USD913977S1 - Elastic membrane for semiconductor wafer polishing - Google Patents
Elastic membrane for semiconductor wafer polishing Download PDFInfo
- Publication number
- USD913977S1 USD913977S1 US29/672,852 US201829672852F USD913977S US D913977 S1 USD913977 S1 US D913977S1 US 201829672852 F US201829672852 F US 201829672852F US D913977 S USD913977 S US D913977S
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- US
- United States
- Prior art keywords
- semiconductor wafer
- elastic membrane
- wafer polishing
- view
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The portions of the elastic membrane shown in even broken lines form no part of the claimed design. The dashed-dot lines in the drawings represent the boundary lines of the claimed design. The box labeled FIG. 8 shown in even broken lines in FIG. 7 defines the enlarged portion view of FIG. 8 .
Claims (1)
- The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/672,852 USD913977S1 (en) | 2016-12-12 | 2018-12-10 | Elastic membrane for semiconductor wafer polishing |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-026915 | 2016-12-12 | ||
JPD2016-26913F JP1582993S (en) | 2016-12-12 | 2016-12-12 | |
JPD2016-26915F JP1582995S (en) | 2016-12-12 | 2016-12-12 | |
JP2016-026913 | 2016-12-12 | ||
JPD2016-26914F JP1582994S (en) | 2016-12-12 | 2016-12-12 | |
JP2016-026914 | 2016-12-12 | ||
US29/606,998 USD839224S1 (en) | 2016-12-12 | 2017-06-09 | Elastic membrane for semiconductor wafer polishing |
US29/672,852 USD913977S1 (en) | 2016-12-12 | 2018-12-10 | Elastic membrane for semiconductor wafer polishing |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/606,998 Division USD839224S1 (en) | 2016-12-12 | 2017-06-09 | Elastic membrane for semiconductor wafer polishing |
Publications (1)
Publication Number | Publication Date |
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USD913977S1 true USD913977S1 (en) | 2021-03-23 |
Family
ID=65032365
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/606,998 Active USD839224S1 (en) | 2016-12-12 | 2017-06-09 | Elastic membrane for semiconductor wafer polishing |
US29/672,852 Active USD913977S1 (en) | 2016-12-12 | 2018-12-10 | Elastic membrane for semiconductor wafer polishing |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/606,998 Active USD839224S1 (en) | 2016-12-12 | 2017-06-09 | Elastic membrane for semiconductor wafer polishing |
Country Status (1)
Country | Link |
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US (2) | USD839224S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD981969S1 (en) * | 2020-12-18 | 2023-03-28 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD1021832S1 (en) * | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
USD859332S1 (en) * | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD851613S1 (en) | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD918161S1 (en) * | 2017-12-19 | 2021-05-04 | Ebara Corporation | Elastic membrane |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
JP1651167S (en) * | 2019-04-24 | 2020-01-27 | ||
JP1646292S (en) * | 2019-04-24 | 2019-11-25 | ||
USD954567S1 (en) * | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Citations (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD363464S (en) | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
USD411516S (en) | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US20010029158A1 (en) * | 1998-07-30 | 2001-10-11 | Yoshitaka Sasaki | Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head |
US20020160693A1 (en) * | 1999-12-28 | 2002-10-31 | Takashi Nihonmatsu | Wafer polishing method and wafer polishing device |
US20030171076A1 (en) * | 2002-01-22 | 2003-09-11 | Moloney Gerard S. | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution |
US6659850B2 (en) | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US20040175951A1 (en) * | 2003-03-07 | 2004-09-09 | Applied Materials, Inc. | Substrate carrier with a textured membrane |
US6890402B2 (en) * | 2000-07-31 | 2005-05-10 | Ebara Corporation | Substrate holding apparatus and substrate polishing apparatus |
US20050215182A1 (en) * | 2004-03-05 | 2005-09-29 | Strasbaugh | Wafer carrier with pressurized membrane and retaining ring actuator |
US7033260B2 (en) * | 2001-12-06 | 2006-04-25 | Ebara Corporation | Substrate holding device and polishing device |
US20070063453A1 (en) * | 2004-03-25 | 2007-03-22 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
USD546784S1 (en) | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
US20080070479A1 (en) * | 2004-11-01 | 2008-03-20 | Ebara Corporation | Polishing Apparatus |
US7357699B2 (en) * | 2003-02-10 | 2008-04-15 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
US20080119119A1 (en) * | 2006-11-22 | 2008-05-22 | Applied Materials, Inc. | Carrier Ring for Carrier Head |
US7402098B2 (en) * | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
US20090068934A1 (en) * | 2007-09-04 | 2009-03-12 | Samsung Electronics Co., Ltd. | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
US20090111362A1 (en) * | 2007-10-29 | 2009-04-30 | Ebara Corporation | Polishing Apparatus |
US20090247057A1 (en) | 2005-09-14 | 2009-10-01 | Ebara Corporation | Polishing platen and polishing apparatus |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD634719S1 (en) | 2009-08-27 | 2011-03-22 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
US8469776B2 (en) | 2006-11-22 | 2013-06-25 | Applied Materials, Inc. | Flexible membrane for carrier head |
US20130316628A1 (en) * | 2012-05-23 | 2013-11-28 | Samsung Electronics Co., Ltd. | Flexible membranes for a polishing head |
USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD711330S1 (en) | 2010-12-28 | 2014-08-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
US20140262193A1 (en) | 2013-03-13 | 2014-09-18 | Techest Co., Ltd. | Edge ring cooling module for semi-conductor manufacture chuck |
US8859070B2 (en) | 2011-11-30 | 2014-10-14 | Ebara Corporation | Elastic membrane |
US8932106B2 (en) * | 2010-09-08 | 2015-01-13 | Ebara Corporation | Polishing apparatus having thermal energy measuring means |
US8939817B2 (en) * | 2011-05-31 | 2015-01-27 | K.C. Tech Co., Ltd. | Membrane assembly and carrier head having the membrane assembly |
US20160002788A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
US9376752B2 (en) | 2012-04-06 | 2016-06-28 | Applied Materials, Inc. | Edge ring for a deposition chamber |
USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770990S1 (en) | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
US20170009367A1 (en) * | 2015-07-09 | 2017-01-12 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
USD783922S1 (en) | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring |
USD797067S1 (en) | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
USD859332S1 (en) * | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
-
2017
- 2017-06-09 US US29/606,998 patent/USD839224S1/en active Active
-
2018
- 2018-12-10 US US29/672,852 patent/USD913977S1/en active Active
Patent Citations (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD363464S (en) | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
USD411516S (en) | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US20010029158A1 (en) * | 1998-07-30 | 2001-10-11 | Yoshitaka Sasaki | Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head |
US20020160693A1 (en) * | 1999-12-28 | 2002-10-31 | Takashi Nihonmatsu | Wafer polishing method and wafer polishing device |
US6659850B2 (en) | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US6890402B2 (en) * | 2000-07-31 | 2005-05-10 | Ebara Corporation | Substrate holding apparatus and substrate polishing apparatus |
US7033260B2 (en) * | 2001-12-06 | 2006-04-25 | Ebara Corporation | Substrate holding device and polishing device |
US20030171076A1 (en) * | 2002-01-22 | 2003-09-11 | Moloney Gerard S. | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution |
US7357699B2 (en) * | 2003-02-10 | 2008-04-15 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
US20040175951A1 (en) * | 2003-03-07 | 2004-09-09 | Applied Materials, Inc. | Substrate carrier with a textured membrane |
US20050215182A1 (en) * | 2004-03-05 | 2005-09-29 | Strasbaugh | Wafer carrier with pressurized membrane and retaining ring actuator |
US20070063453A1 (en) * | 2004-03-25 | 2007-03-22 | Ibiden Co., Ltd. | Vacuum chuck and suction board |
USD553104S1 (en) | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
US20080070479A1 (en) * | 2004-11-01 | 2008-03-20 | Ebara Corporation | Polishing Apparatus |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD557226S1 (en) | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
US20090247057A1 (en) | 2005-09-14 | 2009-10-01 | Ebara Corporation | Polishing platen and polishing apparatus |
USD546784S1 (en) | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
US7402098B2 (en) * | 2006-10-27 | 2008-07-22 | Novellus Systems, Inc. | Carrier head for workpiece planarization/polishing |
US20080119119A1 (en) * | 2006-11-22 | 2008-05-22 | Applied Materials, Inc. | Carrier Ring for Carrier Head |
US8469776B2 (en) | 2006-11-22 | 2013-06-25 | Applied Materials, Inc. | Flexible membrane for carrier head |
US20090068934A1 (en) * | 2007-09-04 | 2009-03-12 | Samsung Electronics Co., Ltd. | Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same |
US20090111362A1 (en) * | 2007-10-29 | 2009-04-30 | Ebara Corporation | Polishing Apparatus |
USD649126S1 (en) | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
USD634719S1 (en) | 2009-08-27 | 2011-03-22 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD633452S1 (en) | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
US8932106B2 (en) * | 2010-09-08 | 2015-01-13 | Ebara Corporation | Polishing apparatus having thermal energy measuring means |
USD711330S1 (en) | 2010-12-28 | 2014-08-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD729753S1 (en) | 2010-12-28 | 2015-05-19 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
US8939817B2 (en) * | 2011-05-31 | 2015-01-27 | K.C. Tech Co., Ltd. | Membrane assembly and carrier head having the membrane assembly |
USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
US8859070B2 (en) | 2011-11-30 | 2014-10-14 | Ebara Corporation | Elastic membrane |
US9376752B2 (en) | 2012-04-06 | 2016-06-28 | Applied Materials, Inc. | Edge ring for a deposition chamber |
US20130316628A1 (en) * | 2012-05-23 | 2013-11-28 | Samsung Electronics Co., Ltd. | Flexible membranes for a polishing head |
US20160002788A1 (en) | 2013-02-21 | 2016-01-07 | Altatech Semiconductor | Chemical vapour deposition device |
US20140262193A1 (en) | 2013-03-13 | 2014-09-18 | Techest Co., Ltd. | Edge ring cooling module for semi-conductor manufacture chuck |
USD813180S1 (en) * | 2013-05-15 | 2018-03-20 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD769200S1 (en) | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770990S1 (en) | 2013-05-15 | 2016-11-08 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD808349S1 (en) | 2013-05-15 | 2018-01-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD783922S1 (en) | 2014-12-08 | 2017-04-11 | Entegris, Inc. | Wafer support ring |
USD767234S1 (en) | 2015-03-02 | 2016-09-20 | Entegris, Inc. | Wafer support ring |
USD797067S1 (en) | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
US20170009367A1 (en) * | 2015-07-09 | 2017-01-12 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
USD810705S1 (en) | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
USD859332S1 (en) * | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD1021832S1 (en) * | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
USD981969S1 (en) * | 2020-12-18 | 2023-03-28 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
Also Published As
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