USD748593S1 - Boat for use in a material deposition apparatus - Google Patents

Boat for use in a material deposition apparatus Download PDF

Info

Publication number
USD748593S1
USD748593S1 US29/484,067 US201429484067F USD748593S US D748593 S1 USD748593 S1 US D748593S1 US 201429484067 F US201429484067 F US 201429484067F US D748593 S USD748593 S US D748593S
Authority
US
United States
Prior art keywords
boat
deposition apparatus
material deposition
view
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/484,067
Inventor
James Dempster
Jason Maynard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HZO Inc
Original Assignee
HZO Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HZO Inc filed Critical HZO Inc
Priority to US29/484,067 priority Critical patent/USD748593S1/en
Assigned to HZO, INC. reassignment HZO, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DEMPSTER, JAMES, MAYNARD, JASON
Priority to US14/634,034 priority patent/US20150167151A1/en
Application granted granted Critical
Publication of USD748593S1 publication Critical patent/USD748593S1/en
Assigned to PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) reassignment PACIFIC WESTERN BANK (AS SUCCESSOR IN INTEREST BY MERGER TO SQUARE 1 BANK) SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
Assigned to HZO, INC. reassignment HZO, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: PACIFIC WESTERN BANK
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO, INC.
Assigned to CATHAY BANK reassignment CATHAY BANK SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HZO HONG KONG LIMITED, HZO, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a perspective view of a boat for use in a material deposition apparatus showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side view thereof;
FIG. 4 is another side view thereof;
FIG. 5 is another side view thereof;
FIG. 6 is another side view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a perspective view thereof shown in a used condition, with a cup partially removed from the carriage;
FIG. 9 is another perspective view thereof in a used condition, with a cup completely removed from the carriage;
FIG. 10 is a top plan view of FIG. 9;
FIG. 11 is a perspective view of the removed cup in FIG. 8, shown separately for ease of illustration;
FIG. 12 is a top plan view of FIG. 11;
FIG. 13 is a side view of FIG. 11; and,
FIG. 14 is a bottom view of FIG. 11.
Broken lines are used in the drawings to illustrate environment. The features illustrated in broken lines form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a boat for use in a material deposition apparatus, as shown and described.
US29/484,067 2012-01-10 2014-03-05 Boat for use in a material deposition apparatus Active USD748593S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/484,067 USD748593S1 (en) 2014-03-05 2014-03-05 Boat for use in a material deposition apparatus
US14/634,034 US20150167151A1 (en) 2012-01-10 2015-02-27 Carrier systems for introducing materials into material processing systems

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/484,067 USD748593S1 (en) 2014-03-05 2014-03-05 Boat for use in a material deposition apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/737,737 Continuation-In-Part US9156055B2 (en) 2012-01-10 2013-01-09 Precursor supplies, material processing systems with which precursor supplies are configured to be used and associated methods

Publications (1)

Publication Number Publication Date
USD748593S1 true USD748593S1 (en) 2016-02-02

Family

ID=55175339

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/484,067 Active USD748593S1 (en) 2012-01-10 2014-03-05 Boat for use in a material deposition apparatus

Country Status (1)

Country Link
US (1) USD748593S1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
US7115984B2 (en) * 2002-06-18 2006-10-03 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD570308S1 (en) * 2006-05-01 2008-06-03 Tokyo Electron Limited Wafer boat
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
US20090247057A1 (en) * 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD361752S (en) * 1993-09-17 1995-08-29 Tokyo Electron Kasbushiki Kaisha Wafer boat or rack for holding semiconductor wafers
USD380454S (en) * 1995-05-30 1997-07-01 Tokyo Electron Limited Wafer boat
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
US6341935B1 (en) * 2000-06-14 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer boat having improved wafer holding capability
US7115984B2 (en) * 2002-06-18 2006-10-03 Micron Technology, Inc. Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US20090247057A1 (en) * 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
USD570308S1 (en) * 2006-05-01 2008-06-03 Tokyo Electron Limited Wafer boat
USD580894S1 (en) * 2006-05-01 2008-11-18 Tokyo Electron Limited Wafer boat
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD616394S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
USD655255S1 (en) * 2010-06-18 2012-03-06 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD655682S1 (en) * 2010-06-18 2012-03-13 Hitachi Kokusai Electric Inc. Boat of wafer processing apparatus
USD674759S1 (en) * 2010-08-19 2013-01-22 Epistar Corporation Wafer carrier
USD704155S1 (en) * 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD684551S1 (en) * 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD686582S1 (en) * 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
USD793972S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD778247S1 (en) * 2015-04-16 2017-02-07 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration

Similar Documents

Publication Publication Date Title
USD721920S1 (en) Beverage container
USD740106S1 (en) Tie down holder
USD830168S1 (en) Container
USD739685S1 (en) Spoon
USD780601S1 (en) Container
USD752436S1 (en) Disposable cup lid
USD762412S1 (en) Lid for water container
USD722826S1 (en) Beverage container
USD767332S1 (en) Impeller for mixer
USD732978S1 (en) Container
USD803675S1 (en) Receptacle
USD779975S1 (en) Container
USD769719S1 (en) Container
USD769769S1 (en) Round gemstone
USD760180S1 (en) Hexcell channel arrangement for use in a boat for a deposition apparatus
USD720967S1 (en) Muddler stick
USD779974S1 (en) Container
USD764376S1 (en) Marine vessel
USD742218S1 (en) Container
USD734688S1 (en) Plant container
USD787945S1 (en) Bottle
USD776760S1 (en) Fountain pen
USD745345S1 (en) Slice and sharpen for cutting board
USD761042S1 (en) Multi-purpose adjustable retaining device
USD717585S1 (en) Cookware vessel