USD627316S1 - Heater board enclosure - Google Patents
Heater board enclosure Download PDFInfo
- Publication number
- USD627316S1 USD627316S1 US29/330,441 US33044109F USD627316S US D627316 S1 USD627316 S1 US D627316S1 US 33044109 F US33044109 F US 33044109F US D627316 S USD627316 S US D627316S
- Authority
- US
- United States
- Prior art keywords
- heater board
- board enclosure
- enclosure
- heater
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines showing portions of the heater board enclosure are shown for illustrative purpose only and forms no part of the claimed design.
Claims (1)
- The ornamental design for the heater board enclosure, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/330,441 USD627316S1 (en) | 2009-01-07 | 2009-01-07 | Heater board enclosure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/330,441 USD627316S1 (en) | 2009-01-07 | 2009-01-07 | Heater board enclosure |
Publications (1)
Publication Number | Publication Date |
---|---|
USD627316S1 true USD627316S1 (en) | 2010-11-16 |
Family
ID=43066279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/330,441 Active USD627316S1 (en) | 2009-01-07 | 2009-01-07 | Heater board enclosure |
Country Status (1)
Country | Link |
---|---|
US (1) | USD627316S1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120106070A1 (en) * | 2010-11-02 | 2012-05-03 | Trevor Landon | Field serviceable cpu module |
US20120120594A1 (en) * | 2010-11-12 | 2012-05-17 | Tien-Sheng Huang | Heat dissipating casing structure for main board |
USD857862S1 (en) * | 2016-11-29 | 2019-08-27 | TSI Products, Inc. | Air conditioning housing |
USD884856S1 (en) * | 2016-12-30 | 2020-05-19 | Marine Canada Acquisition Inc. | Heater |
USD951194S1 (en) * | 2019-12-03 | 2022-05-10 | Fuji Corporation | Head for an atmospheric pressure plasma equipment |
-
2009
- 2009-01-07 US US29/330,441 patent/USD627316S1/en active Active
Non-Patent Citations (1)
Title |
---|
EFD ProcessMate 6500 Temperature Control Unit brochure. |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120106070A1 (en) * | 2010-11-02 | 2012-05-03 | Trevor Landon | Field serviceable cpu module |
US8537540B2 (en) * | 2010-11-02 | 2013-09-17 | Technology Advancement Group, Inc. | Field serviceable CPU module |
US20120120594A1 (en) * | 2010-11-12 | 2012-05-17 | Tien-Sheng Huang | Heat dissipating casing structure for main board |
USD857862S1 (en) * | 2016-11-29 | 2019-08-27 | TSI Products, Inc. | Air conditioning housing |
USD884856S1 (en) * | 2016-12-30 | 2020-05-19 | Marine Canada Acquisition Inc. | Heater |
USD951194S1 (en) * | 2019-12-03 | 2022-05-10 | Fuji Corporation | Head for an atmospheric pressure plasma equipment |
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