USD813181S1 - Cover of seal cap for reaction chamber of semiconductor - Google Patents

Cover of seal cap for reaction chamber of semiconductor Download PDF

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Publication number
USD813181S1
USD813181S1 US29/591,907 US201729591907F USD813181S US D813181 S1 USD813181 S1 US D813181S1 US 201729591907 F US201729591907 F US 201729591907F US D813181 S USD813181 S US D813181S
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United States
Prior art keywords
cover
semiconductor
reaction chamber
seal cap
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/591,907
Inventor
Yusaku OKAJIMA
Shuhei SAIDO
Mika URUSHIHARA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: URUSHIHARA, Mika, OKAJIMA, YUSAKU, SAIDO, SHUHEI
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Publication of USD813181S1 publication Critical patent/USD813181S1/en
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
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Description

FIG. 1 is a front, top and right side perspective view of a cover of seal cap for reaction chamber of semiconductor showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a left side elevational view; and,
FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 4.

Claims (1)

    CLAIM
  1. The ornamental design for a cover of seal cap for reaction chamber of semiconductor, as shown and described.
US29/591,907 2016-07-26 2017-01-25 Cover of seal cap for reaction chamber of semiconductor Active USD813181S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP015868/2016 2016-07-26
JP2016015868 2016-07-26

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USD813181S1 true USD813181S1 (en) 2018-03-20

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US29/591,907 Active USD813181S1 (en) 2016-07-26 2017-01-25 Cover of seal cap for reaction chamber of semiconductor

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Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840981S1 (en) * 2017-10-20 2019-02-19 Avery Dennison Retail Information Services, Llc RFID inlay
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD855027S1 (en) 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD916037S1 (en) * 2018-05-18 2021-04-13 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor
USD931240S1 (en) * 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
US6251189B1 (en) * 1999-02-18 2001-06-26 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
USD602886S1 (en) * 2008-10-08 2009-10-27 Atheros Communications, Inc. Shield design
US20110018160A1 (en) * 2009-07-24 2011-01-27 Ziberna Frank J Method of Producing Covers for Electronics
USD642547S1 (en) * 2010-05-26 2011-08-02 Beat Untersee Cover plate for electrical devices
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
US20160157359A1 (en) * 2014-11-07 2016-06-02 International Business Machines Corporation Customized module lid
US20170170030A1 (en) * 2015-12-09 2017-06-15 International Business Machines Corporation Lid attach optimization to limit electronic package warpage
US20170221790A1 (en) * 2016-01-28 2017-08-03 Kyocera International, Inc. Semiconductor packaging structure and package having stress release structure
US20170229360A1 (en) * 2014-05-21 2017-08-10 Materion Corporation Ceramic combo lid with selective and edge metallizations
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
US6251189B1 (en) * 1999-02-18 2001-06-26 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
USD602886S1 (en) * 2008-10-08 2009-10-27 Atheros Communications, Inc. Shield design
US20110018160A1 (en) * 2009-07-24 2011-01-27 Ziberna Frank J Method of Producing Covers for Electronics
USD642547S1 (en) * 2010-05-26 2011-08-02 Beat Untersee Cover plate for electrical devices
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
US20170229360A1 (en) * 2014-05-21 2017-08-10 Materion Corporation Ceramic combo lid with selective and edge metallizations
US20160157359A1 (en) * 2014-11-07 2016-06-02 International Business Machines Corporation Customized module lid
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20170170030A1 (en) * 2015-12-09 2017-06-15 International Business Machines Corporation Lid attach optimization to limit electronic package warpage
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
US20170221790A1 (en) * 2016-01-28 2017-08-03 Kyocera International, Inc. Semiconductor packaging structure and package having stress release structure

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD869409S1 (en) * 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD840981S1 (en) * 2017-10-20 2019-02-19 Avery Dennison Retail Information Services, Llc RFID inlay
USD860146S1 (en) 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD855027S1 (en) 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD916037S1 (en) * 2018-05-18 2021-04-13 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933031S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933032S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD931240S1 (en) * 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus

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