USD869409S1 - Target profile for a physical vapor deposition chamber target - Google Patents
Target profile for a physical vapor deposition chamber target Download PDFInfo
- Publication number
- USD869409S1 USD869409S1 US29/671,900 US201829671900F USD869409S US D869409 S1 USD869409 S1 US D869409S1 US 201829671900 F US201829671900 F US 201829671900F US D869409 S USD869409 S US D869409S
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- US
- United States
- Prior art keywords
- target
- vapor deposition
- physical vapor
- deposition chamber
- profile
- Prior art date
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Description
The dashed lines in FIGS. 1-8 represent disclaimed subject matter and form no part of the claimed design.
Claims (1)
- The ornamental design for a target profile for a physical vapor deposition chamber target, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/671,900 USD869409S1 (en) | 2016-09-30 | 2018-11-30 | Target profile for a physical vapor deposition chamber target |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/579,470 USD836572S1 (en) | 2016-09-30 | 2016-09-30 | Target profile for a physical vapor deposition chamber target |
US29/671,900 USD869409S1 (en) | 2016-09-30 | 2018-11-30 | Target profile for a physical vapor deposition chamber target |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/579,470 Division USD836572S1 (en) | 2016-09-30 | 2016-09-30 | Target profile for a physical vapor deposition chamber target |
Publications (1)
Publication Number | Publication Date |
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USD869409S1 true USD869409S1 (en) | 2019-12-10 |
Family
ID=61066246
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/579,470 Active USD836572S1 (en) | 2016-09-30 | 2016-09-30 | Target profile for a physical vapor deposition chamber target |
US29/671,900 Active USD869409S1 (en) | 2016-09-30 | 2018-11-30 | Target profile for a physical vapor deposition chamber target |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/579,470 Active USD836572S1 (en) | 2016-09-30 | 2016-09-30 | Target profile for a physical vapor deposition chamber target |
Country Status (3)
Country | Link |
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US (2) | USD836572S1 (en) |
JP (2) | JP1596742S (en) |
TW (2) | TWD191626S (en) |
Cited By (13)
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USD894137S1 (en) * | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD946638S1 (en) * | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
USD980394S1 (en) * | 2020-04-01 | 2023-03-07 | Watermann Polyworks Gmbh | Sealing apparatus |
USD981970S1 (en) * | 2021-03-04 | 2023-03-28 | Kokusai Electric Corporation | Substrate mounting plate for substrate processing apparatus |
USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1012051S1 (en) * | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
Families Citing this family (8)
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USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD862539S1 (en) * | 2017-12-04 | 2019-10-08 | Liqua-Tech Corporation | Register gear adapter plate |
USD851693S1 (en) * | 2017-12-04 | 2019-06-18 | Liqua-Tech Corporation | Register gear adapter plate |
USD851144S1 (en) * | 2017-12-04 | 2019-06-11 | Liqua-Tech Corporation | Register gear adapter plate |
JP1638282S (en) * | 2018-09-20 | 2019-08-05 | ||
USD888903S1 (en) | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
US11961723B2 (en) | 2018-12-17 | 2024-04-16 | Applied Materials, Inc. | Process kit having tall deposition ring for PVD chamber |
USD947802S1 (en) | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
Citations (63)
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US6390905B1 (en) * | 2000-03-31 | 2002-05-21 | Speedfam-Ipec Corporation | Workpiece carrier with adjustable pressure zones and barriers |
USD487254S1 (en) | 2002-05-24 | 2004-03-02 | Nichia Corporation | Light emitting diode |
US20040149567A1 (en) | 2002-12-16 | 2004-08-05 | Alexander Kosyachkov | Composite sputter target and phosphor deposition method |
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USD503729S1 (en) | 2003-10-31 | 2005-04-05 | Nordson Corporation | Nozzle for dispensing adhesives and sealants |
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USD614593S1 (en) | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
US20100108500A1 (en) | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Encapsulated sputtering target |
USD616390S1 (en) | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
US20100170786A1 (en) | 2009-01-07 | 2010-07-08 | Solar Applied Materials Technology Corp. | Refurbished sputtering target and method for making the same |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
US20120033340A1 (en) | 2010-08-06 | 2012-02-09 | Applied Materials, Inc. | Electrostatic chuck and methods of use thereof |
USD669509S1 (en) | 2011-10-19 | 2012-10-23 | Kjellberg Stiftung, rechtsfahige Stiftung des burge rlichen Rechts | Nozzle for torch |
USD683806S1 (en) | 2012-01-12 | 2013-06-04 | Surefire, Llc | Front plate for a firearm sound suppressor |
USD687791S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
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USD691974S1 (en) | 2011-12-22 | 2013-10-22 | Tokyo Electron Limited | Holding pad for transferring a wafer |
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US20140261180A1 (en) | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Pvd target for self-centering process shield |
USD716742S1 (en) | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD724553S1 (en) | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD732094S1 (en) | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
US20150170888A1 (en) | 2013-12-18 | 2015-06-18 | Applied Materials, Inc. | Physical vapor deposition (pvd) target having low friction pads |
USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
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US20160035547A1 (en) | 2014-07-29 | 2016-02-04 | Applied Materials, Inc. | Magnetron assembly for physical vapor deposition chamber |
USD750728S1 (en) | 2014-12-02 | 2016-03-01 | John K. Kremer | Laser target |
USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD790041S1 (en) | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Gas dispersing plate for semiconductor manufacturing apparatus |
USD793572S1 (en) | 2015-06-10 | 2017-08-01 | Tokyo Electron Limited | Electrode plate for plasma processing apparatus |
USD795208S1 (en) | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD796458S1 (en) | 2016-01-08 | 2017-09-05 | Asm Ip Holding B.V. | Gas flow control plate for semiconductor manufacturing apparatus |
USD797067S1 (en) | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD797691S1 (en) | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
USD798248S1 (en) | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
CN206573738U (en) | 2017-03-16 | 2017-10-20 | 江苏亨通光导新材料有限公司 | Low loss fiber |
USD801942S1 (en) | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD813181S1 (en) * | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
USD830435S1 (en) * | 2015-12-28 | 2018-10-09 | Ntn Corporation | Inner ring for tapered roller bearing |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
-
2016
- 2016-09-30 US US29/579,470 patent/USD836572S1/en active Active
-
2017
- 2017-03-17 TW TW106301373D01F patent/TWD191626S/en unknown
- 2017-03-17 TW TW106301373F patent/TWD188898S/en unknown
- 2017-03-29 JP JPD2017-6430F patent/JP1596742S/ja active Active
- 2017-03-29 JP JPD2017-19120F patent/JP1599074S/ja active Active
-
2018
- 2018-11-30 US US29/671,900 patent/USD869409S1/en active Active
Patent Citations (67)
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USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
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Cited By (15)
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USD894137S1 (en) * | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD946638S1 (en) * | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD1012051S1 (en) * | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD970566S1 (en) * | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD980394S1 (en) * | 2020-04-01 | 2023-03-07 | Watermann Polyworks Gmbh | Sealing apparatus |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD966357S1 (en) * | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD981970S1 (en) * | 2021-03-04 | 2023-03-28 | Kokusai Electric Corporation | Substrate mounting plate for substrate processing apparatus |
USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Also Published As
Publication number | Publication date |
---|---|
JP1599074S (en) | 2018-03-05 |
TWD191626S (en) | 2018-07-11 |
JP1596742S (en) | 2018-02-05 |
TWD188898S (en) | 2018-03-01 |
USD836572S1 (en) | 2018-12-25 |
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