USD761745S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD761745S1 USD761745S1 US29/476,807 US201329476807F USD761745S US D761745 S1 USD761745 S1 US D761745S1 US 201329476807 F US201329476807 F US 201329476807F US D761745 S USD761745 S US D761745S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- ornamental design
- taken along
- along line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-014730 | 2013-06-28 | ||
JPD2013-14730F JP1493925S (en) | 2013-06-28 | 2013-06-28 | |
JPD2013-14732F JP1500107S (en) | 2013-06-28 | 2013-06-28 | |
JPD2013-14731F JP1493609S (en) | 2013-06-28 | 2013-06-28 | |
JP2013-014732 | 2013-06-28 | ||
JP2013-014731 | 2013-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD761745S1 true USD761745S1 (en) | 2016-07-19 |
Family
ID=56382044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/476,807 Active USD761745S1 (en) | 2013-06-28 | 2013-12-17 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
US (1) | USD761745S1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD778852S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD784937S1 (en) | 2014-11-13 | 2017-04-25 | Tokyo Electron Limited | Dummy wafer |
USD785576S1 (en) | 2014-11-13 | 2017-05-02 | Tokyo Electron Limited | Dummy wafer |
USD786810S1 (en) * | 2014-11-13 | 2017-05-16 | Tokyo Electron Limited | Dummy wafer |
US10383240B2 (en) | 2017-06-13 | 2019-08-13 | Honeywell International Inc. | Housing to retain integrated circuit package |
US10718640B2 (en) * | 2016-05-03 | 2020-07-21 | Continental Teves Ag & Co. Ohg | Sensor element for a motor vehicle |
USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
Citations (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2789344A (en) * | 1951-04-23 | 1957-04-23 | American Radiator & Standard | Method of cold shaping tubular steel articles and product |
US3579859A (en) * | 1968-02-02 | 1971-05-25 | Pierre Malenge | Design grid with variable guide |
USD273582S (en) * | 1981-09-08 | 1984-04-24 | Bolt William S | Holding pallet for PC boards |
USD273860S (en) * | 1981-09-08 | 1984-05-15 | Bolt William S | Holding pallet for PC boards |
USD390833S (en) * | 1996-09-09 | 1998-02-17 | Fujikura Ltd. | Piezolectric conversion type semiconductor device |
USD436085S1 (en) * | 1999-06-18 | 2001-01-09 | Fujikura, Ltd. | Piezoelectric conversion type semiconductor device |
US20020027762A1 (en) * | 1998-09-29 | 2002-03-07 | Shinji Yamaguchi | Electrostatic chuck |
US20020066693A1 (en) * | 2000-12-01 | 2002-06-06 | Jones Zhu | Coded tray for holding packaged semiconductor devices |
USD471167S1 (en) * | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
USD493152S1 (en) * | 2002-11-27 | 2004-07-20 | International Business Machines Corporation | Server blade chassis midplane printed circuit board with cover |
USD522471S1 (en) * | 2005-05-27 | 2006-06-06 | Danville Automation Holdings Llc | Funnel plate |
USD526972S1 (en) * | 2004-10-14 | 2006-08-22 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
US20070086189A1 (en) * | 2004-05-18 | 2007-04-19 | Onscreen Technologies, Inc. | LED Assembly with Vented Circuit Board |
USD554084S1 (en) * | 2005-10-31 | 2007-10-30 | Kabushiki Kaisha Toshiba | Portion of a semiconductor apparatus mounting-position accuracy measurement jig |
USD570307S1 (en) * | 2006-11-30 | 2008-06-03 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
USD576577S1 (en) * | 2006-11-30 | 2008-09-09 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
USD579885S1 (en) * | 2007-02-20 | 2008-11-04 | Tokyo Electron Limited | Upper heat insulating cylinder for manufacturing semiconductor wafers |
USD616395S1 (en) * | 2009-03-11 | 2010-05-25 | Tokyo Electron Limited | Support of wafer boat for manufacturing semiconductor wafers |
USD621804S1 (en) * | 2009-08-07 | 2010-08-17 | Hon Hai Precision Industry Co., Ltd. | PCB for arranging LED lights |
USD674759S1 (en) * | 2010-08-19 | 2013-01-22 | Epistar Corporation | Wafer carrier |
USD687788S1 (en) * | 2012-01-20 | 2013-08-13 | Lextar Electronics Corp. | Light emitting diode module |
USD692843S1 (en) * | 2012-05-02 | 2013-11-05 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD695241S1 (en) * | 2012-03-20 | 2013-12-10 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD705184S1 (en) * | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD712853S1 (en) * | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD724554S1 (en) * | 2014-02-19 | 2015-03-17 | Fuji Electric Co., Ltd. | Semiconductor module |
USD730304S1 (en) * | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD731990S1 (en) * | 2012-04-18 | 2015-06-16 | Nok Corporation | Integrated circuit tag |
-
2013
- 2013-12-17 US US29/476,807 patent/USD761745S1/en active Active
Patent Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2789344A (en) * | 1951-04-23 | 1957-04-23 | American Radiator & Standard | Method of cold shaping tubular steel articles and product |
US3579859A (en) * | 1968-02-02 | 1971-05-25 | Pierre Malenge | Design grid with variable guide |
USD273582S (en) * | 1981-09-08 | 1984-04-24 | Bolt William S | Holding pallet for PC boards |
USD273860S (en) * | 1981-09-08 | 1984-05-15 | Bolt William S | Holding pallet for PC boards |
USD390833S (en) * | 1996-09-09 | 1998-02-17 | Fujikura Ltd. | Piezolectric conversion type semiconductor device |
US20020027762A1 (en) * | 1998-09-29 | 2002-03-07 | Shinji Yamaguchi | Electrostatic chuck |
USD436085S1 (en) * | 1999-06-18 | 2001-01-09 | Fujikura, Ltd. | Piezoelectric conversion type semiconductor device |
US20020066693A1 (en) * | 2000-12-01 | 2002-06-06 | Jones Zhu | Coded tray for holding packaged semiconductor devices |
USD471167S1 (en) * | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
USD493152S1 (en) * | 2002-11-27 | 2004-07-20 | International Business Machines Corporation | Server blade chassis midplane printed circuit board with cover |
US20070086189A1 (en) * | 2004-05-18 | 2007-04-19 | Onscreen Technologies, Inc. | LED Assembly with Vented Circuit Board |
USD526972S1 (en) * | 2004-10-14 | 2006-08-22 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
USD522471S1 (en) * | 2005-05-27 | 2006-06-06 | Danville Automation Holdings Llc | Funnel plate |
USD554084S1 (en) * | 2005-10-31 | 2007-10-30 | Kabushiki Kaisha Toshiba | Portion of a semiconductor apparatus mounting-position accuracy measurement jig |
USD570307S1 (en) * | 2006-11-30 | 2008-06-03 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
USD576577S1 (en) * | 2006-11-30 | 2008-09-09 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
USD579885S1 (en) * | 2007-02-20 | 2008-11-04 | Tokyo Electron Limited | Upper heat insulating cylinder for manufacturing semiconductor wafers |
USD616395S1 (en) * | 2009-03-11 | 2010-05-25 | Tokyo Electron Limited | Support of wafer boat for manufacturing semiconductor wafers |
USD621804S1 (en) * | 2009-08-07 | 2010-08-17 | Hon Hai Precision Industry Co., Ltd. | PCB for arranging LED lights |
USD674759S1 (en) * | 2010-08-19 | 2013-01-22 | Epistar Corporation | Wafer carrier |
USD704155S1 (en) * | 2010-08-19 | 2014-05-06 | Epistar Corporation | Wafer carrier |
USD701843S1 (en) * | 2010-12-28 | 2014-04-01 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD737230S1 (en) * | 2010-12-28 | 2015-08-25 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD737229S1 (en) * | 2010-12-28 | 2015-08-25 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD687788S1 (en) * | 2012-01-20 | 2013-08-13 | Lextar Electronics Corp. | Light emitting diode module |
USD695241S1 (en) * | 2012-03-20 | 2013-12-10 | Veeco Instruments Inc. | Wafer carrier having pockets |
USD731990S1 (en) * | 2012-04-18 | 2015-06-16 | Nok Corporation | Integrated circuit tag |
USD692843S1 (en) * | 2012-05-02 | 2013-11-05 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
USD712853S1 (en) * | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721340S1 (en) * | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
USD721048S1 (en) * | 2013-06-17 | 2015-01-13 | Fuji Electric Co., Ltd. | Semiconductor module |
USD705184S1 (en) * | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD724554S1 (en) * | 2014-02-19 | 2015-03-17 | Fuji Electric Co., Ltd. | Semiconductor module |
USD730304S1 (en) * | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD778852S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD778851S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD778850S1 (en) * | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD784937S1 (en) | 2014-11-13 | 2017-04-25 | Tokyo Electron Limited | Dummy wafer |
USD785576S1 (en) | 2014-11-13 | 2017-05-02 | Tokyo Electron Limited | Dummy wafer |
USD786810S1 (en) * | 2014-11-13 | 2017-05-16 | Tokyo Electron Limited | Dummy wafer |
US10718640B2 (en) * | 2016-05-03 | 2020-07-21 | Continental Teves Ag & Co. Ohg | Sensor element for a motor vehicle |
US10383240B2 (en) | 2017-06-13 | 2019-08-13 | Honeywell International Inc. | Housing to retain integrated circuit package |
USD893438S1 (en) * | 2017-08-21 | 2020-08-18 | Tokyo Electron Limited | Wafer boat |
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