USD687791S1 - Multi-keyed wafer carrier - Google Patents

Multi-keyed wafer carrier Download PDF

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Publication number
USD687791S1
USD687791S1 US29/416,236 US201229416236F USD687791S US D687791 S1 USD687791 S1 US D687791S1 US 201229416236 F US201229416236 F US 201229416236F US D687791 S USD687791 S US D687791S
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US
United States
Prior art keywords
wafer carrier
keyed
keyed wafer
view
enlarged view
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Active
Application number
US29/416,236
Inventor
Sandeep Krishnan
Keng Moy
Alexander I. Gurary
Matthew King
Vadim Boguslavskiy
Steven Krommenhoek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Veeco Instruments Inc
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Veeco Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Veeco Instruments Inc filed Critical Veeco Instruments Inc
Priority to US29/416,236 priority Critical patent/USD687791S1/en
Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GURARY, ALEXANDER I., BOGUSLAVSKIY, VADIM, KING, MATTHEW, KRISHNAN, SANDEEP, KROMMENHOEK, STEVEN, MOY, KENG
Application granted granted Critical
Publication of USD687791S1 publication Critical patent/USD687791S1/en
Assigned to HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT reassignment HSBC BANK USA, NATIONAL ASSOCIATION, AS COLLATERAL AGENT PATENT SECURITY AGREEMENT Assignors: VEECO INSTRUMENTS INC.
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Description

FIG. 1 is a bottom perspective view of a multi-keyed wafer carrier showing a first embodiment of our new design;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a bottom plan view of the first embodiment;
FIG. 4 is an enlarged view of a portion of FIG. 3;
FIG. 5 is a bottom perspective view of a multi-keyed wafer carrier showing a second embodiment of our new design;
FIG. 6 is an enlarged view of a portion of FIG. 5;
FIG. 7 is a bottom plan view of the second embodiment;
FIG. 8 is an enlarged view of a portion of FIG. 7;
FIG. 9 is a bottom perspective view of a multi-keyed wafer carrier showing a third embodiment of our new design;
FIG. 10 is an enlarged view of a portion of FIG. 9;
FIG. 11 is a bottom plan view of the third embodiment;
FIG. 12 is an enlarged view of a portion of FIG. 11;
FIG. 13 is a top perspective view that can correspond to any of the first, second, or third embodiments;
FIG. 14 is a top plan view that can correspond to any of the first, second, or third embodiments; and,
FIG. 15 is a right side view that can correspond to any of the first, second, or third embodiments, the left side, front, and rear views being the same as the right side view.
The dash-dot broken lines shown in the drawings define the area corresponding to the enlarged portion shown in FIGS. 2, 4, 6, 8, 10, and 12 views and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a multi-keyed wafer carrier, as shown and described.
US29/416,236 2012-03-20 2012-03-20 Multi-keyed wafer carrier Active USD687791S1 (en)

Priority Applications (1)

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US29/416,236 USD687791S1 (en) 2012-03-20 2012-03-20 Multi-keyed wafer carrier

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US29/416,236 USD687791S1 (en) 2012-03-20 2012-03-20 Multi-keyed wafer carrier

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USD687791S1 true USD687791S1 (en) 2013-08-13

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130125820A1 (en) * 2011-11-23 2013-05-23 Gerald Zheyao Yin Chemical vapor deposition or epitaxial-layer growth reactor and supporter thereof
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130125820A1 (en) * 2011-11-23 2013-05-23 Gerald Zheyao Yin Chemical vapor deposition or epitaxial-layer growth reactor and supporter thereof
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en) 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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