USD711330S1 - Elastic membrane for semiconductor wafer polishing - Google Patents
Elastic membrane for semiconductor wafer polishing Download PDFInfo
- Publication number
- USD711330S1 USD711330S1 US29/384,219 US201129384219F USD711330S US D711330 S1 USD711330 S1 US D711330S1 US 201129384219 F US201129384219 F US 201129384219F US D711330 S USD711330 S US D711330S
- Authority
- US
- United States
- Prior art keywords
- semiconductor wafer
- elastic membrane
- wafer polishing
- view
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines depict environmental subject matter only and form no part of the claimed design.
Claims (1)
- The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/496,207 USD729753S1 (en) | 2010-12-28 | 2014-07-10 | Elastic membrane for semiconductor wafer polishing |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-031214 | 2010-02-16 | ||
JP2010-031215 | 2010-12-28 | ||
JP2010031213 | 2010-12-28 | ||
JP2010031215 | 2010-12-28 | ||
JP2010-031216 | 2010-12-28 | ||
JP2010031214 | 2010-12-28 | ||
JP2010-031213 | 2010-12-28 | ||
JP2010031216 | 2010-12-28 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/496,207 Division USD729753S1 (en) | 2010-12-28 | 2014-07-10 | Elastic membrane for semiconductor wafer polishing |
Publications (1)
Publication Number | Publication Date |
---|---|
USD711330S1 true USD711330S1 (en) | 2014-08-19 |
Family
ID=51302154
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/384,219 Active USD711330S1 (en) | 2010-12-28 | 2011-01-28 | Elastic membrane for semiconductor wafer polishing |
US29/496,207 Active USD729753S1 (en) | 2010-12-28 | 2014-07-10 | Elastic membrane for semiconductor wafer polishing |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/496,207 Active USD729753S1 (en) | 2010-12-28 | 2014-07-10 | Elastic membrane for semiconductor wafer polishing |
Country Status (1)
Country | Link |
---|---|
US (2) | USD711330S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770990S1 (en) | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD814473S1 (en) * | 2016-01-19 | 2018-04-03 | Sony Corporation | Memory card |
-
2011
- 2011-01-28 US US29/384,219 patent/USD711330S1/en active Active
-
2014
- 2014-07-10 US US29/496,207 patent/USD729753S1/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770990S1 (en) | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD813180S1 (en) | 2013-05-15 | 2018-03-20 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD913977S1 (en) | 2016-12-12 | 2021-03-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
Also Published As
Publication number | Publication date |
---|---|
USD729753S1 (en) | 2015-05-19 |
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