USD674759S1 - Wafer carrier - Google Patents

Wafer carrier Download PDF

Info

Publication number
USD674759S1
USD674759S1 US29/385,727 US201129385727F USD674759S US D674759 S1 USD674759 S1 US D674759S1 US 201129385727 F US201129385727 F US 201129385727F US D674759 S USD674759 S US D674759S
Authority
US
United States
Prior art keywords
wafer carrier
view
elevational view
mirror image
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/385,727
Inventor
Chung-Ying Chang
Tzu-Ching Yang
Chia-Sheng Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201030290123.6F external-priority patent/CN301476433S/en
Application filed by Epistar Corp filed Critical Epistar Corp
Assigned to EPISTAR CORPORATION reassignment EPISTAR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, CHUNG-YING, YANG, TZU-CHING
Priority to US29/439,932 priority Critical patent/USD704155S1/en
Application granted granted Critical
Publication of USD674759S1 publication Critical patent/USD674759S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of the first embodiment showing the claimed design;
FIG. 2 is a front elevational view of FIG. 1;
FIG. 3 is a rear elevational view of FIG. 1;
FIG. 4 is a right side elevational view of FIG. 1, which is a mirror image of the left side elevational view;
FIG. 5 is a bottom plan view of FIG. 1, which is a mirror image of the top plan view;
FIG. 6 is a perspective view of the second embodiment showing the claimed design;
FIG. 7 is a front elevational view of FIG. 6;
FIG. 8 is a rear elevational view of FIG. 6;
FIG. 9 is a right side elevational view of FIG. 6, which is a mirror image of the left side elevational view;
FIG. 10 is a bottom plan view of FIG. 6, which is a mirror image of the top plan view;
FIG. 11 is a perspective view of the third embodiment showing the claimed design;
FIG. 12 is a front elevational view of FIG. 11;
FIG. 13 is a rear elevational view of FIG. 11;
FIG. 14 is a right side elevational view of FIG. 11, which is a mirror image of the left side elevational view;
FIG. 15 is a bottom plan view of FIG. 11, which is a mirror image of the top plan view;
FIG. 16 is a perspective view of the fourth embodiment showing the claimed design;
FIG. 17 is a front elevational view of FIG. 16;
FIG. 18 is a rear elevational view of FIG. 16;
FIG. 19 is a right side elevational view of FIG. 16, which is a mirror image of the left side elevational view;
FIG. 20 is a bottom plan view of FIG. 16, which is a mirror image of the top plan view;
FIG. 21 is a perspective view of the fifth embodiment showing the claimed design;
FIG. 22 is a front elevational view of FIG. 21;
FIG. 23 is a rear elevational view of FIG. 21;
FIG. 24 is a right side elevational view of FIG. 21, which is a mirror image of the left side elevational view;
FIG. 25 is a bottom plan view of FIG. 21, which is a mirror image of the top plan view;
FIG. 26 is a perspective view of the sixth embodiment showing the claimed design;
FIG. 27 is a front elevational view of FIG. 26;
FIG. 28 is a rear elevational view of FIG. 26;
FIG. 29 is a right side elevational view of FIG. 26, which is a mirror image of the left side elevational view; and,
FIG. 30 is a bottom plan view of FIG. 26, which is a mirror image of the top plan view.

Claims (1)

  1. The ornamental design for a “wafer carrier,” as shown and described.
US29/385,727 2010-08-19 2011-02-18 Wafer carrier Active USD674759S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/439,932 USD704155S1 (en) 2010-08-19 2012-12-17 Wafer carrier

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201030290123 2010-08-19
CN201030290123.6F CN301476433S (en) 2010-08-19 Wafer carrier

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/439,932 Continuation USD704155S1 (en) 2010-08-19 2012-12-17 Wafer carrier

Publications (1)

Publication Number Publication Date
USD674759S1 true USD674759S1 (en) 2013-01-22

Family

ID=47521999

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/385,727 Active USD674759S1 (en) 2010-08-19 2011-02-18 Wafer carrier
US29/439,932 Active USD704155S1 (en) 2010-08-19 2012-12-17 Wafer carrier

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/439,932 Active USD704155S1 (en) 2010-08-19 2012-12-17 Wafer carrier

Country Status (1)

Country Link
US (2) USD674759S1 (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD744967S1 (en) 2012-03-20 2015-12-08 Veeco Instruments Inc. Spindle key
USD748591S1 (en) 2012-03-20 2016-02-02 Veeco Instruments Inc. Keyed spindle
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
US9478697B2 (en) * 2014-11-11 2016-10-25 Applied Materials, Inc. Reusable substrate carrier
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD988300S1 (en) * 2021-03-09 2023-06-06 Thales Dis Ais Deutschland Gmbh IoT module
USD988299S1 (en) * 2021-06-18 2023-06-06 Telit Cinterion Deutschland Gmbh Cellular module
USD1009816S1 (en) * 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD744967S1 (en) 2012-03-20 2015-12-08 Veeco Instruments Inc. Spindle key
USD748591S1 (en) 2012-03-20 2016-02-02 Veeco Instruments Inc. Keyed spindle
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778851S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778850S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778852S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
US9478697B2 (en) * 2014-11-11 2016-10-25 Applied Materials, Inc. Reusable substrate carrier
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover

Also Published As

Publication number Publication date
USD704155S1 (en) 2014-05-06

Similar Documents

Publication Publication Date Title
USD674759S1 (en) Wafer carrier
USD651791S1 (en) Case for holding ear buds
USD642555S1 (en) Loudspeaker
USD722302S1 (en) Headphones
USD666015S1 (en) Chair
USD675915S1 (en) Package
USD650070S1 (en) Injector
USD637643S1 (en) Eyewear
USD635959S1 (en) Headphone
USD696518S1 (en) Toothbrush
USD675713S1 (en) Mister
USD651992S1 (en) Semiconductor substrate
USD654057S1 (en) Earphone earloop
USD694563S1 (en) Modular seat component
USD646783S1 (en) Tool
USD646311S1 (en) Field glass
USD661091S1 (en) Eyeglass holder
USD648374S1 (en) Payment terminal
USD650388S1 (en) Scanner
USD655144S1 (en) Wedging tool
USD671762S1 (en) Seat
USD658699S1 (en) Projector
USD717687S1 (en) Pendant
USD667017S1 (en) Facsimile
USD644140S1 (en) Ring