USD869409S1 - Target profile for a physical vapor deposition chamber target - Google Patents

Target profile for a physical vapor deposition chamber target Download PDF

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Publication number
USD869409S1
USD869409S1 US29/671,900 US201829671900F USD869409S US D869409 S1 USD869409 S1 US D869409S1 US 201829671900 F US201829671900 F US 201829671900F US D869409 S USD869409 S US D869409S
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Prior art keywords
target
vapor deposition
physical vapor
deposition chamber
profile
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US29/671,900
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Martin Lee Riker
Fuhong Zhang
Xiaodong Wang
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Applied Materials Inc
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Applied Materials Inc
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Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RIKER, MARTIN LEE, WANG, XIAODONG, ZHANG, FUHONG
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FIG. 1 is a perspective view of a target profile for a physical vapor deposition chamber target, showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a front elevation view thereof;
FIG. 7 is a back elevation view thereof; and,
FIG. 8 is an enlarged cross sectional view taken along line 8-8 in FIG. 2.
The dashed lines in FIGS. 1-8 represent disclaimed subject matter and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a target profile for a physical vapor deposition chamber target, as shown and described.
US29/671,900 2016-09-30 2018-11-30 Target profile for a physical vapor deposition chamber target Active USD869409S1 (en)

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US29/579,470 USD836572S1 (en) 2016-09-30 2016-09-30 Target profile for a physical vapor deposition chamber target
US29/671,900 USD869409S1 (en) 2016-09-30 2018-11-30 Target profile for a physical vapor deposition chamber target

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USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
USD981970S1 (en) * 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device

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USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD862539S1 (en) * 2017-12-04 2019-10-08 Liqua-Tech Corporation Register gear adapter plate
USD851693S1 (en) * 2017-12-04 2019-06-18 Liqua-Tech Corporation Register gear adapter plate
USD851144S1 (en) * 2017-12-04 2019-06-11 Liqua-Tech Corporation Register gear adapter plate
JP1638282S (en) * 2018-09-20 2019-08-05
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US11961723B2 (en) 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film

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USD750728S1 (en) 2014-12-02 2016-03-01 John K. Kremer Laser target
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
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USD795208S1 (en) 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD796458S1 (en) 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD798248S1 (en) 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber
USD801942S1 (en) 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD830435S1 (en) * 2015-12-28 2018-10-09 Ntn Corporation Inner ring for tapered roller bearing
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

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Cited By (15)

* Cited by examiner, † Cited by third party
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USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD980394S1 (en) * 2020-04-01 2023-03-07 Watermann Polyworks Gmbh Sealing apparatus
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD981970S1 (en) * 2021-03-04 2023-03-28 Kokusai Electric Corporation Substrate mounting plate for substrate processing apparatus
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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JP1599074S (en) 2018-03-05
TWD191626S (en) 2018-07-11
JP1596742S (en) 2018-02-05
TWD188898S (en) 2018-03-01
USD836572S1 (en) 2018-12-25

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