USD709538S1 - Focusing ring - Google Patents

Focusing ring Download PDF

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Publication number
USD709538S1
USD709538S1 US29/417,077 US201229417077F USD709538S US D709538 S1 USD709538 S1 US D709538S1 US 201229417077 F US201229417077 F US 201229417077F US D709538 S USD709538 S US D709538S
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US
United States
Prior art keywords
focusing ring
view
focusing
ring
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/417,077
Inventor
Shunsuke Mizukami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIZUKAMI, SHUNSUKE
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Publication of USD709538S1 publication Critical patent/USD709538S1/en
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Description

FIG. 1 is a front view of a focusing ring of the present invention.
FIG. 2 is a right side view of the focusing ring of FIG. 1.
FIG. 3 is a top plan view of the focusing ring of FIG. 1.
FIG. 4 is a bottom view of the focusing ring of FIG. 1.
FIG. 5 is an enlarged sectional view of the 1-3 intersection of lines 1 and 3 of the focusing ring of FIG. 3.
FIG. 6 is an enlarged sectional view of the 2-3 intersection of lines 2 and 3 of the focusing ring of FIG. 3; and,
FIG. 7 is a perspective view of the focusing ring of FIG. 1.
The rear view is the same as the front view.
The left side view is the same as the right side view.

Claims (1)

    CLAIM
  1. The ornamental design for a focusing ring, as shown and described.
US29/417,077 2011-09-30 2012-03-29 Focusing ring Active USD709538S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2011-022451 2011-09-30
JP2011022451 2011-09-30

Publications (1)

Publication Number Publication Date
USD709538S1 true USD709538S1 (en) 2014-07-22

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US29/417,077 Active USD709538S1 (en) 2011-09-30 2012-03-29 Focusing ring

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US (1) USD709538S1 (en)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD900178S1 (en) * 2019-03-20 2020-10-27 Makerbot Industries, Llc Spool for filament of a three-dimensional printer
USD900176S1 (en) * 2019-03-19 2020-10-27 Makerbot Industries, Llc Spool for filament of a three-dimensional printer
TWD208178S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208175S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208177S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208174S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208176S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Taiwan Office Action, Application D101301750, mailed Oct. 24, 2012.

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD793976S1 (en) 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD802472S1 (en) * 2015-08-06 2017-11-14 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD803802S1 (en) * 2015-08-18 2017-11-28 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
TWD208176S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208175S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208177S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208174S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
TWD208178S (en) 2018-07-25 2020-11-11 日商日本碍子股份有限公司 Wafer retainer for manufacturing semiconductor
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD900176S1 (en) * 2019-03-19 2020-10-27 Makerbot Industries, Llc Spool for filament of a three-dimensional printer
USD900178S1 (en) * 2019-03-20 2020-10-27 Makerbot Industries, Llc Spool for filament of a three-dimensional printer
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life

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