USD600221S1 - Wafer boat - Google Patents

Wafer boat Download PDF

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Publication number
USD600221S1
USD600221S1 US29/309,699 US30969908F USD600221S US D600221 S1 USD600221 S1 US D600221S1 US 30969908 F US30969908 F US 30969908F US D600221 S USD600221 S US D600221S
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US
United States
Prior art keywords
wafer boat
view
wafer
boat
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/309,699
Inventor
Izumi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SATO, IZUMI
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Publication of USD600221S1 publication Critical patent/USD600221S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front view;
FIG. 2 is a partial enlarged perspective view of a bottom along 22 of the frontal view shown in FIG. 1;
FIG. 3 is a rear view;
FIG. 4 is a left side view the right side being a mirror image thereof;
FIG. 5 is a plan view;
FIG. 6 is a bottom view;
FIG. 7 is an enlarged bottom view; and,
FIG. 8 is a partially enlarged sectional view, along 22 of the front view shown in FIG. 1 and line 88 of the bottom view shown in FIG. 6, of the wafer boat in use.
Salients are formed on the bottom board of a wafer boat to get into reentrants of a heat insulating cylinder for manufacturing a semiconductor wafer, and prevent it from falling down in a setting condition. The portion shown in solid lines is my claimed design. The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

  1. The ornamental design for a wafer boat, as shown and described.
US29/309,699 2008-03-28 2008-09-26 Wafer boat Expired - Lifetime USD600221S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008007855 2008-03-28

Publications (1)

Publication Number Publication Date
USD600221S1 true USD600221S1 (en) 2009-09-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/309,699 Expired - Lifetime USD600221S1 (en) 2008-03-28 2008-09-26 Wafer boat

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US (1) USD600221S1 (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
USD769201S1 (en) * 2014-11-20 2016-10-18 Tokyo Electron Limited Wafer boat
USD772183S1 (en) * 2014-11-20 2016-11-22 Tokyo Electron Limited Wafer boat
USD789310S1 (en) * 2014-11-20 2017-06-13 Tokyo Electron Limited Wafer boat
USD791721S1 (en) * 2014-11-20 2017-07-11 Tokyo Electron Limited Wafer boat
US10167571B2 (en) 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
US20220254668A1 (en) * 2021-02-08 2022-08-11 Asm Ip Holding B.V. Wafer boat

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10316412B2 (en) 2012-04-18 2019-06-11 Veeco Instruments Inc. Wafter carrier for chemical vapor deposition systems
USD734730S1 (en) * 2012-12-27 2015-07-21 Hitachi Kokusai Electric Inc. Boat of substrate processing apparatus
US10167571B2 (en) 2013-03-15 2019-01-01 Veeco Instruments Inc. Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems
USD739831S1 (en) * 2013-03-22 2015-09-29 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD740769S1 (en) * 2013-03-22 2015-10-13 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD737785S1 (en) * 2013-07-29 2015-09-01 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD738329S1 (en) * 2013-07-29 2015-09-08 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD747279S1 (en) * 2013-07-29 2016-01-12 Hitachi Kokusai Electric Inc. Boat for substrate processing apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD763807S1 (en) * 2014-05-22 2016-08-16 Hzo, Inc. Boat for a deposition apparatus
USD789310S1 (en) * 2014-11-20 2017-06-13 Tokyo Electron Limited Wafer boat
USD791721S1 (en) * 2014-11-20 2017-07-11 Tokyo Electron Limited Wafer boat
USD772183S1 (en) * 2014-11-20 2016-11-22 Tokyo Electron Limited Wafer boat
USD769201S1 (en) * 2014-11-20 2016-10-18 Tokyo Electron Limited Wafer boat
USD839219S1 (en) * 2016-02-12 2019-01-29 Kokusai Electric Corporation Boat for substrate processing apparatus
USD846514S1 (en) * 2018-05-03 2019-04-23 Kokusai Electric Corporation Boat of substrate processing apparatus
USD847105S1 (en) * 2018-05-03 2019-04-30 Kokusai Electric Corporation Boat of substrate processing apparatus
USD908103S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD908102S1 (en) * 2019-02-20 2021-01-19 Veeco Instruments Inc. Transportable semiconductor wafer rack
USD939459S1 (en) * 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD928732S1 (en) * 2020-03-20 2021-08-24 Yubico Ab Bezel for attaching sensor to a printed circuit board in a security key
US20220254668A1 (en) * 2021-02-08 2022-08-11 Asm Ip Holding B.V. Wafer boat
US11869786B2 (en) * 2021-02-08 2024-01-09 Asm Ip Holding B.V. Wafer boat

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