USD916037S1 - Cover of seal cap for reaction chamber for semiconductor - Google Patents

Cover of seal cap for reaction chamber for semiconductor Download PDF

Info

Publication number
USD916037S1
USD916037S1 US29/670,537 US201829670537F USD916037S US D916037 S1 USD916037 S1 US D916037S1 US 201829670537 F US201829670537 F US 201829670537F US D916037 S USD916037 S US D916037S
Authority
US
United States
Prior art keywords
cover
semiconductor
reaction chamber
seal cap
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/670,537
Inventor
Yusaku OKAJIMA
Shuhei SAIDO
Hidenari YOSHIDA
Takafumi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAJIMA, YUSAKU, SAIDO, SHUHEI, SASAKI, TAKAFUMI, YOSHIDA, HIDENARI
Application granted granted Critical
Publication of USD916037S1 publication Critical patent/USD916037S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a rear, top and left side perspective view of a cover of seal cap for reaction chamber for semiconductor showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross-sectional view thereof taken in the direction of line 8-8 in FIG. 2.
The broken lines are included for the purpose of illustrating portions of the article that form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a cover of seal cap for reaction chamber for semiconductor, as shown and described.
US29/670,537 2018-05-18 2018-11-16 Cover of seal cap for reaction chamber for semiconductor Active USD916037S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2018-010931 2018-05-18
JPD2018-10931F JP1624334S (en) 2018-05-18 2018-05-18

Publications (1)

Publication Number Publication Date
USD916037S1 true USD916037S1 (en) 2021-04-13

Family

ID=65269280

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/670,537 Active USD916037S1 (en) 2018-05-18 2018-11-16 Cover of seal cap for reaction chamber for semiconductor

Country Status (3)

Country Link
US (1) USD916037S1 (en)
JP (1) JP1624334S (en)
TW (1) TWD201038S (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD947914S1 (en) * 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD981972S1 (en) * 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
US11887878B2 (en) 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
JP1579504S (en) 2016-07-26 2017-06-19
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1598442S (en) 2017-08-09 2018-02-26
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1579504S (en) 2016-07-26 2017-06-19
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
JP1598442S (en) 2017-08-09 2018-02-26
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11887878B2 (en) 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
USD947914S1 (en) * 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD960216S1 (en) * 2020-11-23 2022-08-09 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD981972S1 (en) * 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus

Also Published As

Publication number Publication date
TWD201038S (en) 2019-11-21
JP1624334S (en) 2019-02-12

Similar Documents

Publication Publication Date Title
USD939346S1 (en) Cap seal for bottle cap
USD813181S1 (en) Cover of seal cap for reaction chamber of semiconductor
USD878054S1 (en) Sealing lid
USD923394S1 (en) Bottle cap
USD868534S1 (en) Bottle cap
USD865521S1 (en) Packaging container
USD831432S1 (en) Vacuum bottle
USD916246S1 (en) Faucet
USD916037S1 (en) Cover of seal cap for reaction chamber for semiconductor
USD883792S1 (en) Container
USD984587S1 (en) Showerhead
USD906108S1 (en) Cap for packing container
USD855027S1 (en) Cover of seal cap for reaction chamber of semiconductor
USD909810S1 (en) Bottle cap
USD874216S1 (en) Lid for a bottle
USD881576S1 (en) Sealing tote
USD838179S1 (en) Bottle
USD883791S1 (en) Container
USD872037S1 (en) Cover of seal cap for reaction chamber for semiconductor manufacturing
USD885899S1 (en) Closure
USD903002S1 (en) Scooter
USD889114S1 (en) Water bottle
USD885895S1 (en) Cap for a bottle
USD933475S1 (en) Cap for bottle
USD838231S1 (en) Sensor cover

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY