USD1021832S1 - Elastic membrane - Google Patents
Elastic membrane Download PDFInfo
- Publication number
- USD1021832S1 USD1021832S1 US29/874,375 US202329874375F USD1021832S US D1021832 S1 USD1021832 S1 US D1021832S1 US 202329874375 F US202329874375 F US 202329874375F US D1021832 S USD1021832 S US D1021832S
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- US
- United States
- Prior art keywords
- elastic membrane
- view
- elastic
- membrane
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000012528 membrane Substances 0.000 title claims description 4
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Description
The broken lines in the drawings depict portions of the elastic membrane that form no part of the claimed design.
Claims (1)
- The ornamental design for an elastic membrane, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/874,375 USD1021832S1 (en) | 2020-09-17 | 2023-04-19 | Elastic membrane |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020-019863D | 2020-09-17 | ||
JP2020019864F JP1683320S (en) | 2020-09-17 | 2020-09-17 | Elastic film for polishing semiconductor wafers |
JP2020-019864D | 2020-09-17 | ||
JP2020019863F JP1683319S (en) | 2020-09-17 | 2020-09-17 | Elastic film for polishing semiconductor wafers |
US29/774,336 USD989012S1 (en) | 2020-09-17 | 2021-03-16 | Elastic membrane |
US29/874,375 USD1021832S1 (en) | 2020-09-17 | 2023-04-19 | Elastic membrane |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/774,336 Division USD989012S1 (en) | 2020-09-17 | 2021-03-16 | Elastic membrane |
Publications (1)
Publication Number | Publication Date |
---|---|
USD1021832S1 true USD1021832S1 (en) | 2024-04-09 |
Family
ID=86670967
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/774,336 Active USD989012S1 (en) | 2020-09-17 | 2021-03-16 | Elastic membrane |
US29/874,375 Active USD1021832S1 (en) | 2020-09-17 | 2023-04-19 | Elastic membrane |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/774,336 Active USD989012S1 (en) | 2020-09-17 | 2021-03-16 | Elastic membrane |
Country Status (1)
Country | Link |
---|---|
US (2) | USD989012S1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1010415S1 (en) * | 2021-10-27 | 2024-01-09 | Mirka Ltd | Backing pad for sander |
Citations (44)
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---|---|---|---|---|
US3627338A (en) * | 1969-10-09 | 1971-12-14 | Sheldon Thompson | Vacuum chuck |
USD312126S (en) * | 1988-02-10 | 1990-11-13 | Redring Electric Limited | Electric heater element for use in a radiant heater for a glass ceramic hob |
USD323385S (en) * | 1990-02-10 | 1992-01-21 | Ceramaspeed Limited | Radiant stove heater |
USD517743S1 (en) * | 2003-12-09 | 2006-03-21 | Le Creuset Of America, Inc. | Hotpad |
USD541486S1 (en) * | 2005-07-22 | 2007-04-24 | Le Creuset Of America, Inc. | Hotpad |
USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
USD625558S1 (en) * | 2010-02-05 | 2010-10-19 | Chef'n Corporation | Trivet |
USD650344S1 (en) * | 2008-10-20 | 2011-12-13 | Ebara Corporation | Vacuum contact pad |
USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD793976S1 (en) | 2013-05-15 | 2017-08-08 | Ebara Corporation | Substrate retaining ring |
USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD819580S1 (en) | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD826185S1 (en) * | 2016-10-14 | 2018-08-21 | Hitachi Kokusai Electric Inc. | Ceiling heater for substrate processing apparatus |
USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
US20180301367A1 (en) | 2017-04-12 | 2018-10-18 | Ebara Corporation | Elastic membrane, substrate holding device, and polishing apparatus |
USD832023S1 (en) * | 2015-10-27 | 2018-10-30 | Meyer Intellectual Properties Limited | Circular grill pan |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD840364S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
USD862404S1 (en) * | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US20190375070A1 (en) | 2018-05-21 | 2019-12-12 | Ebara Corporation | Substrate holding apparatus, substrate polishing apparatus, elastic member, and manufacturing method of substrate holding apparatus |
USD894137S1 (en) * | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD918848S1 (en) * | 2019-07-18 | 2021-05-11 | Kokusai Electric Corporation | Retainer of ceiling heater for semiconductor fabrication apparatus |
USD920936S1 (en) | 2019-01-17 | 2021-06-01 | Asm Ip Holding B.V. | Higher temperature vented susceptor |
USD921431S1 (en) * | 2019-04-01 | 2021-06-08 | Veeco Instruments, Inc. | Multi-filament heater assembly |
USD931240S1 (en) | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
USD933033S1 (en) | 2018-10-12 | 2021-10-12 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD933726S1 (en) | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD939459S1 (en) | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD947144S1 (en) | 2019-05-10 | 2022-03-29 | Tdk Corporation | Vibration element for a haptic actuator |
USD947914S1 (en) | 2020-11-23 | 2022-04-05 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
USD949116S1 (en) | 2019-05-03 | 2022-04-19 | Lumileds Holding B.V. | Flexible circuit board with connectors |
-
2021
- 2021-03-16 US US29/774,336 patent/USD989012S1/en active Active
-
2023
- 2023-04-19 US US29/874,375 patent/USD1021832S1/en active Active
Patent Citations (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3627338A (en) * | 1969-10-09 | 1971-12-14 | Sheldon Thompson | Vacuum chuck |
USD312126S (en) * | 1988-02-10 | 1990-11-13 | Redring Electric Limited | Electric heater element for use in a radiant heater for a glass ceramic hob |
USD323385S (en) * | 1990-02-10 | 1992-01-21 | Ceramaspeed Limited | Radiant stove heater |
USD517743S1 (en) * | 2003-12-09 | 2006-03-21 | Le Creuset Of America, Inc. | Hotpad |
USD541486S1 (en) * | 2005-07-22 | 2007-04-24 | Le Creuset Of America, Inc. | Hotpad |
USD616389S1 (en) * | 2008-10-20 | 2010-05-25 | Ebara Corporation | Vacuum contact pad |
USD650344S1 (en) * | 2008-10-20 | 2011-12-13 | Ebara Corporation | Vacuum contact pad |
USD625558S1 (en) * | 2010-02-05 | 2010-10-19 | Chef'n Corporation | Trivet |
USD793976S1 (en) | 2013-05-15 | 2017-08-08 | Ebara Corporation | Substrate retaining ring |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD724553S1 (en) * | 2013-09-13 | 2015-03-17 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
USD720313S1 (en) * | 2014-06-16 | 2014-12-30 | Emcore Solar Power, Inc. | Semiconductor wafer with dicing positions for solar cell fabrication |
USD770992S1 (en) | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD832023S1 (en) * | 2015-10-27 | 2018-10-30 | Meyer Intellectual Properties Limited | Circular grill pan |
USD819580S1 (en) | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD826185S1 (en) * | 2016-10-14 | 2018-08-21 | Hitachi Kokusai Electric Inc. | Ceiling heater for substrate processing apparatus |
USD862404S1 (en) * | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD913977S1 (en) * | 2016-12-12 | 2021-03-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD827592S1 (en) * | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD840364S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD859331S1 (en) * | 2017-03-31 | 2019-09-10 | Ebara Corporation | Vacuum contact pad |
USD830981S1 (en) | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
US20180301367A1 (en) | 2017-04-12 | 2018-10-18 | Ebara Corporation | Elastic membrane, substrate holding device, and polishing apparatus |
USD894137S1 (en) * | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD946638S1 (en) * | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
US20190375070A1 (en) | 2018-05-21 | 2019-12-12 | Ebara Corporation | Substrate holding apparatus, substrate polishing apparatus, elastic member, and manufacturing method of substrate holding apparatus |
USD933033S1 (en) | 2018-10-12 | 2021-10-12 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
USD933619S1 (en) | 2018-10-12 | 2021-10-19 | Valqua, Ltd. | Seal member for semiconductor production apparatus |
USD920936S1 (en) | 2019-01-17 | 2021-06-01 | Asm Ip Holding B.V. | Higher temperature vented susceptor |
USD958764S1 (en) | 2019-01-17 | 2022-07-26 | Asm Ip Holding B.V. | Higher temperature vented susceptor |
USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD921431S1 (en) * | 2019-04-01 | 2021-06-08 | Veeco Instruments, Inc. | Multi-filament heater assembly |
USD949116S1 (en) | 2019-05-03 | 2022-04-19 | Lumileds Holding B.V. | Flexible circuit board with connectors |
USD947144S1 (en) | 2019-05-10 | 2022-03-29 | Tdk Corporation | Vibration element for a haptic actuator |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD918848S1 (en) * | 2019-07-18 | 2021-05-11 | Kokusai Electric Corporation | Retainer of ceiling heater for semiconductor fabrication apparatus |
USD931240S1 (en) | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
USD939459S1 (en) | 2019-08-07 | 2021-12-28 | Kokusai Electric Corporation | Boat for wafer processing apparatus |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD933726S1 (en) | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD947914S1 (en) | 2020-11-23 | 2022-04-05 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD966357S1 (en) | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Non-Patent Citations (4)
Title |
---|
SV Tech Parts; Retrieved on Nov. 1, 2022, retrieved from internet, http://www.svtechparts.com/index.php/high-tech/semiconductor-equipment/ebara-cmp-polishing-head-from-ebara-cmp-epo-113-system.html. |
SV Tech Parts—No Announcement Date [online], retrieved on Nov. 1, 2022, retrieved from internet, http://www.svtechparts.com/index.php/high-tech/semiconductor-equipment/ebara-cmp-polishing-head-from-ebara-cmp-epo-113-system.html (Year: 2023). * |
Systa; Retrieved on Nov. 1, 2022, retrieved from internet, http://www.systa.kr/index.html. |
Systa—No Announcement Date [online], retrieved on Nov. 1, 2022, retrieved from internet, http://www.systa.kr/index.html?div=part&menu_1st=CK&menu_2nd=CUK&maker=&cont=view&sys_code=H2SYSCK07973 (Year: 2023). * |
Also Published As
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