JP4499567B2 - 基板上のポリマーの堆積を減少させるためのデバイスを備えたプラズマ装置及びポリマーの堆積を減少させるための方法 - Google Patents

基板上のポリマーの堆積を減少させるためのデバイスを備えたプラズマ装置及びポリマーの堆積を減少させるための方法 Download PDF

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JP4499567B2
JP4499567B2 JP2004537702A JP2004537702A JP4499567B2 JP 4499567 B2 JP4499567 B2 JP 4499567B2 JP 2004537702 A JP2004537702 A JP 2004537702A JP 2004537702 A JP2004537702 A JP 2004537702A JP 4499567 B2 JP4499567 B2 JP 4499567B2
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ring
substrate
steps
substrate support
coupling
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JP2006500766A (ja
JP2006500766A5 (enExample
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ホセ トング，
エリック， エイチ． レンツ，
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/915—Differential etching apparatus including focus ring surrounding a wafer for plasma apparatus

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP2004537702A 2002-09-20 2003-08-28 基板上のポリマーの堆積を減少させるためのデバイスを備えたプラズマ装置及びポリマーの堆積を減少させるための方法 Expired - Fee Related JP4499567B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/251,179 US7252738B2 (en) 2002-09-20 2002-09-20 Apparatus for reducing polymer deposition on a substrate and substrate support
PCT/US2003/027055 WO2004027815A1 (en) 2002-09-20 2003-08-28 Plasma apparatus with device for reducing polymer deposition on a substrate and method for reducing polymer deposition

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Publication Number Publication Date
JP2006500766A JP2006500766A (ja) 2006-01-05
JP2006500766A5 JP2006500766A5 (enExample) 2006-10-12
JP4499567B2 true JP4499567B2 (ja) 2010-07-07

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US (2) US7252738B2 (enExample)
EP (1) EP1543537B1 (enExample)
JP (1) JP4499567B2 (enExample)
KR (1) KR101008863B1 (enExample)
CN (2) CN100533658C (enExample)
AT (1) ATE527679T1 (enExample)
AU (1) AU2003260128A1 (enExample)
TW (1) TWI324804B (enExample)
WO (1) WO2004027815A1 (enExample)

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US20080041820A1 (en) 2008-02-21
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US7252738B2 (en) 2007-08-07
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US7867356B2 (en) 2011-01-11
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