USD933725S1 - Deposition ring for a substrate processing chamber - Google Patents
Deposition ring for a substrate processing chamber Download PDFInfo
- Publication number
- USD933725S1 USD933725S1 US29/679,746 US201929679746F USD933725S US D933725 S1 USD933725 S1 US D933725S1 US 201929679746 F US201929679746 F US 201929679746F US D933725 S USD933725 S US D933725S
- Authority
- US
- United States
- Prior art keywords
- processing chamber
- substrate processing
- deposition ring
- view
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The dashed lines in FIGS. 1-8 represent unclaimed environment forming no part of the claimed design.
Claims (1)
- The ornamental design for a deposition ring for a substrate processing chamber, as shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/679,746 USD933725S1 (en) | 2019-02-08 | 2019-02-08 | Deposition ring for a substrate processing chamber |
TW108304729F TWD210892S (en) | 2019-02-08 | 2019-08-08 | Deposition ring for a substrate processing chamber |
TW108304729D01F TWD210893S (en) | 2019-02-08 | 2019-08-08 | Deposition ring for a substrate processing chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/679,746 USD933725S1 (en) | 2019-02-08 | 2019-02-08 | Deposition ring for a substrate processing chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
USD933725S1 true USD933725S1 (en) | 2021-10-19 |
Family
ID=78069699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/679,746 Active USD933725S1 (en) | 2019-02-08 | 2019-02-08 | Deposition ring for a substrate processing chamber |
Country Status (2)
Country | Link |
---|---|
US (1) | USD933725S1 (en) |
TW (2) | TWD210892S (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD954986S1 (en) * | 2019-10-18 | 2022-06-14 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing device |
USD966357S1 (en) * | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD970566S1 (en) * | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD973609S1 (en) * | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
USD983297S1 (en) * | 2021-02-03 | 2023-04-11 | Bradley R. Mason | Ring-shaped golf alignment stick stand |
USD983915S1 (en) * | 2021-02-03 | 2023-04-18 | Bradley R. Mason | Flattened ring-shaped golf alignment stick stand |
USD984571S1 (en) * | 2021-02-03 | 2023-04-25 | Bradley R. Mason | Disc-shaped golf alignment stick stand |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD992615S1 (en) * | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Citations (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5320728A (en) | 1990-03-30 | 1994-06-14 | Applied Materials, Inc. | Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity |
USD351450S (en) | 1993-05-19 | 1994-10-11 | Riteflite Pty. Limited | Target for shooting |
USD376744S (en) | 1994-08-03 | 1996-12-24 | Gerd Eisenblatter Gmbh | Support plate |
USD381030S (en) * | 1995-11-21 | 1997-07-15 | Avi Tepman | Sputtering target |
USD401252S (en) * | 1998-01-27 | 1998-11-17 | Semiconductor Equipment Technology | Shield and cover for target of sputter coating apparatus |
USD403002S (en) * | 1998-01-27 | 1998-12-22 | Semiconductor Equipment Technology, Inc. | Shield and cover for target of sputter coating apparatus |
USD403334S (en) * | 1998-01-27 | 1998-12-29 | Semiconductor Equipment Technology, Inc | Shield and cover for target of sputter coating apparatus |
USD403337S (en) * | 1997-08-05 | 1998-12-29 | Applied Materials, Inc. | High conductance low wall deposition upper shield |
USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD559066S1 (en) | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
USD559994S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
US20080308416A1 (en) * | 2007-06-18 | 2008-12-18 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
US20100108500A1 (en) * | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Encapsulated sputtering target |
USD616389S1 (en) | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US20110209985A1 (en) * | 2010-02-26 | 2011-09-01 | Youming Li | Physical Vapor Deposition With Heat Diffuser |
USD649986S1 (en) * | 2010-08-17 | 2011-12-06 | Ebara Corporation | Sealing ring |
USD665491S1 (en) * | 2012-01-25 | 2012-08-14 | Applied Materials, Inc. | Deposition chamber cover ring |
US20120263569A1 (en) * | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
US8371904B2 (en) | 2008-08-08 | 2013-02-12 | Globalfoundries Singapore Pte. Ltd. | Polishing with enhanced uniformity |
USD678745S1 (en) | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
USD694340S1 (en) * | 2012-01-31 | 2013-11-26 | Laporte Holding | Target |
USD694790S1 (en) * | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD703162S1 (en) | 2012-10-17 | 2014-04-22 | Sumitomo Electric Industries, Ltd. | Wafer holder for stepper |
USD705280S1 (en) * | 2013-07-11 | 2014-05-20 | Ebara Corporation | Sealing ring |
TWD161030S (en) | 2013-08-12 | 2014-06-11 | 陳世發 | Substrate retaining ring |
USD709538S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
TWD166552S (en) | 2013-01-25 | 2015-03-11 | 日立國際電氣股份有限公司 | Vaporizer for substrate processing equipment |
TWD167109S (en) | 2013-05-15 | 2015-04-11 | 荏原製作所股份有限公司 | Substrate retaining ring |
USD738451S1 (en) * | 2014-11-11 | 2015-09-08 | Mary Olson | Golf ball target for chipping and putting |
USD741921S1 (en) | 2014-04-15 | 2015-10-27 | Q-Linea Ab | Positive mold for manufacturing a sample holding disc |
USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
US20150357169A1 (en) * | 2013-01-04 | 2015-12-10 | Tosoh Smd, Inc. | Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same |
US20160002788A1 (en) * | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
JP1549498S (en) | 2015-07-15 | 2016-05-16 | ||
US20160189938A1 (en) | 2014-12-31 | 2016-06-30 | Applied Materials, Inc. | One-piece process kit shield |
USD767234S1 (en) * | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
US9475996B2 (en) | 2012-10-17 | 2016-10-25 | Richard Max Mandle | Centrifugal fluid ring plasma reactor |
USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
US20170009367A1 (en) * | 2015-07-09 | 2017-01-12 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
JP1570910S (en) | 2015-10-14 | 2017-03-06 | ||
JP1575876S (en) | 2016-04-14 | 2017-05-08 | ||
USD795208S1 (en) | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
JP1584875S (en) | 2015-11-19 | 2017-08-28 | ||
JP1584906S (en) | 2017-01-31 | 2017-08-28 | ||
USD796458S1 (en) * | 2016-01-08 | 2017-09-05 | Asm Ip Holding B.V. | Gas flow control plate for semiconductor manufacturing apparatus |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
TWD186431S (en) | 2017-04-03 | 2017-11-01 | ASM知識產權私人控股有	 | Exhaust flow control ring for semiconductor substrate deposition apparatus |
USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
TWD187432S (en) | 2016-09-14 | 2017-12-21 | 日本華爾卡工業股份有限公 | Composite sealing material |
US20180025895A1 (en) | 2016-07-20 | 2018-01-25 | Applied Materials, Inc. | Physical vapor deposition (pvd) plasma energy control per dynamic magnetron control |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD819580S1 (en) * | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD851613S1 (en) * | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US20200090915A1 (en) * | 2017-06-01 | 2020-03-19 | Oerlikon Surface Solutions Ag, Pfäffikon | Target assembly for safe and economic evaporation of brittle materials |
USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD913979S1 (en) | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
USD913980S1 (en) | 2018-02-01 | 2021-03-23 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
-
2019
- 2019-02-08 US US29/679,746 patent/USD933725S1/en active Active
- 2019-08-08 TW TW108304729F patent/TWD210892S/en unknown
- 2019-08-08 TW TW108304729D01F patent/TWD210893S/en unknown
Patent Citations (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5320728A (en) | 1990-03-30 | 1994-06-14 | Applied Materials, Inc. | Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity |
USD351450S (en) | 1993-05-19 | 1994-10-11 | Riteflite Pty. Limited | Target for shooting |
USD376744S (en) | 1994-08-03 | 1996-12-24 | Gerd Eisenblatter Gmbh | Support plate |
USD381030S (en) * | 1995-11-21 | 1997-07-15 | Avi Tepman | Sputtering target |
USD403337S (en) * | 1997-08-05 | 1998-12-29 | Applied Materials, Inc. | High conductance low wall deposition upper shield |
USD401252S (en) * | 1998-01-27 | 1998-11-17 | Semiconductor Equipment Technology | Shield and cover for target of sputter coating apparatus |
USD403002S (en) * | 1998-01-27 | 1998-12-22 | Semiconductor Equipment Technology, Inc. | Shield and cover for target of sputter coating apparatus |
USD403334S (en) * | 1998-01-27 | 1998-12-29 | Semiconductor Equipment Technology, Inc | Shield and cover for target of sputter coating apparatus |
USD491963S1 (en) * | 2002-11-20 | 2004-06-22 | Tokyo Electron Limited | Inner wall shield for a process chamber for manufacturing semiconductors |
USD600989S1 (en) | 2004-10-26 | 2009-09-29 | Jsr Corporation | Polishing pad |
USD584591S1 (en) | 2004-10-26 | 2009-01-13 | Jsr Corporation | Polishing pad |
USD592030S1 (en) | 2004-10-26 | 2009-05-12 | Jsr Corporation | Polishing pad |
USD592029S1 (en) | 2004-10-26 | 2009-05-12 | Jsr Corporation | Polishing pad |
USD559066S1 (en) | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
USD559994S1 (en) * | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
US7981262B2 (en) | 2007-01-29 | 2011-07-19 | Applied Materials, Inc. | Process kit for substrate processing chamber |
US20080308416A1 (en) * | 2007-06-18 | 2008-12-18 | Applied Materials, Inc. | Sputtering target having increased life and sputtering uniformity |
US8371904B2 (en) | 2008-08-08 | 2013-02-12 | Globalfoundries Singapore Pte. Ltd. | Polishing with enhanced uniformity |
USD616389S1 (en) | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
US20100108500A1 (en) * | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Encapsulated sputtering target |
US20110209985A1 (en) * | 2010-02-26 | 2011-09-01 | Youming Li | Physical Vapor Deposition With Heat Diffuser |
USD649986S1 (en) * | 2010-08-17 | 2011-12-06 | Ebara Corporation | Sealing ring |
USD659175S1 (en) * | 2010-08-17 | 2012-05-08 | Ebara Corporation | Sealing ring |
US20120263569A1 (en) * | 2011-04-14 | 2012-10-18 | Scott Wayne Priddy | Substrate holders and methods of substrate mounting |
USD678745S1 (en) | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
USD694790S1 (en) * | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
USD709538S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD665491S1 (en) * | 2012-01-25 | 2012-08-14 | Applied Materials, Inc. | Deposition chamber cover ring |
USD694340S1 (en) * | 2012-01-31 | 2013-11-26 | Laporte Holding | Target |
USD703162S1 (en) | 2012-10-17 | 2014-04-22 | Sumitomo Electric Industries, Ltd. | Wafer holder for stepper |
US9475996B2 (en) | 2012-10-17 | 2016-10-25 | Richard Max Mandle | Centrifugal fluid ring plasma reactor |
US20150357169A1 (en) * | 2013-01-04 | 2015-12-10 | Tosoh Smd, Inc. | Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same |
TWD166552S (en) | 2013-01-25 | 2015-03-11 | 日立國際電氣股份有限公司 | Vaporizer for substrate processing equipment |
US20160002788A1 (en) * | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
TWD167109S (en) | 2013-05-15 | 2015-04-11 | 荏原製作所股份有限公司 | Substrate retaining ring |
USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
USD705280S1 (en) * | 2013-07-11 | 2014-05-20 | Ebara Corporation | Sealing ring |
TWD161030S (en) | 2013-08-12 | 2014-06-11 | 陳世發 | Substrate retaining ring |
USD741921S1 (en) | 2014-04-15 | 2015-10-27 | Q-Linea Ab | Positive mold for manufacturing a sample holding disc |
USD738451S1 (en) * | 2014-11-11 | 2015-09-08 | Mary Olson | Golf ball target for chipping and putting |
US20160189938A1 (en) | 2014-12-31 | 2016-06-30 | Applied Materials, Inc. | One-piece process kit shield |
USD767234S1 (en) * | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD837755S1 (en) * | 2015-04-16 | 2019-01-08 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD825504S1 (en) * | 2015-04-21 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US20170009367A1 (en) * | 2015-07-09 | 2017-01-12 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
JP1549498S (en) | 2015-07-15 | 2016-05-16 | ||
USD795208S1 (en) | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
JP1570910S (en) | 2015-10-14 | 2017-03-06 | ||
JP1584875S (en) | 2015-11-19 | 2017-08-28 | ||
USD796458S1 (en) * | 2016-01-08 | 2017-09-05 | Asm Ip Holding B.V. | Gas flow control plate for semiconductor manufacturing apparatus |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD819580S1 (en) * | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
JP1575876S (en) | 2016-04-14 | 2017-05-08 | ||
US20180025895A1 (en) | 2016-07-20 | 2018-01-25 | Applied Materials, Inc. | Physical vapor deposition (pvd) plasma energy control per dynamic magnetron control |
TWD187432S (en) | 2016-09-14 | 2017-12-21 | 日本華爾卡工業股份有限公 | Composite sealing material |
USD869409S1 (en) * | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
JP1584906S (en) | 2017-01-31 | 2017-08-28 | ||
TWD186431S (en) | 2017-04-03 | 2017-11-01 | ASM知識產權私人控股有	 | Exhaust flow control ring for semiconductor substrate deposition apparatus |
USD876504S1 (en) * | 2017-04-03 | 2020-02-25 | Asm Ip Holding B.V. | Exhaust flow control ring for semiconductor deposition apparatus |
US20200090915A1 (en) * | 2017-06-01 | 2020-03-19 | Oerlikon Surface Solutions Ag, Pfäffikon | Target assembly for safe and economic evaporation of brittle materials |
USD851613S1 (en) * | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD894137S1 (en) * | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD913980S1 (en) | 2018-02-01 | 2021-03-23 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD902165S1 (en) * | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD913979S1 (en) | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
Non-Patent Citations (2)
Title |
---|
Search Report for Taiwan Design Application No. 1068304729, dated Aug. 5, 2020. |
Search Report for Taiwan Design Application No. 108304735001, dated Dec. 2, 2020. |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD992615S1 (en) * | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
USD954986S1 (en) * | 2019-10-18 | 2022-06-14 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing device |
USD970566S1 (en) * | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD973609S1 (en) * | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD1021832S1 (en) | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
USD966357S1 (en) * | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD983297S1 (en) * | 2021-02-03 | 2023-04-11 | Bradley R. Mason | Ring-shaped golf alignment stick stand |
USD983915S1 (en) * | 2021-02-03 | 2023-04-18 | Bradley R. Mason | Flattened ring-shaped golf alignment stick stand |
USD984571S1 (en) * | 2021-02-03 | 2023-04-25 | Bradley R. Mason | Disc-shaped golf alignment stick stand |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Also Published As
Publication number | Publication date |
---|---|
TWD210893S (en) | 2021-04-11 |
TWD210892S (en) | 2021-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD933725S1 (en) | Deposition ring for a substrate processing chamber | |
USD891382S1 (en) | Process shield for a substrate processing chamber | |
USD913979S1 (en) | Inner shield for a substrate processing chamber | |
USD888903S1 (en) | Deposition ring for physical vapor deposition chamber | |
USD934315S1 (en) | Deposition ring for a substrate processing chamber | |
USD933726S1 (en) | Deposition ring for a semiconductor processing chamber | |
USD893441S1 (en) | Base plate for a processing chamber substrate support | |
USD830981S1 (en) | Susceptor for semiconductor substrate processing apparatus | |
USD973599S1 (en) | Contact wafer | |
USD914620S1 (en) | Vented susceptor | |
USD902165S1 (en) | Target profile for a physical vapor deposition chamber target | |
USD918978S1 (en) | Selecting robot (first generation) | |
USD904347S1 (en) | Earphone | |
USD978691S1 (en) | Biomonitoring wristband | |
USD970566S1 (en) | Sputter target for a physical vapor deposition chamber | |
USD790039S1 (en) | Showerhead for a semiconductor processing chamber | |
USD941371S1 (en) | Process shield for a substrate processing chamber | |
USD941372S1 (en) | Process shield for a substrate processing chamber | |
USD885140S1 (en) | Vacuum insulated bowl | |
USD948057S1 (en) | Haptic wristband | |
USD917590S1 (en) | Intelligent transporting robot (second generation) | |
USD986190S1 (en) | Confinement plate for a substrate processing chamber | |
USD905145S1 (en) | Robot | |
USD946840S1 (en) | Robot vacuum cleaner | |
USD931240S1 (en) | Substrate support pedestal |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |