USD836572S1 - Target profile for a physical vapor deposition chamber target - Google Patents

Target profile for a physical vapor deposition chamber target Download PDF

Info

Publication number
USD836572S1
USD836572S1 US29/579,470 US201629579470F USD836572S US D836572 S1 USD836572 S1 US D836572S1 US 201629579470 F US201629579470 F US 201629579470F US D836572 S USD836572 S US D836572S
Authority
US
United States
Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
profile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/579,470
Inventor
Martin Lee Riker
Fuhong Zhang
Xiaodong Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/579,470 priority Critical patent/USD836572S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RIKER, MARTIN LEE, WANG, XIAODONG, ZHANG, FUHONG
Priority to TW106301373F priority patent/TWD188898S/en
Priority to TW106301373D01F priority patent/TWD191626S/en
Priority to JPD2017-6430F priority patent/JP1596742S/ja
Priority to JPD2017-19120F priority patent/JP1599074S/ja
Priority to US29/671,900 priority patent/USD869409S1/en
Application granted granted Critical
Publication of USD836572S1 publication Critical patent/USD836572S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of a target profile for a physical vapor deposition chamber target, showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a front elevation view thereof;
FIG. 7 is a back elevation view thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2.
The dashed lines in FIGS. 1-8 represent disclaimed matter that forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a target profile for a physical vapor deposition chamber target, as shown and described.
US29/579,470 2016-09-30 2016-09-30 Target profile for a physical vapor deposition chamber target Active USD836572S1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US29/579,470 USD836572S1 (en) 2016-09-30 2016-09-30 Target profile for a physical vapor deposition chamber target
TW106301373F TWD188898S (en) 2016-09-30 2017-03-17 Target profile for a physical vapor deposition chamber target
TW106301373D01F TWD191626S (en) 2016-09-30 2017-03-17 Target profile for a physical vapor deposition chamber target
JPD2017-6430F JP1596742S (en) 2016-09-30 2017-03-29
JPD2017-19120F JP1599074S (en) 2016-09-30 2017-03-29
US29/671,900 USD869409S1 (en) 2016-09-30 2018-11-30 Target profile for a physical vapor deposition chamber target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/579,470 USD836572S1 (en) 2016-09-30 2016-09-30 Target profile for a physical vapor deposition chamber target

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/671,900 Division USD869409S1 (en) 2016-09-30 2018-11-30 Target profile for a physical vapor deposition chamber target

Publications (1)

Publication Number Publication Date
USD836572S1 true USD836572S1 (en) 2018-12-25

Family

ID=61066246

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/579,470 Active USD836572S1 (en) 2016-09-30 2016-09-30 Target profile for a physical vapor deposition chamber target
US29/671,900 Active USD869409S1 (en) 2016-09-30 2018-11-30 Target profile for a physical vapor deposition chamber target

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/671,900 Active USD869409S1 (en) 2016-09-30 2018-11-30 Target profile for a physical vapor deposition chamber target

Country Status (3)

Country Link
US (2) USD836572S1 (en)
JP (2) JP1596742S (en)
TW (2) TWD191626S (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD851144S1 (en) * 2017-12-04 2019-06-11 Liqua-Tech Corporation Register gear adapter plate
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851693S1 (en) * 2017-12-04 2019-06-18 Liqua-Tech Corporation Register gear adapter plate
USD862539S1 (en) * 2017-12-04 2019-10-08 Liqua-Tech Corporation Register gear adapter plate
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
JP1655453S (en) * 2019-06-17 2020-03-23
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
JP1700776S (en) * 2021-03-04 2021-11-29

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20050152089A1 (en) * 2003-12-26 2005-07-14 Ngk Insulators, Ltd. Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
US20050193952A1 (en) * 2004-02-13 2005-09-08 Goodman Matt G. Substrate support system for reduced autodoping and backside deposition
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD691974S1 (en) * 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD795208S1 (en) 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD351450S (en) 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
US6114216A (en) 1996-11-13 2000-09-05 Applied Materials, Inc. Methods for shallow trench isolation
US6086725A (en) 1998-04-02 2000-07-11 Applied Materials, Inc. Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life
JP3551867B2 (en) * 1999-11-09 2004-08-11 信越化学工業株式会社 Silicon focus ring and manufacturing method thereof
USD487254S1 (en) 2002-05-24 2004-03-02 Nichia Corporation Light emitting diode
CA2508523A1 (en) 2002-12-16 2004-07-01 Ifire Technology Corp. Composite sputter target and phosphor deposition method
USD503729S1 (en) 2003-10-31 2005-04-05 Nordson Corporation Nozzle for dispensing adhesives and sealants
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
US20070076345A1 (en) 2005-09-20 2007-04-05 Bang Won B Substrate placement determination using substrate backside pressure measurement
US7402098B2 (en) * 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US8968536B2 (en) 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
USD600660S1 (en) 2008-03-28 2009-09-22 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
KR101571558B1 (en) 2008-04-16 2015-11-24 어플라이드 머티어리얼스, 인코포레이티드 Wafer processing deposition shielding components
US8070925B2 (en) 2008-10-17 2011-12-06 Applied Materials, Inc. Physical vapor deposition reactor with circularly symmetric RF feed and DC feed to the sputter target
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8133368B2 (en) 2008-10-31 2012-03-13 Applied Materials, Inc. Encapsulated sputtering target
TWI397600B (en) 2009-01-07 2013-06-01 Solar Applied Mat Tech Corp Recycled sputtering target and its making method
WO2012019017A2 (en) 2010-08-06 2012-02-09 Applied Materials, Inc. Electrostatic chuck and methods of use thereof
USD669509S1 (en) 2011-10-19 2012-10-23 Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts Nozzle for torch
USD683806S1 (en) 2012-01-12 2013-06-04 Surefire, Llc Front plate for a firearm sound suppressor
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
KR20130131120A (en) * 2012-05-23 2013-12-03 삼성전자주식회사 A flexible membrane for polishing head
USD732094S1 (en) 2012-07-20 2015-06-16 Ivoclar Vivadent Ag Firing plate for a dental furnace
FR3002241B1 (en) 2013-02-21 2015-11-20 Altatech Semiconductor CHEMICAL VAPOR DEPOSITION DEVICE
FR3002242B1 (en) 2013-02-21 2015-04-03 Altatech Semiconductor CHEMICAL VAPOR DEPOSITION DEVICE
US9534286B2 (en) 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US9960021B2 (en) 2013-12-18 2018-05-01 Applied Materials, Inc. Physical vapor deposition (PVD) target having low friction pads
US9991101B2 (en) 2014-07-29 2018-06-05 Applied Materials, Inc. Magnetron assembly for physical vapor deposition chamber
USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
JP1545222S (en) 2015-06-10 2016-03-07
USD830434S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
TWD178699S (en) 2016-01-08 2016-10-01 ＡＳＭ知識產權私人控股有&#x9 Gas dispersing plate for semiconductor manufacturing apparatus
TWD178424S (en) 2016-01-08 2016-09-21 ＡＳＭ知識產權私人控股有&#x9 Gas flow control plate for semiconductor manufacturing apparatus
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20050152089A1 (en) * 2003-12-26 2005-07-14 Ngk Insulators, Ltd. Electrostatic chuck and manufacturing method for the same, and alumina sintered member and manufacturing method for the same
US20050193952A1 (en) * 2004-02-13 2005-09-08 Goodman Matt G. Substrate support system for reduced autodoping and backside deposition
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD691974S1 (en) * 2011-12-22 2013-10-22 Tokyo Electron Limited Holding pad for transferring a wafer
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD795208S1 (en) 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Search Report for Taiwan Design Application No. 106301373 dated Jun. 20, 2017.
U.S. Appl. No. 29/524,109, filed Apr. 16, 2015, Riker et al.
U.S. Appl. No. 29/524,557, filed Apr. 21, 2015, Zhang et al.
U.S. Appl. No. 29/530,683, filed Jun. 18, 2015, Hanson et al.

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851693S1 (en) * 2017-12-04 2019-06-18 Liqua-Tech Corporation Register gear adapter plate
USD862539S1 (en) * 2017-12-04 2019-10-08 Liqua-Tech Corporation Register gear adapter plate
USD851144S1 (en) * 2017-12-04 2019-06-11 Liqua-Tech Corporation Register gear adapter plate
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947802S1 (en) * 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Also Published As

Publication number Publication date
USD869409S1 (en) 2019-12-10
TWD188898S (en) 2018-03-01
TWD191626S (en) 2018-07-11
JP1599074S (en) 2018-03-05
JP1596742S (en) 2018-02-05

Similar Documents

Publication Publication Date Title
USD825504S1 (en) Target profile for a physical vapor deposition chamber target
USD825505S1 (en) Target profile for a physical vapor deposition chamber target
USD869409S1 (en) Target profile for a physical vapor deposition chamber target
USD837755S1 (en) Target profile for a physical vapor deposition chamber target
USD894137S1 (en) Target profile for a physical vapor deposition chamber target
USD868124S1 (en) Target profile for a physical vapor deposition chamber target
USD877101S1 (en) Target profile for a physical vapor deposition chamber target
USD888903S1 (en) Deposition ring for physical vapor deposition chamber
USD913826S1 (en) Spectrometer
USD812870S1 (en) Footwear
USD806512S1 (en) Knob
USD770798S1 (en) Soap pump
USD801468S1 (en) Firearm sight
USD757903S1 (en) Faucet
USD808243S1 (en) Knob
USD834850S1 (en) Chair
USD779259S1 (en) Kettle
USD767102S1 (en) Faucet
USD771776S1 (en) Faucet
USD871678S1 (en) Shin guard plate
USD816804S1 (en) Faucet
USD767098S1 (en) Faucet
USD829870S1 (en) Toilet pan
USD848568S1 (en) Vapor distributor
USD779099S1 (en) Luminaire