JP1624334S - - Google Patents
Info
- Publication number
- JP1624334S JP1624334S JPD2018-10931F JP2018010931F JP1624334S JP 1624334 S JP1624334 S JP 1624334S JP 2018010931 F JP2018010931 F JP 2018010931F JP 1624334 S JP1624334 S JP 1624334S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2018-10931F JP1624334S (ja) | 2018-05-18 | 2018-05-18 | |
TW107306363F TWD201038S (zh) | 2018-05-18 | 2018-10-29 | 半導體製造裝置用密封蓋護罩 |
US29/670,537 USD916037S1 (en) | 2018-05-18 | 2018-11-16 | Cover of seal cap for reaction chamber for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2018-10931F JP1624334S (ja) | 2018-05-18 | 2018-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1624334S true JP1624334S (ja) | 2019-02-12 |
Family
ID=65269280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2018-10931F Active JP1624334S (ja) | 2018-05-18 | 2018-05-18 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD916037S1 (ja) |
JP (1) | JP1624334S (ja) |
TW (1) | TWD201038S (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11887878B2 (en) | 2019-06-28 | 2024-01-30 | Applied Materials, Inc. | Detachable biasable electrostatic chuck for high temperature applications |
USD947914S1 (en) * | 2020-11-23 | 2022-04-05 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
JP1700781S (ja) * | 2021-03-22 | 2021-11-29 | ||
TWD232576S (zh) | 2021-04-12 | 2024-08-01 | 美商蘭姆研究公司 (美國) | 基板處理系統用台座 |
USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD616390S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
USD654883S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
USD654884S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD813181S1 (en) * | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
JP1579504S (ja) | 2016-07-26 | 2017-06-19 | ||
JP1598442S (ja) * | 2017-08-09 | 2018-02-26 | ||
JP1620194S (ja) * | 2018-01-22 | 2018-12-10 |
-
2018
- 2018-05-18 JP JPD2018-10931F patent/JP1624334S/ja active Active
- 2018-10-29 TW TW107306363F patent/TWD201038S/zh unknown
- 2018-11-16 US US29/670,537 patent/USD916037S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD916037S1 (en) | 2021-04-13 |
TWD201038S (zh) | 2019-11-21 |