USD769200S1 - Elastic membrane for semiconductor wafer polishing apparatus - Google Patents
Elastic membrane for semiconductor wafer polishing apparatus Download PDFInfo
- Publication number
- USD769200S1 USD769200S1 US29/472,346 US201329472346F USD769200S US D769200 S1 USD769200 S1 US D769200S1 US 201329472346 F US201329472346 F US 201329472346F US D769200 S USD769200 S US D769200S
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- US
- United States
- Prior art keywords
- semiconductor wafer
- polishing apparatus
- elastic membrane
- wafer polishing
- view
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design.
Claims (1)
- The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/489,477 USD770990S1 (en) | 2013-05-15 | 2014-04-30 | Elastic membrane for semiconductor wafer polishing apparatus |
US29/580,339 USD813180S1 (en) | 2013-05-15 | 2016-10-07 | Elastic membrane for semiconductor wafer polishing apparatus |
Applications Claiming Priority (14)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2013-10676F JP1495739S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10676 | 2013-05-15 | ||
JP2013-10672 | 2013-05-15 | ||
JPD2013-10672F JP1494713S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10677 | 2013-05-15 | ||
JP2013-10678 | 2013-05-15 | ||
JPD2013-10673F JP1495738S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10675 | 2013-05-15 | ||
JPD2013-10674F JP1495081S (en) | 2013-05-15 | 2013-05-15 | |
JPD2013-10678F JP1521701S (en) | 2013-05-15 | 2013-05-15 | |
JPD2013-10677F JP1521451S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10674 | 2013-05-15 | ||
JPD2013-10675F JP1495082S (en) | 2013-05-15 | 2013-05-15 | |
JP2013-10673 | 2013-05-15 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/489,477 Continuation-In-Part USD770990S1 (en) | 2013-05-15 | 2014-04-30 | Elastic membrane for semiconductor wafer polishing apparatus |
US29/580,339 Division USD813180S1 (en) | 2013-05-15 | 2016-10-07 | Elastic membrane for semiconductor wafer polishing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
USD769200S1 true USD769200S1 (en) | 2016-10-18 |
Family
ID=57120114
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/472,346 Active USD769200S1 (en) | 2013-05-15 | 2013-11-12 | Elastic membrane for semiconductor wafer polishing apparatus |
US29/580,339 Active USD813180S1 (en) | 2013-05-15 | 2016-10-07 | Elastic membrane for semiconductor wafer polishing apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/580,339 Active USD813180S1 (en) | 2013-05-15 | 2016-10-07 | Elastic membrane for semiconductor wafer polishing apparatus |
Country Status (1)
Country | Link |
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US (2) | USD769200S1 (en) |
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD799646S1 (en) * | 2016-08-30 | 2017-10-10 | Asm Ip Holding B.V. | Heater block |
USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD808349S1 (en) * | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD813180S1 (en) * | 2013-05-15 | 2018-03-20 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD839224S1 (en) | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD851613S1 (en) | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
USD859332S1 (en) | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD918161S1 (en) * | 2017-12-19 | 2021-05-04 | Ebara Corporation | Elastic membrane |
USD918848S1 (en) * | 2019-07-18 | 2021-05-11 | Kokusai Electric Corporation | Retainer of ceiling heater for semiconductor fabrication apparatus |
US11179823B2 (en) | 2016-10-28 | 2021-11-23 | Ebara Corporation | Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD954567S1 (en) * | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
USD962184S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD962183S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD981969S1 (en) * | 2020-12-18 | 2023-03-28 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US11958163B2 (en) | 2016-10-28 | 2024-04-16 | Ebara Corporation | Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane |
Citations (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010029158A1 (en) * | 1998-07-30 | 2001-10-11 | Yoshitaka Sasaki | Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head |
US6659850B2 (en) * | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US20040175951A1 (en) * | 2003-03-07 | 2004-09-09 | Applied Materials, Inc. | Substrate carrier with a textured membrane |
US20080070479A1 (en) * | 2004-11-01 | 2008-03-20 | Ebara Corporation | Polishing Apparatus |
US7357699B2 (en) * | 2003-02-10 | 2008-04-15 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
US7402098B2 (en) * | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
US20090068935A1 (en) * | 2003-10-17 | 2009-03-12 | Hiroomi Torii | Polishing apparatus |
US20090068934A1 (en) * | 2007-09-04 | 2009-03-12 | Samsung Electronics Co., Ltd. | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
US20090111362A1 (en) * | 2007-10-29 | 2009-04-30 | Ebara Corporation | Polishing Apparatus |
US20090247057A1 (en) * | 2005-09-14 | 2009-10-01 | Ebara Corporation | Polishing platen and polishing apparatus |
USD616390S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
CN301348233S (en) | 2009-08-27 | 2010-09-15 | 株式会社荏原制作所 | Elastic film for semiconductor wafer polishing device |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD634719S1 (en) | 2009-08-27 | 2011-03-22 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
USD684551S1 (en) * | 2011-07-07 | 2013-06-18 | Phuong Van Nguyen | Wafer polishing pad holder |
US8469776B2 (en) * | 2006-11-22 | 2013-06-25 | Applied Materials, Inc. | Flexible membrane for carrier head |
USD686175S1 (en) * | 2012-03-20 | 2013-07-16 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD686582S1 (en) * | 2012-03-20 | 2013-07-23 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD687790S1 (en) * | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Keyed wafer carrier |
USD687791S1 (en) * | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
US20130316628A1 (en) * | 2012-05-23 | 2013-11-28 | Samsung Electronics Co., Ltd. | Flexible membranes for a polishing head |
USD711330S1 (en) | 2010-12-28 | 2014-08-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
US8859070B2 (en) * | 2011-11-30 | 2014-10-14 | Ebara Corporation | Elastic membrane |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3627338A (en) * | 1969-10-09 | 1971-12-14 | Sheldon Thompson | Vacuum chuck |
US6402594B1 (en) * | 1999-01-18 | 2002-06-11 | Shin-Etsu Handotai Co., Ltd. | Polishing method for wafer and holding plate |
JP3342686B2 (en) * | 1999-12-28 | 2002-11-11 | 信越半導体株式会社 | Wafer polishing method and wafer polishing apparatus |
US20050035514A1 (en) * | 2003-08-11 | 2005-02-17 | Supercritical Systems, Inc. | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
US7033252B2 (en) * | 2004-03-05 | 2006-04-25 | Strasbaugh | Wafer carrier with pressurized membrane and retaining ring actuator |
KR100753302B1 (en) * | 2004-03-25 | 2007-08-29 | 이비덴 가부시키가이샤 | Vacuum chuck, suction board, polishing device, and method for manufacturing of semiconductor wafer |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770990S1 (en) * | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
-
2013
- 2013-11-12 US US29/472,346 patent/USD769200S1/en active Active
-
2016
- 2016-10-07 US US29/580,339 patent/USD813180S1/en active Active
Patent Citations (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010029158A1 (en) * | 1998-07-30 | 2001-10-11 | Yoshitaka Sasaki | Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head |
US6659850B2 (en) * | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US7357699B2 (en) * | 2003-02-10 | 2008-04-15 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
US20040175951A1 (en) * | 2003-03-07 | 2004-09-09 | Applied Materials, Inc. | Substrate carrier with a textured membrane |
US20090068935A1 (en) * | 2003-10-17 | 2009-03-12 | Hiroomi Torii | Polishing apparatus |
US20080070479A1 (en) * | 2004-11-01 | 2008-03-20 | Ebara Corporation | Polishing Apparatus |
US20090247057A1 (en) * | 2005-09-14 | 2009-10-01 | Ebara Corporation | Polishing platen and polishing apparatus |
US7402098B2 (en) * | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
US8469776B2 (en) * | 2006-11-22 | 2013-06-25 | Applied Materials, Inc. | Flexible membrane for carrier head |
US20090068934A1 (en) * | 2007-09-04 | 2009-03-12 | Samsung Electronics Co., Ltd. | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
US20090111362A1 (en) * | 2007-10-29 | 2009-04-30 | Ebara Corporation | Polishing Apparatus |
USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
USD616390S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Quartz cover for manufacturing semiconductor wafers |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD634719S1 (en) | 2009-08-27 | 2011-03-22 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
CN301348233S (en) | 2009-08-27 | 2010-09-15 | 株式会社荏原制作所 | Elastic film for semiconductor wafer polishing device |
USD711330S1 (en) | 2010-12-28 | 2014-08-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD729753S1 (en) | 2010-12-28 | 2015-05-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD684551S1 (en) * | 2011-07-07 | 2013-06-18 | Phuong Van Nguyen | Wafer polishing pad holder |
US8859070B2 (en) * | 2011-11-30 | 2014-10-14 | Ebara Corporation | Elastic membrane |
USD686175S1 (en) * | 2012-03-20 | 2013-07-16 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD686582S1 (en) * | 2012-03-20 | 2013-07-23 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD687790S1 (en) * | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Keyed wafer carrier |
USD687791S1 (en) * | 2012-03-20 | 2013-08-13 | Veeco Instruments Inc. | Multi-keyed wafer carrier |
US20130316628A1 (en) * | 2012-05-23 | 2013-11-28 | Samsung Electronics Co., Ltd. | Flexible membranes for a polishing head |
Cited By (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD808349S1 (en) * | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD813180S1 (en) * | 2013-05-15 | 2018-03-20 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD837755S1 (en) * | 2015-04-16 | 2019-01-08 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD825504S1 (en) | 2015-04-21 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD799646S1 (en) * | 2016-08-30 | 2017-10-10 | Asm Ip Holding B.V. | Heater block |
USD869409S1 (en) | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US11179823B2 (en) | 2016-10-28 | 2021-11-23 | Ebara Corporation | Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane |
US11958163B2 (en) | 2016-10-28 | 2024-04-16 | Ebara Corporation | Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane |
USD839224S1 (en) | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD913977S1 (en) | 2016-12-12 | 2021-03-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
USD859332S1 (en) | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD851613S1 (en) | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD946638S1 (en) | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD918161S1 (en) * | 2017-12-19 | 2021-05-04 | Ebara Corporation | Elastic membrane |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD954567S1 (en) * | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
USD962184S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD962183S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD918848S1 (en) * | 2019-07-18 | 2021-05-11 | Kokusai Electric Corporation | Retainer of ceiling heater for semiconductor fabrication apparatus |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD970566S1 (en) | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD947802S1 (en) * | 2020-05-20 | 2022-04-05 | Applied Materials, Inc. | Replaceable substrate carrier interfacing film |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD1021832S1 (en) * | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
USD966357S1 (en) | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD981969S1 (en) * | 2020-12-18 | 2023-03-28 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Also Published As
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