USD793972S1 - Wafer carrier with a 31-pocket configuration - Google Patents

Wafer carrier with a 31-pocket configuration Download PDF

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Publication number
USD793972S1
USD793972S1 US29/522,214 US201529522214F USD793972S US D793972 S1 USD793972 S1 US D793972S1 US 201529522214 F US201529522214 F US 201529522214F US D793972 S USD793972 S US D793972S
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US
United States
Prior art keywords
wafer carrier
pocket configuration
pocket
design
new design
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Active
Application number
US29/522,214
Inventor
Sandeep Krishnan
Keng Moy
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Veeco Instruments Inc
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Veeco Instruments Inc
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Publication date
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Priority to US29/522,214 priority Critical patent/USD793972S1/en
Assigned to VEECO INSTRUMENTS INC. reassignment VEECO INSTRUMENTS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KRISHNAN, SANDEEP
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Description

FIG. 1 is a perspective view of a wafer carrier with a 31-pocket configuration according to the new design of the first embodiment.

FIG. 2 is a top plan view of a wafer carrier with a 31-pocket configuration according to the new design thereof.

FIG. 3 is a right side view of a wafer carrier with a 31-pocket configuration according to the new design, with the left side, front, and rear views being the same as the right side view thereof.

FIG. 4 is a bottom plan view of a wafer carrier with a 31-pocket configuration according to the new design thereof.

FIG. 5 is a perspective view of a wafer carrier with a 31-pocket configuration according to the new design of the second embodiment.

FIG. 6 is a right side view of a wafer carrier with a 31-pocket configuration according to the new design, with the left side, front, and rear views being the same as the right side view thereof.

FIG. 7 is a bottom plan view of a wafer carrier with a 31-pocket configuration according to the new design thereof; and,

FIG. 8 is a detail view of a portion of the wafer carrier with a 31-pocket configuration shown in FIG. 1 according to the new design showing a single pocket from a perspective view of the first embodiment.

The broken lines, where present, in FIGS. 1, 2, 3, 4, and 8, illustrate portions of the wafer carrier with a 31-pocket configuration that represent environment of the claimed design and form no part of the claimed design. The broken lines of FIG. 1 that define the area corresponding to the enlarged portion shown in FIG. 8 form no part of the claimed design. The broken lines in FIG. 8 that represent the edge of the enlarged portion of the design form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a wafer carrier with a 31-pocket configuration, as shown and described.
US29/522,214 2015-03-27 2015-03-27 Wafer carrier with a 31-pocket configuration Active USD793972S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/522,214 USD793972S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 31-pocket configuration

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US29/522,214 USD793972S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 31-pocket configuration
TW105205249U TWM531052U (en) 2015-03-27 2015-09-25 Wafer carrier with a 31-pocket configuration
DE202015006764.6U DE202015006764U1 (en) 2015-03-27 2015-09-25 Wafer carrier having a configuration with pockets 31
JPD2015-21231F JP1545629S (en) 2015-03-27 2015-09-28
KR2020150006434U KR20160003441U (en) 2015-03-27 2015-09-30 Wafer carrier with a 31-pocket configuration

Publications (1)

Publication Number Publication Date
USD793972S1 true USD793972S1 (en) 2017-08-08

Family

ID=55312602

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/522,214 Active USD793972S1 (en) 2015-03-27 2015-03-27 Wafer carrier with a 31-pocket configuration

Country Status (5)

Country Link
US (1) USD793972S1 (en)
JP (1) JP1545629S (en)
KR (1) KR20160003441U (en)
DE (1) DE202015006764U1 (en)
TW (1) TWM531052U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD813228S1 (en) * 2016-10-04 2018-03-20 Amazon Technologies, Inc. Electronic device
USD820254S1 (en) * 2017-03-03 2018-06-12 Amazon Technologies, Inc. Electronic device
USD837479S1 (en) * 2017-07-26 2019-01-01 Coincard Llc Coin card device
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD854506S1 (en) * 2018-03-26 2019-07-23 Veeco Instruments Inc. Chemical vapor deposition wafer carrier with thermal cover

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