USD1021832S1 - Elastic membrane - Google Patents

Elastic membrane Download PDF

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Publication number
USD1021832S1
USD1021832S1 US29/874,375 US202329874375F USD1021832S US D1021832 S1 USD1021832 S1 US D1021832S1 US 202329874375 F US202329874375 F US 202329874375F US D1021832 S USD1021832 S US D1021832S
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United States
Prior art keywords
elastic membrane
view
elastic
membrane
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/874,375
Inventor
Kenichi AKAZAWA
Osamu Nabeya
Shingo Togashi
Satoru Yamaki
Tomoko OWADA
Cheng Cheng
Yuichi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020019864F external-priority patent/JP1683320S/en
Priority claimed from JP2020019863F external-priority patent/JP1683319S/en
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US29/874,375 priority Critical patent/USD1021832S1/en
Application granted granted Critical
Publication of USD1021832S1 publication Critical patent/USD1021832S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top perspective view of an elastic membrane showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front view thereof, a rear view being identical thereto;
FIG. 6 is a right-side view thereof, a left-side view being identical thereto;
FIG. 7 is a cross sectional view taken along section line 7-7 in FIG. 3 ; and,
FIG. 8 is an enlarged portion view taken along line 8-8 in FIG. 7 .
The broken lines in the drawings depict portions of the elastic membrane that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an elastic membrane, as shown and described.
US29/874,375 2020-09-17 2023-04-19 Elastic membrane Active USD1021832S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/874,375 USD1021832S1 (en) 2020-09-17 2023-04-19 Elastic membrane

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2020-019863D 2020-09-17
JP2020019864F JP1683320S (en) 2020-09-17 2020-09-17 Elastic film for polishing semiconductor wafers
JP2020-019864D 2020-09-17
JP2020019863F JP1683319S (en) 2020-09-17 2020-09-17 Elastic film for polishing semiconductor wafers
US29/774,336 USD989012S1 (en) 2020-09-17 2021-03-16 Elastic membrane
US29/874,375 USD1021832S1 (en) 2020-09-17 2023-04-19 Elastic membrane

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/774,336 Division USD989012S1 (en) 2020-09-17 2021-03-16 Elastic membrane

Publications (1)

Publication Number Publication Date
USD1021832S1 true USD1021832S1 (en) 2024-04-09

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ID=86670967

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US29/774,336 Active USD989012S1 (en) 2020-09-17 2021-03-16 Elastic membrane
US29/874,375 Active USD1021832S1 (en) 2020-09-17 2023-04-19 Elastic membrane

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US29/774,336 Active USD989012S1 (en) 2020-09-17 2021-03-16 Elastic membrane

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US (2) USD989012S1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1010415S1 (en) * 2021-10-27 2024-01-09 Mirka Ltd Backing pad for sander

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USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US20180301367A1 (en) 2017-04-12 2018-10-18 Ebara Corporation Elastic membrane, substrate holding device, and polishing apparatus
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USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD840364S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
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USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
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USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
USD921431S1 (en) * 2019-04-01 2021-06-08 Veeco Instruments, Inc. Multi-filament heater assembly
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD939459S1 (en) 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD947144S1 (en) 2019-05-10 2022-03-29 Tdk Corporation Vibration element for a haptic actuator
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD949116S1 (en) 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors

Patent Citations (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3627338A (en) * 1969-10-09 1971-12-14 Sheldon Thompson Vacuum chuck
USD312126S (en) * 1988-02-10 1990-11-13 Redring Electric Limited Electric heater element for use in a radiant heater for a glass ceramic hob
USD323385S (en) * 1990-02-10 1992-01-21 Ceramaspeed Limited Radiant stove heater
USD517743S1 (en) * 2003-12-09 2006-03-21 Le Creuset Of America, Inc. Hotpad
USD541486S1 (en) * 2005-07-22 2007-04-24 Le Creuset Of America, Inc. Hotpad
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD650344S1 (en) * 2008-10-20 2011-12-13 Ebara Corporation Vacuum contact pad
USD625558S1 (en) * 2010-02-05 2010-10-19 Chef'n Corporation Trivet
USD793976S1 (en) 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD832023S1 (en) * 2015-10-27 2018-10-30 Meyer Intellectual Properties Limited Circular grill pan
USD819580S1 (en) 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
USD826185S1 (en) * 2016-10-14 2018-08-21 Hitachi Kokusai Electric Inc. Ceiling heater for substrate processing apparatus
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD913977S1 (en) * 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD859331S1 (en) * 2017-03-31 2019-09-10 Ebara Corporation Vacuum contact pad
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US20180301367A1 (en) 2017-04-12 2018-10-18 Ebara Corporation Elastic membrane, substrate holding device, and polishing apparatus
USD894137S1 (en) * 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20190375070A1 (en) 2018-05-21 2019-12-12 Ebara Corporation Substrate holding apparatus, substrate polishing apparatus, elastic member, and manufacturing method of substrate holding apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
USD958764S1 (en) 2019-01-17 2022-07-26 Asm Ip Holding B.V. Higher temperature vented susceptor
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD921431S1 (en) * 2019-04-01 2021-06-08 Veeco Instruments, Inc. Multi-filament heater assembly
USD949116S1 (en) 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD947144S1 (en) 2019-05-10 2022-03-29 Tdk Corporation Vibration element for a haptic actuator
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD918848S1 (en) * 2019-07-18 2021-05-11 Kokusai Electric Corporation Retainer of ceiling heater for semiconductor fabrication apparatus
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal
USD939459S1 (en) 2019-08-07 2021-12-28 Kokusai Electric Corporation Boat for wafer processing apparatus
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD933726S1 (en) 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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SV Tech Parts; Retrieved on Nov. 1, 2022, retrieved from internet, http://www.svtechparts.com/index.php/high-tech/semiconductor-equipment/ebara-cmp-polishing-head-from-ebara-cmp-epo-113-system.html.
SV Tech Parts—No Announcement Date [online], retrieved on Nov. 1, 2022, retrieved from internet, http://www.svtechparts.com/index.php/high-tech/semiconductor-equipment/ebara-cmp-polishing-head-from-ebara-cmp-epo-113-system.html (Year: 2023). *
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