USD979524S1 - Confinement liner for a substrate processing chamber - Google Patents
Confinement liner for a substrate processing chamber Download PDFInfo
- Publication number
- USD979524S1 USD979524S1 US29/728,614 US202029728614F USD979524S US D979524 S1 USD979524 S1 US D979524S1 US 202029728614 F US202029728614 F US 202029728614F US D979524 S USD979524 S US D979524S
- Authority
- US
- United States
- Prior art keywords
- processing chamber
- substrate processing
- confinement
- liner
- confinement liner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines shown in the drawings represent portions of a confinement liner for a substrate processing chamber that form no part of the claimed design.
Claims (1)
- The ornamental design for a confinement liner for a substrate processing chamber, as shown and described.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/728,614 USD979524S1 (en) | 2020-03-19 | 2020-03-19 | Confinement liner for a substrate processing chamber |
TW109305178D01F TWD215698S (en) | 2020-03-19 | 2020-09-15 | Confinement liner for a substrate processing chamber |
TW109305178F TWD215697S (en) | 2020-03-19 | 2020-09-15 | Confinement liner for a substrate processing chamber |
JPD2020-20094F JP1686347S (en) | 2020-03-19 | 2020-09-19 | |
JPD2021-5063F JP1692414S (en) | 2020-03-19 | 2020-09-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/728,614 USD979524S1 (en) | 2020-03-19 | 2020-03-19 | Confinement liner for a substrate processing chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
USD979524S1 true USD979524S1 (en) | 2023-02-28 |
Family
ID=76083950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/728,614 Active USD979524S1 (en) | 2020-03-19 | 2020-03-19 | Confinement liner for a substrate processing chamber |
Country Status (3)
Country | Link |
---|---|
US (1) | USD979524S1 (en) |
JP (2) | JP1686347S (en) |
TW (2) | TWD215698S (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD233706S (en) | 2023-10-27 | 2024-09-21 | 俊龍 吳 | Nozzle pad |
Citations (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6129808A (en) | 1998-03-31 | 2000-10-10 | Lam Research Corporation | Low contamination high density plasma etch chambers and methods for making the same |
US6156151A (en) | 1996-07-19 | 2000-12-05 | Tokyo Electron Limited | Plasma processing apparatus |
US6224472B1 (en) * | 1999-06-24 | 2001-05-01 | Samsung Austin Semiconductor, L.P. | Retaining ring for chemical mechanical polishing |
US6464843B1 (en) | 1998-03-31 | 2002-10-15 | Lam Research Corporation | Contamination controlling method and apparatus for a plasma processing chamber |
US6506254B1 (en) | 2000-06-30 | 2003-01-14 | Lam Research Corporation | Semiconductor processing equipment having improved particle performance |
US6506685B2 (en) | 1998-12-28 | 2003-01-14 | Lam Research Corporation | Perforated plasma confinement ring in plasma reactors |
US20030092278A1 (en) | 2001-11-13 | 2003-05-15 | Fink Steven T. | Plasma baffle assembly |
US20040075036A1 (en) * | 2002-10-04 | 2004-04-22 | Ceramic Component Technologies, Inc. | Test plate for ceramic surface mount devices and other electronic components |
WO2004059716A1 (en) | 2002-12-20 | 2004-07-15 | Lam Research Corporation | A system and method for controlling plasma with an adjustable coupling to ground circuit |
USD494551S1 (en) * | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
US20060283551A1 (en) * | 2005-06-17 | 2006-12-21 | Sung-Ku Son | Confinement ring assembly of plasma processing apparatus |
US7267741B2 (en) | 2003-11-14 | 2007-09-11 | Lam Research Corporation | Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon |
US20080110567A1 (en) | 2006-11-15 | 2008-05-15 | Miller Matthew L | Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution |
US7552521B2 (en) | 2004-12-08 | 2009-06-30 | Tokyo Electron Limited | Method and apparatus for improved baffle plate |
US20090188625A1 (en) | 2008-01-28 | 2009-07-30 | Carducci James D | Etching chamber having flow equalizer and lower liner |
US7585384B2 (en) | 2003-04-17 | 2009-09-08 | Applied Materials, Inc. | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor |
US7802539B2 (en) | 2000-06-30 | 2010-09-28 | Lam Research Corporation | Semiconductor processing equipment having improved particle performance |
US7837826B2 (en) | 2006-07-18 | 2010-11-23 | Lam Research Corporation | Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof |
US20100304571A1 (en) | 2007-12-19 | 2010-12-02 | Larson Dean J | Film adhesive for semiconductor vacuum processing apparatus |
JP2011040461A (en) | 2009-08-07 | 2011-02-24 | Tokyo Electron Ltd | Baffle plate and plasma processing apparatus |
US20110100553A1 (en) | 2009-08-31 | 2011-05-05 | Rajinder Dhindsa | multi-peripheral ring arrangement for performing plasma confinement |
US20110226739A1 (en) | 2010-03-19 | 2011-09-22 | Varian Semiconductor Equipment Associates, Inc. | Process chamber liner with apertures for particle containment |
US8298046B2 (en) * | 2009-10-21 | 2012-10-30 | SPM Technology, Inc. | Retaining rings |
US20120273130A1 (en) | 2011-04-28 | 2012-11-01 | Lam Research Corporation | Internal Faraday Shield Having Distributed Chevron Patterns and Correlated Positioning Relative to External Inner and Outer TCP Coil |
US8485128B2 (en) | 2010-06-30 | 2013-07-16 | Lam Research Corporation | Movable ground ring for a plasma processing chamber |
US8517803B2 (en) * | 2009-09-16 | 2013-08-27 | SPM Technology, Inc. | Retaining ring for chemical mechanical polishing |
US8622021B2 (en) | 2007-10-31 | 2014-01-07 | Lam Research Corporation | High lifetime consumable silicon nitride-silicon dioxide plasma processing components |
USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
US20140113453A1 (en) | 2012-10-24 | 2014-04-24 | Lam Research Corporation | Tungsten carbide coated metal component of a plasma reactor chamber and method of coating |
US20140116338A1 (en) | 2012-10-29 | 2014-05-01 | Advanced Micro-Fabrication Equipment Inc, Shanghai | Coating for performance enhancement of semiconductor apparatus |
USD709539S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709537S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709538S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
US8826855B2 (en) | 2010-06-30 | 2014-09-09 | Lam Research Corporation | C-shaped confinement ring for a plasma processing chamber |
US8893702B2 (en) | 2013-02-20 | 2014-11-25 | Lam Research Corporation | Ductile mode machining methods for hard and brittle components of plasma processing apparatuses |
USD729730S1 (en) * | 2013-06-06 | 2015-05-19 | Jon Simon Gillespie-Brown | Power charging ring |
US9123661B2 (en) | 2013-08-07 | 2015-09-01 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
US9184029B2 (en) | 2013-09-03 | 2015-11-10 | Lam Research Corporation | System, method and apparatus for coordinating pressure pulses and RF modulation in a small volume confined process reactor |
US20150329955A1 (en) | 2014-05-16 | 2015-11-19 | Applied Materials, Inc. | Plasma spray coating design using phase and stress control |
US20160002788A1 (en) * | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
US9330927B2 (en) | 2013-08-28 | 2016-05-03 | Lam Research Corporation | System, method and apparatus for generating pressure pulses in small volume confined process reactor |
US20160158910A1 (en) * | 2013-07-11 | 2016-06-09 | Will Be S & T Co., Ltd. | Retainer ring for chemical-mechanical polishing device |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
US9508530B2 (en) | 2011-11-21 | 2016-11-29 | Lam Research Corporation | Plasma processing chamber with flexible symmetric RF return strap |
CN106898534A (en) | 2015-12-21 | 2017-06-27 | 中微半导体设备(上海)有限公司 | Plasma confinement ring, plasma processing apparatus and processing method for substrate |
USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
US9779916B2 (en) | 2009-08-31 | 2017-10-03 | Lam Research Corporation | Radio frequency (RF) ground return arrangements |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
US20180061618A1 (en) | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Plasma screen for plasma processing chamber |
USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
US10672629B2 (en) * | 2016-09-28 | 2020-06-02 | Samsung Electronics Co., Ltd. | Ring assembly and chuck assembly having the same |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD895777S1 (en) * | 2017-09-20 | 2020-09-08 | Gardner Denver Petroleum Pumps Llc | Header ring |
-
2020
- 2020-03-19 US US29/728,614 patent/USD979524S1/en active Active
- 2020-09-15 TW TW109305178D01F patent/TWD215698S/en unknown
- 2020-09-15 TW TW109305178F patent/TWD215697S/en unknown
- 2020-09-19 JP JPD2020-20094F patent/JP1686347S/ja active Active
- 2020-09-19 JP JPD2021-5063F patent/JP1692414S/ja active Active
Patent Citations (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6156151A (en) | 1996-07-19 | 2000-12-05 | Tokyo Electron Limited | Plasma processing apparatus |
US6464843B1 (en) | 1998-03-31 | 2002-10-15 | Lam Research Corporation | Contamination controlling method and apparatus for a plasma processing chamber |
US6129808A (en) | 1998-03-31 | 2000-10-10 | Lam Research Corporation | Low contamination high density plasma etch chambers and methods for making the same |
US6506685B2 (en) | 1998-12-28 | 2003-01-14 | Lam Research Corporation | Perforated plasma confinement ring in plasma reactors |
US6224472B1 (en) * | 1999-06-24 | 2001-05-01 | Samsung Austin Semiconductor, L.P. | Retaining ring for chemical mechanical polishing |
US7802539B2 (en) | 2000-06-30 | 2010-09-28 | Lam Research Corporation | Semiconductor processing equipment having improved particle performance |
US6506254B1 (en) | 2000-06-30 | 2003-01-14 | Lam Research Corporation | Semiconductor processing equipment having improved particle performance |
US20030092278A1 (en) | 2001-11-13 | 2003-05-15 | Fink Steven T. | Plasma baffle assembly |
US20040075036A1 (en) * | 2002-10-04 | 2004-04-22 | Ceramic Component Technologies, Inc. | Test plate for ceramic surface mount devices and other electronic components |
USD494551S1 (en) * | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
WO2004059716A1 (en) | 2002-12-20 | 2004-07-15 | Lam Research Corporation | A system and method for controlling plasma with an adjustable coupling to ground circuit |
US7585384B2 (en) | 2003-04-17 | 2009-09-08 | Applied Materials, Inc. | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor |
US7754997B2 (en) | 2003-04-17 | 2010-07-13 | Applied Materials, Inc. | Apparatus and method to confine plasma and reduce flow resistance in a plasma |
US7972467B2 (en) | 2003-04-17 | 2011-07-05 | Applied Materials Inc. | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor |
US7267741B2 (en) | 2003-11-14 | 2007-09-11 | Lam Research Corporation | Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon |
US20080023029A1 (en) | 2003-11-14 | 2008-01-31 | Lam Research Corporation | Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon |
US7552521B2 (en) | 2004-12-08 | 2009-06-30 | Tokyo Electron Limited | Method and apparatus for improved baffle plate |
US20060283551A1 (en) * | 2005-06-17 | 2006-12-21 | Sung-Ku Son | Confinement ring assembly of plasma processing apparatus |
US7837826B2 (en) | 2006-07-18 | 2010-11-23 | Lam Research Corporation | Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof |
US20080110567A1 (en) | 2006-11-15 | 2008-05-15 | Miller Matthew L | Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution |
US8622021B2 (en) | 2007-10-31 | 2014-01-07 | Lam Research Corporation | High lifetime consumable silicon nitride-silicon dioxide plasma processing components |
US20100304571A1 (en) | 2007-12-19 | 2010-12-02 | Larson Dean J | Film adhesive for semiconductor vacuum processing apparatus |
US20090188625A1 (en) | 2008-01-28 | 2009-07-30 | Carducci James D | Etching chamber having flow equalizer and lower liner |
JP2011040461A (en) | 2009-08-07 | 2011-02-24 | Tokyo Electron Ltd | Baffle plate and plasma processing apparatus |
US20110100553A1 (en) | 2009-08-31 | 2011-05-05 | Rajinder Dhindsa | multi-peripheral ring arrangement for performing plasma confinement |
US9779916B2 (en) | 2009-08-31 | 2017-10-03 | Lam Research Corporation | Radio frequency (RF) ground return arrangements |
US8900398B2 (en) | 2009-08-31 | 2014-12-02 | Lam Research Corporation | Local plasma confinement and pressure control arrangement and methods thereof |
US8517803B2 (en) * | 2009-09-16 | 2013-08-27 | SPM Technology, Inc. | Retaining ring for chemical mechanical polishing |
US8298046B2 (en) * | 2009-10-21 | 2012-10-30 | SPM Technology, Inc. | Retaining rings |
US20110226739A1 (en) | 2010-03-19 | 2011-09-22 | Varian Semiconductor Equipment Associates, Inc. | Process chamber liner with apertures for particle containment |
US8485128B2 (en) | 2010-06-30 | 2013-07-16 | Lam Research Corporation | Movable ground ring for a plasma processing chamber |
US8826855B2 (en) | 2010-06-30 | 2014-09-09 | Lam Research Corporation | C-shaped confinement ring for a plasma processing chamber |
US20120273130A1 (en) | 2011-04-28 | 2012-11-01 | Lam Research Corporation | Internal Faraday Shield Having Distributed Chevron Patterns and Correlated Positioning Relative to External Inner and Outer TCP Coil |
USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
USD709537S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709538S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709539S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
US9508530B2 (en) | 2011-11-21 | 2016-11-29 | Lam Research Corporation | Plasma processing chamber with flexible symmetric RF return strap |
US20140113453A1 (en) | 2012-10-24 | 2014-04-24 | Lam Research Corporation | Tungsten carbide coated metal component of a plasma reactor chamber and method of coating |
US20140116338A1 (en) | 2012-10-29 | 2014-05-01 | Advanced Micro-Fabrication Equipment Inc, Shanghai | Coating for performance enhancement of semiconductor apparatus |
US8893702B2 (en) | 2013-02-20 | 2014-11-25 | Lam Research Corporation | Ductile mode machining methods for hard and brittle components of plasma processing apparatuses |
US20160002788A1 (en) * | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
USD793976S1 (en) * | 2013-05-15 | 2017-08-08 | Ebara Corporation | Substrate retaining ring |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
USD729730S1 (en) * | 2013-06-06 | 2015-05-19 | Jon Simon Gillespie-Brown | Power charging ring |
US20160158910A1 (en) * | 2013-07-11 | 2016-06-09 | Will Be S & T Co., Ltd. | Retainer ring for chemical-mechanical polishing device |
US9123661B2 (en) | 2013-08-07 | 2015-09-01 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
US20150364322A1 (en) | 2013-08-07 | 2015-12-17 | Lam Research Corporation | Silicon containing confinement ring for plasma processing apparatus and method of forming thereof |
US9330927B2 (en) | 2013-08-28 | 2016-05-03 | Lam Research Corporation | System, method and apparatus for generating pressure pulses in small volume confined process reactor |
US9184029B2 (en) | 2013-09-03 | 2015-11-10 | Lam Research Corporation | System, method and apparatus for coordinating pressure pulses and RF modulation in a small volume confined process reactor |
US20150329955A1 (en) | 2014-05-16 | 2015-11-19 | Applied Materials, Inc. | Plasma spray coating design using phase and stress control |
USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
CN106898534A (en) | 2015-12-21 | 2017-06-27 | 中微半导体设备(上海)有限公司 | Plasma confinement ring, plasma processing apparatus and processing method for substrate |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
US20180061618A1 (en) | 2016-08-26 | 2018-03-01 | Applied Materials, Inc. | Plasma screen for plasma processing chamber |
US10672629B2 (en) * | 2016-09-28 | 2020-06-02 | Samsung Electronics Co., Ltd. | Ring assembly and chuck assembly having the same |
USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
USD895777S1 (en) * | 2017-09-20 | 2020-09-08 | Gardner Denver Petroleum Pumps Llc | Header ring |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
Non-Patent Citations (2)
Title |
---|
International Search Report for PCT/US2021/021986, dated Jun. 28, 2021. |
Search Report for Taiwan Design Application No. 109305178, dated Mar. 30, 2021. |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1034493S1 (en) * | 2022-11-25 | 2024-07-09 | Ap Systems Inc. | Chamber wall liner for a semiconductor manufacturing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP1692414S (en) | 2021-08-16 |
JP1686347S (en) | 2021-05-31 |
TWD215697S (en) | 2021-12-01 |
TWD215698S (en) | 2021-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD957196S1 (en) | Bottle | |
USD986190S1 (en) | Confinement plate for a substrate processing chamber | |
USD972804S1 (en) | Cart | |
USD1036754S1 (en) | Geometric decorative light | |
USD1039710S1 (en) | Mask | |
USD986888S1 (en) | Keyboard | |
USD965592S1 (en) | Keyboard | |
USD976260S1 (en) | Keyboard | |
USD961592S1 (en) | Keyboard | |
USD960631S1 (en) | Cooking tray | |
USD980953S1 (en) | Faucet | |
USD979524S1 (en) | Confinement liner for a substrate processing chamber | |
USD997772S1 (en) | Jewelry | |
USD1029985S1 (en) | Substrate | |
USD960303S1 (en) | Showerhead | |
USD935498S1 (en) | Cutting insert | |
USD1033676S1 (en) | Pavilion | |
USD967334S1 (en) | Showerhead | |
USD960318S1 (en) | Showerhead | |
USD1002616S1 (en) | Keyboard | |
USD1025064S1 (en) | Keyboard | |
USD1011346S1 (en) | Keyboard | |
USD1015474S1 (en) | Trigger | |
USD1026159S1 (en) | Trigger lock | |
USD1028701S1 (en) | Nut |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |