USD808349S1 - Elastic membrane for semiconductor wafer polishing apparatus - Google Patents
Elastic membrane for semiconductor wafer polishing apparatus Download PDFInfo
- Publication number
- USD808349S1 USD808349S1 US29/574,604 US201629574604F USD808349S US D808349 S1 USD808349 S1 US D808349S1 US 201629574604 F US201629574604 F US 201629574604F US D808349 S USD808349 S US D808349S
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- US
- United States
- Prior art keywords
- semiconductor wafer
- polishing apparatus
- elastic membrane
- wafer polishing
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design. The dashed-dot-dashed lines represent boundary lines of the claimed design.
All surfaces not shown form no part of the claimed design.
Claims (1)
- The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.
Applications Claiming Priority (22)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2013-10678F JP1521701S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10675 | 2013-05-15 | ||
JP2013-10673 | 2013-05-15 | ||
JP2013-10678 | 2013-05-15 | ||
JPD2013-10675F JP1495082S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10672 | 2013-05-15 | ||
JPD2013-10676F JP1495739S (en) | 2013-05-15 | 2013-05-15 | |
JPD2013-10674F JP1495081S (en) | 2013-05-15 | 2013-05-15 | |
JPD2013-10677F JP1521451S (en) | 2013-05-15 | 2013-05-15 | |
JPD2013-10673F JP1495738S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10676 | 2013-05-15 | ||
JP2013-10674 | 2013-05-15 | ||
JPD2013-10672F JP1494713S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10677 | 2013-05-15 | ||
JP2013026347 | 2013-11-11 | ||
JP2013026346 | 2013-11-11 | ||
JP2013-026348 | 2013-11-11 | ||
JP2013026348 | 2013-11-11 | ||
JP2013-026347 | 2013-11-11 | ||
JP2013-026346 | 2013-11-11 | ||
JP2013026349 | 2013-11-11 | ||
JP2013-026349 | 2013-11-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD808349S1 true USD808349S1 (en) | 2018-01-23 |
Family
ID=60956707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/574,604 Active USD808349S1 (en) | 2013-05-15 | 2016-08-17 | Elastic membrane for semiconductor wafer polishing apparatus |
Country Status (1)
Country | Link |
---|---|
US (1) | USD808349S1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD869409S1 (en) | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD981969S1 (en) * | 2020-12-18 | 2023-03-28 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Citations (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010029158A1 (en) | 1998-07-30 | 2001-10-11 | Yoshitaka Sasaki | Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head |
US6508696B1 (en) * | 2000-08-25 | 2003-01-21 | Mitsubishi Materials Corporation | Wafer-polishing head and polishing apparatus having the same |
US6659850B2 (en) | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US20040175951A1 (en) | 2003-03-07 | 2004-09-09 | Applied Materials, Inc. | Substrate carrier with a textured membrane |
US20080070479A1 (en) | 2004-11-01 | 2008-03-20 | Ebara Corporation | Polishing Apparatus |
US20080066682A1 (en) * | 2006-03-24 | 2008-03-20 | Tokyo Electron Limited | Substrate supporting mechanism and substrate processing apparatus |
US7357699B2 (en) | 2003-02-10 | 2008-04-15 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
US7402098B2 (en) | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
US20090068935A1 (en) | 2003-10-17 | 2009-03-12 | Hiroomi Torii | Polishing apparatus |
US20090068934A1 (en) | 2007-09-04 | 2009-03-12 | Samsung Electronics Co., Ltd. | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
US20090111362A1 (en) | 2007-10-29 | 2009-04-30 | Ebara Corporation | Polishing Apparatus |
US20090247057A1 (en) | 2005-09-14 | 2009-10-01 | Ebara Corporation | Polishing platen and polishing apparatus |
USD616390S1 (en) | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
CN301348233S (en) | 2009-08-27 | 2010-09-15 | 株式会社荏原制作所 | Elastic film for semiconductor wafer polishing device |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD634719S1 (en) | 2009-08-27 | 2011-03-22 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
USD684551S1 (en) | 2011-07-07 | 2013-06-18 | Phuong Van Nguyen | Wafer polishing pad holder |
US8469776B2 (en) | 2006-11-22 | 2013-06-25 | Applied Materials, Inc. | Flexible membrane for carrier head |
USD686175S1 (en) | 2012-03-20 | 2013-07-16 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD686582S1 (en) | 2012-03-20 | 2013-07-23 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD687790S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Keyed wafer carrier |
USD687791S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
US20130316628A1 (en) | 2012-05-23 | 2013-11-28 | Samsung Electronics Co., Ltd. | Flexible membranes for a polishing head |
USD711330S1 (en) | 2010-12-28 | 2014-08-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
US8859070B2 (en) | 2011-11-30 | 2014-10-14 | Ebara Corporation | Elastic membrane |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770990S1 (en) * | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
-
2016
- 2016-08-17 US US29/574,604 patent/USD808349S1/en active Active
Patent Citations (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010029158A1 (en) | 1998-07-30 | 2001-10-11 | Yoshitaka Sasaki | Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head |
US6659850B2 (en) | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US6508696B1 (en) * | 2000-08-25 | 2003-01-21 | Mitsubishi Materials Corporation | Wafer-polishing head and polishing apparatus having the same |
US7357699B2 (en) | 2003-02-10 | 2008-04-15 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
US20040175951A1 (en) | 2003-03-07 | 2004-09-09 | Applied Materials, Inc. | Substrate carrier with a textured membrane |
US20090068935A1 (en) | 2003-10-17 | 2009-03-12 | Hiroomi Torii | Polishing apparatus |
US20080070479A1 (en) | 2004-11-01 | 2008-03-20 | Ebara Corporation | Polishing Apparatus |
US20090247057A1 (en) | 2005-09-14 | 2009-10-01 | Ebara Corporation | Polishing platen and polishing apparatus |
US20080066682A1 (en) * | 2006-03-24 | 2008-03-20 | Tokyo Electron Limited | Substrate supporting mechanism and substrate processing apparatus |
US7402098B2 (en) | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
US8469776B2 (en) | 2006-11-22 | 2013-06-25 | Applied Materials, Inc. | Flexible membrane for carrier head |
US20090068934A1 (en) | 2007-09-04 | 2009-03-12 | Samsung Electronics Co., Ltd. | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
US20090111362A1 (en) | 2007-10-29 | 2009-04-30 | Ebara Corporation | Polishing Apparatus |
USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
USD616390S1 (en) | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
CN301348233S (en) | 2009-08-27 | 2010-09-15 | 株式会社荏原制作所 | Elastic film for semiconductor wafer polishing device |
USD634719S1 (en) | 2009-08-27 | 2011-03-22 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD711330S1 (en) | 2010-12-28 | 2014-08-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD729753S1 (en) | 2010-12-28 | 2015-05-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD684551S1 (en) | 2011-07-07 | 2013-06-18 | Phuong Van Nguyen | Wafer polishing pad holder |
US8859070B2 (en) | 2011-11-30 | 2014-10-14 | Ebara Corporation | Elastic membrane |
USD686175S1 (en) | 2012-03-20 | 2013-07-16 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD687791S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
USD687790S1 (en) | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Keyed wafer carrier |
USD686582S1 (en) | 2012-03-20 | 2013-07-23 | Veeco Instruments Inc. | Wafer carrier having pockets |
US20130316628A1 (en) | 2012-05-23 | 2013-11-28 | Samsung Electronics Co., Ltd. | Flexible membranes for a polishing head |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770990S1 (en) * | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD869409S1 (en) | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD913977S1 (en) | 2016-12-12 | 2021-03-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD946638S1 (en) | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD970566S1 (en) | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD966357S1 (en) | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD981969S1 (en) * | 2020-12-18 | 2023-03-28 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
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