USD704155S1 - Wafer carrier - Google Patents

Wafer carrier Download PDF

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Publication number
USD704155S1
USD704155S1 US29/439,932 US201229439932F USD704155S US D704155 S1 USD704155 S1 US D704155S1 US 201229439932 F US201229439932 F US 201229439932F US D704155 S USD704155 S US D704155S
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US
United States
Prior art keywords
wafer carrier
view
elevational view
wafer
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/439,932
Inventor
Chung-Ying Chang
Tzu-Ching Yang
Chia-Sheng Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201030290123.6F external-priority patent/CN301476433S/en
Application filed by Epistar Corp filed Critical Epistar Corp
Priority to US29/439,932 priority Critical patent/USD704155S1/en
Assigned to EPISTAR CORPORATION reassignment EPISTAR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, CHIA-SHENG, CHANG, CHUNG-YING, YANG, TZU-CHING
Application granted granted Critical
Publication of USD704155S1 publication Critical patent/USD704155S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a wafer carrier showing the claimed design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof, which is a mirror image of the left side elevational view; and,
FIG. 5 is a bottom plan view thereof, which is a mirror image of the top plan view.
The broken lines are directed to environment and are provided for illustrative purpose only; the broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a wafer carrier, as shown and described.
US29/439,932 2010-08-19 2012-12-17 Wafer carrier Active USD704155S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/439,932 USD704155S1 (en) 2010-08-19 2012-12-17 Wafer carrier

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201030290123.6F CN301476433S (en) 2010-08-19 Wafer carrier
US29/385,727 USD674759S1 (en) 2010-08-19 2011-02-18 Wafer carrier
US29/439,932 USD704155S1 (en) 2010-08-19 2012-12-17 Wafer carrier

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/385,727 Continuation USD674759S1 (en) 2010-08-19 2011-02-18 Wafer carrier

Publications (1)

Publication Number Publication Date
USD704155S1 true USD704155S1 (en) 2014-05-06

Family

ID=47521999

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/385,727 Active USD674759S1 (en) 2010-08-19 2011-02-18 Wafer carrier
US29/439,932 Active USD704155S1 (en) 2010-08-19 2012-12-17 Wafer carrier

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/385,727 Active USD674759S1 (en) 2010-08-19 2011-02-18 Wafer carrier

Country Status (1)

Country Link
US (2) USD674759S1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD988300S1 (en) * 2021-03-09 2023-06-06 Thales Dis Ais Deutschland Gmbh IoT module
USD988299S1 (en) * 2021-06-18 2023-06-06 Telit Cinterion Deutschland Gmbh Cellular module
USD1009816S1 (en) * 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD712852S1 (en) 2012-03-20 2014-09-09 Veeco Instruments Inc. Spindle key
USD726133S1 (en) 2012-03-20 2015-04-07 Veeco Instruments Inc. Keyed spindle
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
US9478697B2 (en) * 2014-11-11 2016-10-25 Applied Materials, Inc. Reusable substrate carrier
USD1026297S1 (en) * 2022-07-15 2024-05-07 Dandan Tan Set of lenses

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD761745S1 (en) * 2013-06-28 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor device
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD778851S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778850S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD778852S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD784937S1 (en) 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) * 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD852762S1 (en) * 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD904355S1 (en) 2015-12-11 2020-12-08 Gemalto M2M Gmbh Radio module
USD893438S1 (en) * 2017-08-21 2020-08-18 Tokyo Electron Limited Wafer boat
USD860146S1 (en) * 2017-11-30 2019-09-17 Veeco Instruments Inc. Wafer carrier with a 33-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD863239S1 (en) * 2018-03-26 2019-10-15 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD866491S1 (en) * 2018-03-26 2019-11-12 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD860147S1 (en) * 2018-03-26 2019-09-17 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD858469S1 (en) * 2018-03-26 2019-09-03 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD937232S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device
USD938925S1 (en) * 2019-10-24 2021-12-21 Nuvoton Technology Corporation Japan Semiconductor device
USD988300S1 (en) * 2021-03-09 2023-06-06 Thales Dis Ais Deutschland Gmbh IoT module
USD988299S1 (en) * 2021-06-18 2023-06-06 Telit Cinterion Deutschland Gmbh Cellular module
USD1009816S1 (en) * 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Also Published As

Publication number Publication date
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