膜3上开设有贯穿所述弹性膜3的通孔30，所述通孔连通所述凹孔20与所述背腔40。
MEMS芯片4安装于弹性膜3的上侧面，当外界振动信号通过结构传导至振动传感器100上时，MEMS芯片4随弹性膜3上下振动，引起凹孔20内体积变化，凹孔20内气体压强随之发生变化，变化的压强信号被MEMS芯片4拾取，并转化为电信号，如此，变化的压强信号更容易被MEMS芯片4拾取到，提高了振动传感器100的灵敏度，除此之外，由于MEMS芯片4代替质量块，产品的高度降低。
优选地，所述凹孔20从所述垫片2的朝向所述弹性膜3的侧面向所述垫片2的朝向所述内壁的侧面贯穿设置。如此，充分利用垫片2，增加凹孔20的体积。
优选地，所述腔体1包括电路板11及固定于所述电路板11上的外壳12，所述电路板11形成为所述内壁。所述外壳12具有内腔120，外壳12罩设于垫片2、弹性膜3和MEMS芯片4外。充分利用电路板11，减小振动传感器100的尺寸。
具体地，外壳12的内腔120形成为振动传感器100的后腔，凹孔20与电路板11围合形成为振动传感器100的前腔。
凹孔20和通孔30均呈圆柱形，优选凹孔20与通孔30两者的中轴线共线。
优选地，所述振动传感器100还包括设于所述腔体1内的集成电路芯片5，所述集成电路芯片5与所述电路板11和所述MEMS芯片4均电连接以用于处理所述MEMS芯片4拾取的振动信号。集成电路芯片5既可设于垫片2的顶面上，也可设于电路板11的顶面上。
优选地，MEMS芯片4为MEMS麦克风芯片或者MEMS压力传感器芯片。
本发明还提供一种音频设备（图中未示），包括如上所述的振动传感器100。
本发明还提供一种组装方法，请参照图4和图5，图5为接上图4的步骤，包括如下步骤：
将垫片2安装于具有凸台61的工装6上，并使所述凸台6卡插于凹孔20内；
将弹性膜3贴于所述垫片2的顶面上且覆盖所述凹孔20；
将所述MEMS芯片4安装于所述弹性膜3的顶面上；
将所述垫片2、弹性膜3和所述MEMS芯片4从所述工装6上转移至所述腔体1内。
贴弹性膜3时，凸台61支撑弹性膜3，将MEMS芯片设于弹性膜3上时，由于凸台61的支撑，避免弹性膜3变形，保证组装时结构稳定。
优选地，所述弹性膜3通过胶粘贴于所述垫片2上。
优选地，所述MEMS芯片4通过胶粘设于所述弹性膜3上。
优选地，将所述垫片2、弹性膜3和所述MEMS芯片4从所述工装6上转移安装至所述腔体1内的实施方式为：
将所述垫片2、弹性膜3和所述MEMS芯片4从所述工装6上转移安装至电路板11上，且所述电路板11与所述垫片2的底面贴合；
在所述电路板11的一侧安装外壳12以使所述垫片2、弹性膜3和所述MEMS芯片4收容于由外壳12和电路板11构成的腔体1内。
优选地，在将垫片2安装于所述工装6上之前，所述组装方法还包括：将集成电路芯片5设于所述垫片2的顶面上；
在将所述MEMS芯片4安装于所述弹性膜3的顶面上之后，且在将所述垫2、弹性膜3和所述MEMS芯片4从所述工装6上转移安装至所述腔体1内之前，所述组装方法还包括：在所述集成电路芯片5与所述MEMS芯片4连接第一连接线71；
在将所述垫片2、弹性膜3和所述MEMS芯片4从所述工装6上转移安装至电路板11上之后，在所述集成电路芯片5与所述电路板11之间连接第二连接线72。
优选地，所述集成电路芯片5通过胶粘设于所述垫片6上。
优选集成电路芯片为ASIC芯片。
现提供一种振动传感器100的组装方法的实施例，包括步骤：
将垫片2安装于具有凸台61的工装6上，并使所述凸台6卡插于凹孔20内；
将集成电路芯片5设于所述垫片2的顶面上；
将弹性膜3贴于所述垫片2的顶面上且覆盖所述凹孔20；
将所述MEMS芯片4安装于所述弹性膜3的顶面上；
在所述集成电路芯片5与所述MEMS芯片4连接第一连接线71；
将所述垫片2、弹性膜3和所述MEMS芯片4从所述工装6上转移安装至电路板11上，且所述电路板11与所述垫片2的底面贴合；
在所述集成电路芯片5与所述电路板11之间连接第二连接线72；
在所述电路板11的一侧安装外壳12并将所述垫片2、弹性膜3和所述MEMS芯片4罩住。
现提供另一种振动传感器100的组装方法的实施例，包括步骤：
将垫片2安装于具有凸台61的工装6上，并使所述凸台6卡插于凹孔20内；
将集成电路芯片5设于所述垫片2的顶面上；
将弹性膜3贴于所述垫片2的顶面上且覆盖所述凹孔20；
将所述垫片2、弹性膜3和所述MEMS芯片4从所述工装6上转移安装至电路板11上，且所述电路板11与所述垫片2的底面贴合；
将集成电路芯片5安装于所述电路板11的顶面上；
在所述集成电路芯片5与所述MEMS芯片4连接第一连接线71；
在所述集成电路芯片5与所述电路板11之间连接第二连接线72；
在所述电路板11的一侧安装外壳12并将所述垫片2、弹性膜3和所述MEMS芯片4罩住。
本发明提供的振动传感器100的组装方法，在垫片2上安装弹性膜3和MEMS芯片4时，通过具有凸台61的工装6提供支撑，保证安装弹性膜3和MEMS芯片4的结构的稳定性。
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。
 

Claims (10)

  1. 一种振动传感器，其特征在于，包括具有内壁的腔体以及设于所述腔体内的垫片、弹性膜和具有背腔的MEMS芯片，所述垫片设于所述内壁上，所述弹性膜设于所述垫片之背对所述内壁的侧面上，所述MEMS芯片设于所述弹性膜之背对所述垫片的侧面上，所述垫片之朝向所述弹性膜的侧面上开设有凹孔，所述弹性膜覆盖所述凹孔且所述弹性膜上贯穿开设有通孔，所述通孔连通所述凹孔与所述背腔。
  2. 根据权利要求1所述的振动传感器，其特征在于，所述凹孔从所述垫片之朝向所述弹性膜的侧面朝向所述垫片之朝向所述内壁的侧面贯穿设置。
  3. 根据权利要求1所述的振动传感器，其特征在于：所述腔体包括电路板及固定于所述电路板上的外壳，所述电路板形成为所述内壁。
  4. 根据权利要求1至3任一项所述的振动传感器，其特征在于：所述振动传感器还包括设于所述腔体内的集成电路芯片，所述集成电路芯片与所述电路板、所述MEMS芯片均电连接以用于处理所述MEMS芯片拾取的振动信号。
  5. 根据权利要求1至3任一项所述的振动传感器，其特征在于：所述MEMS芯片为MEMS麦克风芯片或者MEMS压力传感器芯片。
  6. 一种音频设备，其特征在于，包括如权利要求1-5中任意一项所述的振动传感器。
  7. 一种振动传感器的组装方法，其特征在于，包括如下步骤：
    将垫片安装于具有凸台的工装上，并使所述凸台卡插于凹孔内；
    将弹性膜贴于所述垫片的顶面上且覆盖所述凹孔；
    将MEMS芯片安装于所述弹性膜的顶面上；
    将所述垫片、所述弹性膜和所述MEMS芯片从所述工装上转移安装至腔体内。
  8. 如权利要求7所述的振动传感器的组装方法，其特征在于，
    将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至所述腔体内的实施方式为：
    将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至电路板上，且所述电路板与所述垫片的底面贴合；
    在所述电路板的一侧安装外壳以使所述垫片、弹性膜和所述MEMS芯片收容于由所述外壳和所述电路板构成的腔体内。
  9. 如权利要求8所述的振动传感器的组装方法，其特征在于，在将所述垫片安装于所述工装之前，所述组装方法还包括：将集成电路芯片安装于所述垫片的顶面上；
    在将所述MEMS芯片安装于所述弹性膜的顶面上之后，且在将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至所述腔体内之前，所述组装方法还包括：在所述集成电路芯片与所述MEMS芯片连接第一连接线；
    在将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至电路板上之后，在所述集成电路芯片与所述电路板之间连接第二连接线。
  10. 如权利要求8所述的振动传感器的组装方法，其特征在于，在将所述垫片、弹性膜和所述MEMS芯片从所述工装上转移安装至电路板上之后，所述组装方法还包括：
    将集成电路芯片安装于所述电路板的顶面上；
    在所述集成电路芯片与所述MEMS芯片之间连接第一连接线；
    在所述集成电路芯片与所述电路板之间连接第二连接线。
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