USD913977S1 - Elastic membrane for semiconductor wafer polishing - Google Patents

Elastic membrane for semiconductor wafer polishing Download PDF

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Publication number
USD913977S1
USD913977S1 US29/672,852 US201829672852F USD913977S US D913977 S1 USD913977 S1 US D913977S1 US 201829672852 F US201829672852 F US 201829672852F US D913977 S USD913977 S US D913977S
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United States
Prior art keywords
semiconductor wafer
elastic membrane
wafer polishing
view
polishing
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US29/672,852
Inventor
Satoru Yamaki
Makoto Fukushima
Keisuke Namiki
Osamu Nabeya
Shingo Togashi
Tomoko OWADA
Masahiko KISHIMOTO
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Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2016-26913F external-priority patent/JP1582993S/ja
Priority claimed from JPD2016-26915F external-priority patent/JP1582995S/ja
Priority claimed from JPD2016-26914F external-priority patent/JP1582994S/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US29/672,852 priority Critical patent/USD913977S1/en
Application granted granted Critical
Publication of USD913977S1 publication Critical patent/USD913977S1/en
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FIG. 1 is a bottom perspective view of an elastic membrane for semiconductor wafer polishing showing our new design;
FIG. 2 is a top perspective view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a top view thereof;
FIG. 5 is a front view thereof, rear view being identical;
FIG. 6 is a right-side view thereof, left-side view being identical;
FIG. 7 is a cross-sectional view taken along line 7-7 of FIG. 4; and,
FIG. 8 is an enlarged portion view labeled FIG. 8 in FIG. 7.
The portions of the elastic membrane shown in even broken lines form no part of the claimed design. The dashed-dot lines in the drawings represent the boundary lines of the claimed design. The box labeled FIG. 8 shown in even broken lines in FIG. 7 defines the enlarged portion view of FIG. 8.

Claims (1)

    CLAIM
  1. The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.
US29/672,852 2016-12-12 2018-12-10 Elastic membrane for semiconductor wafer polishing Active USD913977S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/672,852 USD913977S1 (en) 2016-12-12 2018-12-10 Elastic membrane for semiconductor wafer polishing

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2016-026915 2016-12-12
JPD2016-26913F JP1582993S (en) 2016-12-12 2016-12-12
JPD2016-26915F JP1582995S (en) 2016-12-12 2016-12-12
JP2016-026913 2016-12-12
JPD2016-26914F JP1582994S (en) 2016-12-12 2016-12-12
JP2016-026914 2016-12-12
US29/606,998 USD839224S1 (en) 2016-12-12 2017-06-09 Elastic membrane for semiconductor wafer polishing
US29/672,852 USD913977S1 (en) 2016-12-12 2018-12-10 Elastic membrane for semiconductor wafer polishing

Related Parent Applications (1)

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US29/606,998 Division USD839224S1 (en) 2016-12-12 2017-06-09 Elastic membrane for semiconductor wafer polishing

Publications (1)

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USD913977S1 true USD913977S1 (en) 2021-03-23

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US29/606,998 Active USD839224S1 (en) 2016-12-12 2017-06-09 Elastic membrane for semiconductor wafer polishing
US29/672,852 Active USD913977S1 (en) 2016-12-12 2018-12-10 Elastic membrane for semiconductor wafer polishing

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US29/606,998 Active USD839224S1 (en) 2016-12-12 2017-06-09 Elastic membrane for semiconductor wafer polishing

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD981969S1 (en) * 2020-12-18 2023-03-28 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1021832S1 (en) * 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1651167S (en) * 2019-04-24 2020-01-27
JP1646292S (en) * 2019-04-24 2019-11-25
USD954567S1 (en) * 2019-06-25 2022-06-14 Ebara Corporation Measurement jig
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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US20070063453A1 (en) * 2004-03-25 2007-03-22 Ibiden Co., Ltd. Vacuum chuck and suction board
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USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20080070479A1 (en) * 2004-11-01 2008-03-20 Ebara Corporation Polishing Apparatus
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US20080119119A1 (en) * 2006-11-22 2008-05-22 Applied Materials, Inc. Carrier Ring for Carrier Head
US7402098B2 (en) * 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US20090068934A1 (en) * 2007-09-04 2009-03-12 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
US20090111362A1 (en) * 2007-10-29 2009-04-30 Ebara Corporation Polishing Apparatus
US20090247057A1 (en) 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
US8469776B2 (en) 2006-11-22 2013-06-25 Applied Materials, Inc. Flexible membrane for carrier head
US20130316628A1 (en) * 2012-05-23 2013-11-28 Samsung Electronics Co., Ltd. Flexible membranes for a polishing head
USD709538S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD711330S1 (en) 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US20140262193A1 (en) 2013-03-13 2014-09-18 Techest Co., Ltd. Edge ring cooling module for semi-conductor manufacture chuck
US8859070B2 (en) 2011-11-30 2014-10-14 Ebara Corporation Elastic membrane
US8932106B2 (en) * 2010-09-08 2015-01-13 Ebara Corporation Polishing apparatus having thermal energy measuring means
US8939817B2 (en) * 2011-05-31 2015-01-27 K.C. Tech Co., Ltd. Membrane assembly and carrier head having the membrane assembly
US20160002788A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
US9376752B2 (en) 2012-04-06 2016-06-28 Applied Materials, Inc. Edge ring for a deposition chamber
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
USD783922S1 (en) 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Patent Citations (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD363464S (en) 1992-08-27 1995-10-24 Tokyo Electron Yamanashi Limited Electrode for a semiconductor processing apparatus
USD411516S (en) 1996-03-15 1999-06-29 Tokyo Electron Limited Gas diffusion plate for electrode of semiconductor wafer processing apparatus
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US20010029158A1 (en) * 1998-07-30 2001-10-11 Yoshitaka Sasaki Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head
US20020160693A1 (en) * 1999-12-28 2002-10-31 Takashi Nihonmatsu Wafer polishing method and wafer polishing device
US6659850B2 (en) 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6890402B2 (en) * 2000-07-31 2005-05-10 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
US7033260B2 (en) * 2001-12-06 2006-04-25 Ebara Corporation Substrate holding device and polishing device
US20030171076A1 (en) * 2002-01-22 2003-09-11 Moloney Gerard S. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
US7357699B2 (en) * 2003-02-10 2008-04-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
US20040175951A1 (en) * 2003-03-07 2004-09-09 Applied Materials, Inc. Substrate carrier with a textured membrane
US20050215182A1 (en) * 2004-03-05 2005-09-29 Strasbaugh Wafer carrier with pressurized membrane and retaining ring actuator
US20070063453A1 (en) * 2004-03-25 2007-03-22 Ibiden Co., Ltd. Vacuum chuck and suction board
USD553104S1 (en) 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
US20080070479A1 (en) * 2004-11-01 2008-03-20 Ebara Corporation Polishing Apparatus
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20090247057A1 (en) 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
USD546784S1 (en) 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
US7402098B2 (en) * 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US20080119119A1 (en) * 2006-11-22 2008-05-22 Applied Materials, Inc. Carrier Ring for Carrier Head
US8469776B2 (en) 2006-11-22 2013-06-25 Applied Materials, Inc. Flexible membrane for carrier head
US20090068934A1 (en) * 2007-09-04 2009-03-12 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
US20090111362A1 (en) * 2007-10-29 2009-04-30 Ebara Corporation Polishing Apparatus
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD634719S1 (en) 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
US8932106B2 (en) * 2010-09-08 2015-01-13 Ebara Corporation Polishing apparatus having thermal energy measuring means
USD711330S1 (en) 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD729753S1 (en) 2010-12-28 2015-05-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US8939817B2 (en) * 2011-05-31 2015-01-27 K.C. Tech Co., Ltd. Membrane assembly and carrier head having the membrane assembly
USD709538S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
US8859070B2 (en) 2011-11-30 2014-10-14 Ebara Corporation Elastic membrane
US9376752B2 (en) 2012-04-06 2016-06-28 Applied Materials, Inc. Edge ring for a deposition chamber
US20130316628A1 (en) * 2012-05-23 2013-11-28 Samsung Electronics Co., Ltd. Flexible membranes for a polishing head
US20160002788A1 (en) 2013-02-21 2016-01-07 Altatech Semiconductor Chemical vapour deposition device
US20140262193A1 (en) 2013-03-13 2014-09-18 Techest Co., Ltd. Edge ring cooling module for semi-conductor manufacture chuck
USD813180S1 (en) * 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD783922S1 (en) 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
USD767234S1 (en) 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD797067S1 (en) 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
USD810705S1 (en) 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1021832S1 (en) * 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD981969S1 (en) * 2020-12-18 2023-03-28 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication

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