USD813181S1 - Cover of seal cap for reaction chamber of semiconductor - Google Patents
Cover of seal cap for reaction chamber of semiconductor Download PDFInfo
- Publication number
- USD813181S1 USD813181S1 US29/591,907 US201729591907F USD813181S US D813181 S1 USD813181 S1 US D813181S1 US 201729591907 F US201729591907 F US 201729591907F US D813181 S USD813181 S US D813181S
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- US
- United States
- Prior art keywords
- cover
- semiconductor
- reaction chamber
- seal cap
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (1)
- The ornamental design for a cover of seal cap for reaction chamber of semiconductor, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP015868/2016 | 2016-07-26 | ||
JP2016015868 | 2016-07-26 |
Publications (1)
Publication Number | Publication Date |
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USD813181S1 true USD813181S1 (en) | 2018-03-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/591,907 Active USD813181S1 (en) | 2016-07-26 | 2017-01-25 | Cover of seal cap for reaction chamber of semiconductor |
Country Status (1)
Country | Link |
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US (1) | USD813181S1 (en) |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD840981S1 (en) * | 2017-10-20 | 2019-02-19 | Avery Dennison Retail Information Services, Llc | RFID inlay |
USD854506S1 (en) * | 2018-03-26 | 2019-07-23 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD855027S1 (en) | 2018-01-22 | 2019-07-30 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber of semiconductor |
USD858469S1 (en) * | 2018-03-26 | 2019-09-03 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD860147S1 (en) * | 2018-03-26 | 2019-09-17 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD860146S1 (en) | 2017-11-30 | 2019-09-17 | Veeco Instruments Inc. | Wafer carrier with a 33-pocket configuration |
USD863239S1 (en) * | 2018-03-26 | 2019-10-15 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD866491S1 (en) * | 2018-03-26 | 2019-11-12 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD869409S1 (en) * | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD872037S1 (en) * | 2017-08-09 | 2020-01-07 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber for semiconductor manufacturing |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD909322S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD909323S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD916037S1 (en) * | 2018-05-18 | 2021-04-13 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber for semiconductor |
USD931240S1 (en) * | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5789810A (en) * | 1995-12-21 | 1998-08-04 | International Business Machines Corporation | Semiconductor cap |
US6251189B1 (en) * | 1999-02-18 | 2001-06-26 | Kokusai Electric Co., Ltd. | Substrate processing apparatus and substrate processing method |
USD602886S1 (en) * | 2008-10-08 | 2009-10-27 | Atheros Communications, Inc. | Shield design |
US20110018160A1 (en) * | 2009-07-24 | 2011-01-27 | Ziberna Frank J | Method of Producing Covers for Electronics |
USD642547S1 (en) * | 2010-05-26 | 2011-08-02 | Beat Untersee | Cover plate for electrical devices |
USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
USD742339S1 (en) * | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD748594S1 (en) * | 2014-03-12 | 2016-02-02 | Hitachi Kokusai Electric Inc. | Reaction tube |
US20160157359A1 (en) * | 2014-11-07 | 2016-06-02 | International Business Machines Corporation | Customized module lid |
US20170170030A1 (en) * | 2015-12-09 | 2017-06-15 | International Business Machines Corporation | Lid attach optimization to limit electronic package warpage |
US20170221790A1 (en) * | 2016-01-28 | 2017-08-03 | Kyocera International, Inc. | Semiconductor packaging structure and package having stress release structure |
US20170229360A1 (en) * | 2014-05-21 | 2017-08-10 | Materion Corporation | Ceramic combo lid with selective and edge metallizations |
USD796458S1 (en) * | 2016-01-08 | 2017-09-05 | Asm Ip Holding B.V. | Gas flow control plate for semiconductor manufacturing apparatus |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
-
2017
- 2017-01-25 US US29/591,907 patent/USD813181S1/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5789810A (en) * | 1995-12-21 | 1998-08-04 | International Business Machines Corporation | Semiconductor cap |
US6251189B1 (en) * | 1999-02-18 | 2001-06-26 | Kokusai Electric Co., Ltd. | Substrate processing apparatus and substrate processing method |
USD602886S1 (en) * | 2008-10-08 | 2009-10-27 | Atheros Communications, Inc. | Shield design |
US20110018160A1 (en) * | 2009-07-24 | 2011-01-27 | Ziberna Frank J | Method of Producing Covers for Electronics |
USD642547S1 (en) * | 2010-05-26 | 2011-08-02 | Beat Untersee | Cover plate for electrical devices |
USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
USD742339S1 (en) * | 2014-03-12 | 2015-11-03 | Hitachi Kokusai Electric Inc. | Reaction tube |
USD748594S1 (en) * | 2014-03-12 | 2016-02-02 | Hitachi Kokusai Electric Inc. | Reaction tube |
US20170229360A1 (en) * | 2014-05-21 | 2017-08-10 | Materion Corporation | Ceramic combo lid with selective and edge metallizations |
US20160157359A1 (en) * | 2014-11-07 | 2016-06-02 | International Business Machines Corporation | Customized module lid |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US20170170030A1 (en) * | 2015-12-09 | 2017-06-15 | International Business Machines Corporation | Lid attach optimization to limit electronic package warpage |
USD796458S1 (en) * | 2016-01-08 | 2017-09-05 | Asm Ip Holding B.V. | Gas flow control plate for semiconductor manufacturing apparatus |
US20170221790A1 (en) * | 2016-01-28 | 2017-08-03 | Kyocera International, Inc. | Semiconductor packaging structure and package having stress release structure |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD869409S1 (en) * | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD840364S1 (en) * | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD872037S1 (en) * | 2017-08-09 | 2020-01-07 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber for semiconductor manufacturing |
USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD840981S1 (en) * | 2017-10-20 | 2019-02-19 | Avery Dennison Retail Information Services, Llc | RFID inlay |
USD860146S1 (en) | 2017-11-30 | 2019-09-17 | Veeco Instruments Inc. | Wafer carrier with a 33-pocket configuration |
USD946638S1 (en) * | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD855027S1 (en) | 2018-01-22 | 2019-07-30 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber of semiconductor |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD863239S1 (en) * | 2018-03-26 | 2019-10-15 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD866491S1 (en) * | 2018-03-26 | 2019-11-12 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD854506S1 (en) * | 2018-03-26 | 2019-07-23 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD860147S1 (en) * | 2018-03-26 | 2019-09-17 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD858469S1 (en) * | 2018-03-26 | 2019-09-03 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD916037S1 (en) * | 2018-05-18 | 2021-04-13 | Kokusai Electric Corporation | Cover of seal cap for reaction chamber for semiconductor |
USD909322S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD933619S1 (en) | 2018-10-12 | 2021-10-19 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
USD909323S1 (en) * | 2018-10-12 | 2021-02-02 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD933031S1 (en) | 2018-10-12 | 2021-10-12 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
USD933033S1 (en) | 2018-10-12 | 2021-10-12 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
USD933032S1 (en) | 2018-10-12 | 2021-10-12 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD931240S1 (en) * | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD970566S1 (en) * | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD966357S1 (en) * | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
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