USD979524S1 - Confinement liner for a substrate processing chamber - Google Patents

Confinement liner for a substrate processing chamber Download PDF

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Publication number
USD979524S1
USD979524S1 US29/728,614 US202029728614F USD979524S US D979524 S1 USD979524 S1 US D979524S1 US 202029728614 F US202029728614 F US 202029728614F US D979524 S USD979524 S US D979524S
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United States
Prior art keywords
processing chamber
substrate processing
confinement
liner
confinement liner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
US29/728,614
Inventor
Joseph Perry
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
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Priority to US29/728,614 priority Critical patent/USD979524S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: PERRY, JOSEPH
Priority to TW109305178D01F priority patent/TWD215698S/en
Priority to TW109305178F priority patent/TWD215697S/en
Priority to JPD2020-20094F priority patent/JP1686347S/ja
Priority to JPD2021-5063F priority patent/JP1692414S/ja
Application granted granted Critical
Publication of USD979524S1 publication Critical patent/USD979524S1/en
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FIG. 1 is a top isometric view of a confinement liner for a substrate processing chamber showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevation view thereof;
FIG. 5 is a rear elevation view thereof;
FIG. 6 is a left side elevation view thereof;
FIG. 7 is a right side elevation view thereof; and,
FIG. 8 is an enlarged cross sectional view taken along line 8-8 of FIG. 2 .
The broken lines shown in the drawings represent portions of a confinement liner for a substrate processing chamber that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a confinement liner for a substrate processing chamber, as shown and described.
US29/728,614 2020-03-19 2020-03-19 Confinement liner for a substrate processing chamber Active USD979524S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/728,614 USD979524S1 (en) 2020-03-19 2020-03-19 Confinement liner for a substrate processing chamber
TW109305178D01F TWD215698S (en) 2020-03-19 2020-09-15 Confinement liner for a substrate processing chamber
TW109305178F TWD215697S (en) 2020-03-19 2020-09-15 Confinement liner for a substrate processing chamber
JPD2020-20094F JP1686347S (en) 2020-03-19 2020-09-19
JPD2021-5063F JP1692414S (en) 2020-03-19 2020-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/728,614 USD979524S1 (en) 2020-03-19 2020-03-19 Confinement liner for a substrate processing chamber

Publications (1)

Publication Number Publication Date
USD979524S1 true USD979524S1 (en) 2023-02-28

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Family Applications (1)

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US29/728,614 Active USD979524S1 (en) 2020-03-19 2020-03-19 Confinement liner for a substrate processing chamber

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US (1) USD979524S1 (en)
JP (2) JP1686347S (en)
TW (2) TWD215698S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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TWD233706S (en) 2023-10-27 2024-09-21 俊龍 吳 Nozzle pad

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USD729730S1 (en) * 2013-06-06 2015-05-19 Jon Simon Gillespie-Brown Power charging ring
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USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US9508530B2 (en) 2011-11-21 2016-11-29 Lam Research Corporation Plasma processing chamber with flexible symmetric RF return strap
CN106898534A (en) 2015-12-21 2017-06-27 中微半导体设备(上海)有限公司 Plasma confinement ring, plasma processing apparatus and processing method for substrate
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
US9779916B2 (en) 2009-08-31 2017-10-03 Lam Research Corporation Radio frequency (RF) ground return arrangements
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
US10672629B2 (en) * 2016-09-28 2020-06-02 Samsung Electronics Co., Ltd. Ring assembly and chuck assembly having the same
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD895777S1 (en) * 2017-09-20 2020-09-08 Gardner Denver Petroleum Pumps Llc Header ring

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156151A (en) 1996-07-19 2000-12-05 Tokyo Electron Limited Plasma processing apparatus
US6464843B1 (en) 1998-03-31 2002-10-15 Lam Research Corporation Contamination controlling method and apparatus for a plasma processing chamber
US6129808A (en) 1998-03-31 2000-10-10 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
US6506685B2 (en) 1998-12-28 2003-01-14 Lam Research Corporation Perforated plasma confinement ring in plasma reactors
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US7802539B2 (en) 2000-06-30 2010-09-28 Lam Research Corporation Semiconductor processing equipment having improved particle performance
US6506254B1 (en) 2000-06-30 2003-01-14 Lam Research Corporation Semiconductor processing equipment having improved particle performance
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US20040075036A1 (en) * 2002-10-04 2004-04-22 Ceramic Component Technologies, Inc. Test plate for ceramic surface mount devices and other electronic components
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
WO2004059716A1 (en) 2002-12-20 2004-07-15 Lam Research Corporation A system and method for controlling plasma with an adjustable coupling to ground circuit
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US7754997B2 (en) 2003-04-17 2010-07-13 Applied Materials, Inc. Apparatus and method to confine plasma and reduce flow resistance in a plasma
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US7267741B2 (en) 2003-11-14 2007-09-11 Lam Research Corporation Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
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US7552521B2 (en) 2004-12-08 2009-06-30 Tokyo Electron Limited Method and apparatus for improved baffle plate
US20060283551A1 (en) * 2005-06-17 2006-12-21 Sung-Ku Son Confinement ring assembly of plasma processing apparatus
US7837826B2 (en) 2006-07-18 2010-11-23 Lam Research Corporation Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof
US20080110567A1 (en) 2006-11-15 2008-05-15 Miller Matthew L Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution
US8622021B2 (en) 2007-10-31 2014-01-07 Lam Research Corporation High lifetime consumable silicon nitride-silicon dioxide plasma processing components
US20100304571A1 (en) 2007-12-19 2010-12-02 Larson Dean J Film adhesive for semiconductor vacuum processing apparatus
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JP2011040461A (en) 2009-08-07 2011-02-24 Tokyo Electron Ltd Baffle plate and plasma processing apparatus
US20110100553A1 (en) 2009-08-31 2011-05-05 Rajinder Dhindsa multi-peripheral ring arrangement for performing plasma confinement
US9779916B2 (en) 2009-08-31 2017-10-03 Lam Research Corporation Radio frequency (RF) ground return arrangements
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USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
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USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
CN106898534A (en) 2015-12-21 2017-06-27 中微半导体设备(上海)有限公司 Plasma confinement ring, plasma processing apparatus and processing method for substrate
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
US10672629B2 (en) * 2016-09-28 2020-06-02 Samsung Electronics Co., Ltd. Ring assembly and chuck assembly having the same
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
USD895777S1 (en) * 2017-09-20 2020-09-08 Gardner Denver Petroleum Pumps Llc Header ring
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber

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International Search Report for PCT/US2021/021986, dated Jun. 28, 2021.
Search Report for Taiwan Design Application No. 109305178, dated Mar. 30, 2021.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JP1692414S (en) 2021-08-16
JP1686347S (en) 2021-05-31
TWD215697S (en) 2021-12-01
TWD215698S (en) 2021-12-01

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