USD958764S1 - Higher temperature vented susceptor - Google Patents

Higher temperature vented susceptor Download PDF

Info

Publication number
USD958764S1
USD958764S1 US29/782,159 US202129782159F USD958764S US D958764 S1 USD958764 S1 US D958764S1 US 202129782159 F US202129782159 F US 202129782159F US D958764 S USD958764 S US D958764S
Authority
US
United States
Prior art keywords
susceptor
higher temperature
vented
temperature vented
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/782,159
Inventor
Uday Kiran Rokkam
Sam Kim
Saket Rathi
Dakai Bian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM IP Holding BV
Original Assignee
ASM IP Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM IP Holding BV filed Critical ASM IP Holding BV
Priority to US29/782,159 priority Critical patent/USD958764S1/en
Assigned to ASM IP HOLDING B.V. reassignment ASM IP HOLDING B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RATHI, Saket, KIM, SAM, ROKKAM, UDAY KIRAN, BIAN, DAKAI
Application granted granted Critical
Publication of USD958764S1 publication Critical patent/USD958764S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a front perspective view of a higher temperature vented susceptor, showing our new design;
FIG. 2 is a back perspective view thereof;
FIG. 3 is a left side view thereof; and,
FIG. 4 is a right side view thereof.
The dash-dash lines in FIGS. 1-4 form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a higher temperature vented susceptor, as shown and described.
US29/782,159 2019-01-17 2021-05-04 Higher temperature vented susceptor Active USD958764S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/782,159 USD958764S1 (en) 2019-01-17 2021-05-04 Higher temperature vented susceptor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/677,173 USD920936S1 (en) 2019-01-17 2019-01-17 Higher temperature vented susceptor
US29/782,159 USD958764S1 (en) 2019-01-17 2021-05-04 Higher temperature vented susceptor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/677,173 Division USD920936S1 (en) 2019-01-17 2019-01-17 Higher temperature vented susceptor

Publications (1)

Publication Number Publication Date
USD958764S1 true USD958764S1 (en) 2022-07-26

Family

ID=76037731

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/677,173 Active USD920936S1 (en) 2019-01-17 2019-01-17 Higher temperature vented susceptor
US29/782,159 Active USD958764S1 (en) 2019-01-17 2021-05-04 Higher temperature vented susceptor

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US29/677,173 Active USD920936S1 (en) 2019-01-17 2019-01-17 Higher temperature vented susceptor

Country Status (2)

Country Link
US (2) USD920936S1 (en)
TW (1) TWD206688S (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210125853A1 (en) * 2019-10-24 2021-04-29 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device
USD1012873S1 (en) * 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD920936S1 (en) * 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
TW202110587A (en) 2019-05-22 2021-03-16 荷蘭商Ａｓｍ Ｉｐ 控股公司 Workpiece susceptor body and method for purging workpiece susceptor

Citations (144)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3407783A (en) 1964-08-31 1968-10-29 Emil R. Capita Vapor deposition apparatus
US3549847A (en) 1967-04-18 1970-12-22 Gen Electric Graphite susceptor
US3641974A (en) 1969-08-29 1972-02-15 Hitachi Ltd Apparatus for forming films
US3796182A (en) 1971-12-16 1974-03-12 Applied Materials Tech Susceptor structure for chemical vapor deposition reactor
US4499354A (en) 1982-10-06 1985-02-12 General Instrument Corp. Susceptor for radiant absorption heater system
US4522149A (en) 1983-11-21 1985-06-11 General Instrument Corp. Reactor and susceptor for chemical vapor deposition process
US4560420A (en) 1984-06-13 1985-12-24 At&T Technologies, Inc. Method for reducing temperature variations across a semiconductor wafer during heating
GB2181458A (en) 1985-10-07 1987-04-23 Epsilon Ltd Partnership Apparatus and method for an axially symmetric chemical vapor deposition reactor
US4710428A (en) 1984-09-13 1987-12-01 Toshiba Ceramics Co., Ltd. Sintered silicon carbide porous body impregnated with metallic silicon
US4821674A (en) 1987-03-31 1989-04-18 Deboer Wiebe B Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
EP0339279A2 (en) 1988-03-31 1989-11-02 Air Products And Chemicals, Inc. Method for making a wafer holder for use in rapid thermal processing equipment
US4958061A (en) 1988-06-27 1990-09-18 Tokyo Electron Limited Method and apparatus for heat-treating a substrate
US4986215A (en) 1988-09-01 1991-01-22 Kyushu Electronic Metal Co., Ltd. Susceptor for vapor-phase growth system
US4990374A (en) 1989-11-28 1991-02-05 Cvd Incorporated Selective area chemical vapor deposition
US5033407A (en) 1989-02-14 1991-07-23 Anelva Corporation Low pressure vapor phase growth apparatus
US5044943A (en) 1990-08-16 1991-09-03 Applied Materials, Inc. Spoked susceptor support for enhanced thermal uniformity of susceptor in semiconductor wafer processing apparatus
EP0445596A2 (en) 1990-03-09 1991-09-11 Applied Materials, Inc. Double-dome reactor for semiconductor processing
EP0448346A1 (en) 1990-03-19 1991-09-25 Kabushiki Kaisha Toshiba Vapor-phase deposition apparatus and vapor-phase deposition method
US5071670A (en) 1990-06-11 1991-12-10 Kelly Michael A Method for chemical vapor deposition under a single reactor vessel divided into separate reaction chambers each with its own depositing and exhausting means
US5074017A (en) 1989-01-13 1991-12-24 Toshiba Ceramics Co., Ltd. Susceptor
US5098198A (en) 1990-04-19 1992-03-24 Applied Materials, Inc. Wafer heating and monitor module and method of operation
US5119540A (en) 1990-07-24 1992-06-09 Cree Research, Inc. Apparatus for eliminating residual nitrogen contamination in epitaxial layers of silicon carbide and resulting product
US5119541A (en) 1987-01-28 1992-06-09 Tadahiro Ohmi Wafer succeptor apparatus
US5121531A (en) 1990-07-06 1992-06-16 Applied Materials, Inc. Refractory susceptors for epitaxial deposition apparatus
US5156820A (en) 1989-05-15 1992-10-20 Rapro Technology, Inc. Reaction chamber with controlled radiant energy heating and distributed reactant flow
US5188501A (en) 1990-04-27 1993-02-23 Shin-Etsu Handotai Co., Ltd. Wafer transfer system
US5199483A (en) 1991-05-15 1993-04-06 Applied Materials, Inc. Method and apparatus for cooling wafers
US5200157A (en) 1986-02-17 1993-04-06 Toshiba Ceramics Co., Ltd. Susceptor for vapor-growth deposition
US5242501A (en) 1982-09-10 1993-09-07 Lam Research Corporation Susceptor in chemical vapor deposition reactors
US5292554A (en) 1992-11-12 1994-03-08 Applied Materials, Inc. Deposition apparatus using a perforated pumping plate
US5298465A (en) 1990-08-16 1994-03-29 Applied Materials, Inc. Plasma etching system
US5304248A (en) 1990-12-05 1994-04-19 Applied Materials, Inc. Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions
US5306699A (en) 1988-08-31 1994-04-26 Superconductor Technologies, Inc. Reactor vessel for manufacture of superconducting films
US5308645A (en) 1992-08-07 1994-05-03 Delco Electronics Corporation Method and apparatus for through hole substrate printing
US5332442A (en) 1991-11-15 1994-07-26 Tokyo Electron Kabushiki Kaisha Surface processing apparatus
US5343938A (en) 1992-12-24 1994-09-06 Vlsi Technology, Inc. Method and apparatus for thermally insulating a wafer support
US5354715A (en) 1986-12-19 1994-10-11 Applied Materials, Inc. Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
US5356486A (en) 1991-03-04 1994-10-18 Applied Materials, Inc. Combined wafer support and temperature monitoring device
US5370739A (en) 1992-06-15 1994-12-06 Materials Research Corporation Rotating susceptor semiconductor wafer processing cluster tool module useful for tungsten CVD
EP0634785A1 (en) 1993-07-13 1995-01-18 Applied Materials, Inc. Improved susceptor design
US5383971A (en) 1990-10-12 1995-01-24 Genus, Inc. Differential pressure CVD chuck
US5393349A (en) 1991-08-16 1995-02-28 Tokyo Electron Sagami Kabushiki Kaisha Semiconductor wafer processing apparatus
JPH0758039A (en) 1993-08-20 1995-03-03 Toshiba Ceramics Co Ltd Susceptor
US5403401A (en) 1993-03-04 1995-04-04 Xycarb B.V. Substrate carrier
US5421893A (en) 1993-02-26 1995-06-06 Applied Materials, Inc. Susceptor drive and wafer displacement mechanism
US5427620A (en) 1987-03-31 1995-06-27 Advanced Semiconductor Materials America, Inc. Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
US5444217A (en) 1993-01-21 1995-08-22 Moore Epitaxial Inc. Rapid thermal processing apparatus for processing semiconductor wafers
EP0669640A1 (en) 1994-02-25 1995-08-30 Applied Materials, Inc. Susceptor for deposition apparatus
US5455069A (en) 1992-06-01 1995-10-03 Motorola, Inc. Method of improving layer uniformity in a CVD reactor
US5456757A (en) 1993-05-27 1995-10-10 Applied Materials, Inc. Susceptor for vapor deposition
US5461214A (en) 1992-06-15 1995-10-24 Thermtec, Inc. High performance horizontal diffusion furnace system
US5467220A (en) 1994-02-18 1995-11-14 Applied Materials, Inc. Method and apparatus for improving semiconductor wafer surface temperature uniformity
US5492566A (en) 1993-02-08 1996-02-20 Sumnitsch; Franz Support for disk-shaped articles using the Bernoulli principle
US5514439A (en) 1994-10-14 1996-05-07 Sibley; Thomas Wafer support fixtures for rapid thermal processing
US5549756A (en) 1994-02-02 1996-08-27 Applied Materials, Inc. Optical pyrometer for a thin film deposition system
US5551985A (en) 1995-08-18 1996-09-03 Torrex Equipment Corporation Method and apparatus for cold wall chemical vapor deposition
US5558717A (en) 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
WO1996030713A1 (en) 1995-03-30 1996-10-03 Helpman Intellectual Properties B.V. Heat exchanger
US5584936A (en) 1995-12-14 1996-12-17 Cvd, Incorporated Susceptor for semiconductor wafer processing
US5588827A (en) 1993-12-17 1996-12-31 Brooks Automation Inc. Passive gas substrate thermal conditioning apparatus and method
WO1997008743A1 (en) 1995-08-22 1997-03-06 Advanced Semiconductor Materials America, Inc. Low mass susceptor
EP0766289A2 (en) 1995-09-29 1997-04-02 Applied Materials, Inc. Susceptor for deposition apparatus
US5620525A (en) 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
US5645646A (en) 1994-02-25 1997-07-08 Applied Materials, Inc. Susceptor for deposition apparatus
US5656093A (en) 1996-03-08 1997-08-12 Applied Materials, Inc. Wafer spacing mask for a substrate support chuck and method of fabricating same
US5690742A (en) 1994-09-06 1997-11-25 Komatsu Electronic Metals Co., Ltd. Susceptor for an epitaxial growth apparatus
US5700725A (en) 1995-06-26 1997-12-23 Lucent Technologies Inc. Apparatus and method for making integrated circuits
US5738165A (en) 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
EP0840358A2 (en) 1996-11-05 1998-05-06 Applied Materials, Inc. Sloped substrate support
US5761023A (en) 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
US5800622A (en) 1995-07-21 1998-09-01 Mitsubishi Denki Kabushiki Kaisha Vapor-phase growth apparatus and compound semiconductor device fabricated thereby
US5803977A (en) 1992-09-30 1998-09-08 Applied Materials, Inc. Apparatus for full wafer deposition
US5834737A (en) 1995-05-12 1998-11-10 Tokyo Electron Limited Heat treating apparatus
USD404370S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US5895530A (en) 1996-02-26 1999-04-20 Applied Materials, Inc. Method and apparatus for directing fluid through a semiconductor processing chamber
US5938850A (en) 1995-08-04 1999-08-17 Tokyo Electron Limited Single wafer heat treatment apparatus
KR19990069091A (en) 1998-02-04 1999-09-06 윤종용 Susceptor for semiconductor device manufacturing
KR19990069084A (en) 1998-02-04 1999-09-06 윤종용 Susceptor for semiconductor device manufacturing
US5960159A (en) 1997-10-14 1999-09-28 Kokusai Electric Co., Ltd. Heat treatment of semiconductor wafers where upper heater directly heats upper wafer in its entirety and lower heater directly heats lower wafer in its entirety
US6001183A (en) 1996-06-10 1999-12-14 Emcore Corporation Wafer carriers for epitaxial growth processes
US6020212A (en) 1995-06-09 2000-02-01 Cis Bio International Phycobiliprotein-linker peptide complex fluorescent tracer and methods of using the same
US6077357A (en) 1997-05-29 2000-06-20 Applied Materials, Inc. Orientless wafer processing on an electrostatic chuck
US6090212A (en) 1997-08-15 2000-07-18 Micro C Technologies, Inc. Substrate platform for a semiconductor substrate during rapid high temperature processing and method of supporting a substrate
US6093252A (en) 1995-08-03 2000-07-25 Asm America, Inc. Process chamber with inner support
JP2000269310A (en) 1999-03-15 2000-09-29 Toshiba Corp Semiconductor wafer support device
US6293749B1 (en) 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6325858B1 (en) 1997-11-03 2001-12-04 Asm America, Inc. Long life high temperature process chamber
US6331023B1 (en) 2000-01-14 2001-12-18 Asm America, Inc. Gridded substrate transport spatula
US6343183B1 (en) 1995-09-01 2002-01-29 Asm America, Inc. Wafer support system
US20020011211A1 (en) 2000-04-06 2002-01-31 Halpin Michael W. Barrier coating for vitreous materials
US20020043337A1 (en) 1997-11-03 2002-04-18 Goodman Matthew G. Low mass wafer support system
US6394797B1 (en) 1997-04-02 2002-05-28 Hitachi, Ltd. Substrate temperature control system and method for controlling temperature of substrate
US6402850B1 (en) 1993-01-13 2002-06-11 Applied Materials, Inc. Depositing polysilicon films having improved uniformity and apparatus therefor
JP2002184843A (en) 2000-12-13 2002-06-28 Sharp Corp Semiconductor substrate holder
JP2002526915A (en) 1998-09-30 2002-08-20 アプライド マテリアルズ インコーポレイテッド Cathode assembly with built-in electrostatic chuck for holding wafers in semiconductor wafer processing equipment
US6464790B1 (en) 1997-07-11 2002-10-15 Applied Materials, Inc. Substrate support member
US20030000472A1 (en) 2001-06-26 2003-01-02 Yu-Dong Lim Vacuum plate having a symmetrical air-load block
US20030049580A1 (en) 2000-12-22 2003-03-13 Goodman Matthew G. Susceptor pocket profile to improve process performance
JP2003124167A (en) 2001-10-10 2003-04-25 Sumitomo Heavy Ind Ltd Wafer support member and double-ended grinding device using the same
US6709267B1 (en) 2002-12-27 2004-03-23 Asm America, Inc. Substrate holder with deep annular groove to prevent edge heat loss
US20040060512A1 (en) 2002-09-30 2004-04-01 Waldhauer Ann P. High temperature anneal with improved substrate support
USD496008S1 (en) 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20040229002A1 (en) 2003-05-15 2004-11-18 3D Systems, Inc. Stereolithographic seal and support structure for semiconductor wafer
US20050092439A1 (en) 2003-10-29 2005-05-05 Keeton Tony J. Low/high temperature substrate holder to reduce edge rolloff and backside damage
US20050284372A1 (en) 2004-06-28 2005-12-29 Applied Materials, Inc. Chamber component having grooved surface with depressions
US20060057826A1 (en) 2002-12-09 2006-03-16 Koninklijke Philips Electronics N.V. System and method for suppression of wafer temperature drift in cold-wall cvd systems
US7033445B2 (en) 2001-12-27 2006-04-25 Asm America, Inc. Gridded susceptor
USD525127S1 (en) 2004-03-01 2006-07-18 Kraft Foods Holdings, Inc. Susceptor ring
JP2006228802A (en) 2005-02-15 2006-08-31 Dainippon Screen Mfg Co Ltd Wafer end surface protective device
KR20070098025A (en) 2006-03-30 2007-10-05 삼성전자주식회사 Apparatus for fabricating semiconductor device
USD600223S1 (en) 2008-08-07 2009-09-15 Ravinder Aggarwal Susceptor ring
US7601224B2 (en) 2002-03-08 2009-10-13 Asm America, Inc. Method of supporting a substrate in a gas cushion susceptor system
US7602224B2 (en) 2007-05-16 2009-10-13 Hynix Semiconductor, Inc. Semiconductor device having delay locked loop and method for driving the same
US20090280248A1 (en) 2008-05-06 2009-11-12 Asm America, Inc. Porous substrate holder with thinned portions
US7648579B2 (en) 2004-02-13 2010-01-19 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
US20100031884A1 (en) 2008-08-07 2010-02-11 Asm America, Inc. Susceptor ring
US20100107974A1 (en) 2008-11-06 2010-05-06 Asm America, Inc. Substrate holder with varying density
US7722441B2 (en) * 2005-10-07 2010-05-25 Rohm And Haas Electronic Materials Llc Semiconductor processing
US7740703B2 (en) * 2003-03-18 2010-06-22 Hitachi Cable, Ltd. Semiconductor film formation device
US8366830B2 (en) 2003-03-04 2013-02-05 Cree, Inc. Susceptor apparatus for inverted type MOCVD reactor
US20130109192A1 (en) 2011-10-28 2013-05-02 Asm America, Inc. Susceptor with ring to limit backside deposition
US8801857B2 (en) 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
USD743357S1 (en) 2013-03-01 2015-11-17 Asm Ip Holding B.V. Susceptor
JP1547357S (en) 2015-07-27 2016-04-11
US20160133504A1 (en) 2014-11-12 2016-05-12 Applied Materials, Inc. Susceptor design to reduce edge thermal peak
US9558985B2 (en) 2012-03-28 2017-01-31 Acm Research (Shanghai) Inc. Vacuum chuck
USD784276S1 (en) 2013-08-06 2017-04-18 Applied Materials, Inc. Susceptor assembly
US9633889B2 (en) 2013-03-06 2017-04-25 Applied Materials, Inc. Substrate support with integrated vacuum and edge purge conduits
TWD184695S (en) 2016-04-08 2017-08-01 應用材料股份有限公司 Patterned heater pedestal
JP1570748S (en) 2016-04-27 2018-02-19
JP1570747S (en) 2016-04-27 2018-02-19
US20180094350A1 (en) 2016-09-30 2018-04-05 Asm Ip Holding B.V. Reactant vaporizer and related systems and methods
TWD191199S (en) 2017-03-31 2018-06-21 荏原製作所股份有限公司 Part of the vacuum injection pad
US10068791B2 (en) * 2013-03-08 2018-09-04 Semiconductor Components Industries, Llc Wafer susceptor for forming a semiconductor device and method therefor
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US10376916B2 (en) * 2012-03-30 2019-08-13 Applied Materials, Inc Substrate processing system having susceptorless substrate support with enhanced substrate heating control
USD864134S1 (en) 2018-10-24 2019-10-22 Asm Ip Holding B.V. Susceptor
US20190355612A1 (en) 2017-02-02 2019-11-21 Sumco Corporation Lift pin, and epitaxial growth apparatus and method of producing silicon epitaxial wafer using the lift pin
US20200234996A1 (en) 2019-01-17 2020-07-23 Asm Ip Holding Bv Vented susceptor
US20200373187A1 (en) 2019-05-22 2020-11-26 Asm Ip Holding B.V. Substrate susceptor using edge purging
USD914620S1 (en) * 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
US20210125853A1 (en) 2019-10-24 2021-04-29 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
USD920936S1 (en) * 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor

Patent Citations (158)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3407783A (en) 1964-08-31 1968-10-29 Emil R. Capita Vapor deposition apparatus
US3549847A (en) 1967-04-18 1970-12-22 Gen Electric Graphite susceptor
US3641974A (en) 1969-08-29 1972-02-15 Hitachi Ltd Apparatus for forming films
US3796182A (en) 1971-12-16 1974-03-12 Applied Materials Tech Susceptor structure for chemical vapor deposition reactor
US5242501A (en) 1982-09-10 1993-09-07 Lam Research Corporation Susceptor in chemical vapor deposition reactors
US4499354A (en) 1982-10-06 1985-02-12 General Instrument Corp. Susceptor for radiant absorption heater system
US4522149A (en) 1983-11-21 1985-06-11 General Instrument Corp. Reactor and susceptor for chemical vapor deposition process
US4560420A (en) 1984-06-13 1985-12-24 At&T Technologies, Inc. Method for reducing temperature variations across a semiconductor wafer during heating
US4710428A (en) 1984-09-13 1987-12-01 Toshiba Ceramics Co., Ltd. Sintered silicon carbide porous body impregnated with metallic silicon
GB2181458A (en) 1985-10-07 1987-04-23 Epsilon Ltd Partnership Apparatus and method for an axially symmetric chemical vapor deposition reactor
US5200157A (en) 1986-02-17 1993-04-06 Toshiba Ceramics Co., Ltd. Susceptor for vapor-growth deposition
US5354715A (en) 1986-12-19 1994-10-11 Applied Materials, Inc. Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
US6167834B1 (en) 1986-12-19 2001-01-02 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
US5119541A (en) 1987-01-28 1992-06-09 Tadahiro Ohmi Wafer succeptor apparatus
US4821674A (en) 1987-03-31 1989-04-18 Deboer Wiebe B Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
US5427620A (en) 1987-03-31 1995-06-27 Advanced Semiconductor Materials America, Inc. Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment
US4978567A (en) 1988-03-31 1990-12-18 Materials Technology Corporation, Subsidiary Of The Carbon/Graphite Group, Inc. Wafer holding fixture for chemical reaction processes in rapid thermal processing equipment and method for making same
EP0339279A2 (en) 1988-03-31 1989-11-02 Air Products And Chemicals, Inc. Method for making a wafer holder for use in rapid thermal processing equipment
US4958061A (en) 1988-06-27 1990-09-18 Tokyo Electron Limited Method and apparatus for heat-treating a substrate
US5306699A (en) 1988-08-31 1994-04-26 Superconductor Technologies, Inc. Reactor vessel for manufacture of superconducting films
US4986215A (en) 1988-09-01 1991-01-22 Kyushu Electronic Metal Co., Ltd. Susceptor for vapor-phase growth system
US5074017A (en) 1989-01-13 1991-12-24 Toshiba Ceramics Co., Ltd. Susceptor
US5033407A (en) 1989-02-14 1991-07-23 Anelva Corporation Low pressure vapor phase growth apparatus
US5156820A (en) 1989-05-15 1992-10-20 Rapro Technology, Inc. Reaction chamber with controlled radiant energy heating and distributed reactant flow
US4990374A (en) 1989-11-28 1991-02-05 Cvd Incorporated Selective area chemical vapor deposition
US5108792A (en) 1990-03-09 1992-04-28 Applied Materials, Inc. Double-dome reactor for semiconductor processing
EP0445596A2 (en) 1990-03-09 1991-09-11 Applied Materials, Inc. Double-dome reactor for semiconductor processing
EP0448346A1 (en) 1990-03-19 1991-09-25 Kabushiki Kaisha Toshiba Vapor-phase deposition apparatus and vapor-phase deposition method
US5527393A (en) 1990-03-19 1996-06-18 Kabushiki Kaisha Toshiba Vapor-phase deposition apparatus and vapor-phase deposition method
US5098198A (en) 1990-04-19 1992-03-24 Applied Materials, Inc. Wafer heating and monitor module and method of operation
US5188501A (en) 1990-04-27 1993-02-23 Shin-Etsu Handotai Co., Ltd. Wafer transfer system
US5071670A (en) 1990-06-11 1991-12-10 Kelly Michael A Method for chemical vapor deposition under a single reactor vessel divided into separate reaction chambers each with its own depositing and exhausting means
US5121531A (en) 1990-07-06 1992-06-16 Applied Materials, Inc. Refractory susceptors for epitaxial deposition apparatus
US5620525A (en) 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
US5119540A (en) 1990-07-24 1992-06-09 Cree Research, Inc. Apparatus for eliminating residual nitrogen contamination in epitaxial layers of silicon carbide and resulting product
US5298465A (en) 1990-08-16 1994-03-29 Applied Materials, Inc. Plasma etching system
US5044943A (en) 1990-08-16 1991-09-03 Applied Materials, Inc. Spoked susceptor support for enhanced thermal uniformity of susceptor in semiconductor wafer processing apparatus
US5383971A (en) 1990-10-12 1995-01-24 Genus, Inc. Differential pressure CVD chuck
US5304248A (en) 1990-12-05 1994-04-19 Applied Materials, Inc. Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions
US5356486A (en) 1991-03-04 1994-10-18 Applied Materials, Inc. Combined wafer support and temperature monitoring device
US5199483A (en) 1991-05-15 1993-04-06 Applied Materials, Inc. Method and apparatus for cooling wafers
US5393349A (en) 1991-08-16 1995-02-28 Tokyo Electron Sagami Kabushiki Kaisha Semiconductor wafer processing apparatus
US5332442A (en) 1991-11-15 1994-07-26 Tokyo Electron Kabushiki Kaisha Surface processing apparatus
US5455069A (en) 1992-06-01 1995-10-03 Motorola, Inc. Method of improving layer uniformity in a CVD reactor
US5370739A (en) 1992-06-15 1994-12-06 Materials Research Corporation Rotating susceptor semiconductor wafer processing cluster tool module useful for tungsten CVD
US5461214A (en) 1992-06-15 1995-10-24 Thermtec, Inc. High performance horizontal diffusion furnace system
US5308645A (en) 1992-08-07 1994-05-03 Delco Electronics Corporation Method and apparatus for through hole substrate printing
US5803977A (en) 1992-09-30 1998-09-08 Applied Materials, Inc. Apparatus for full wafer deposition
US5292554A (en) 1992-11-12 1994-03-08 Applied Materials, Inc. Deposition apparatus using a perforated pumping plate
US5343938A (en) 1992-12-24 1994-09-06 Vlsi Technology, Inc. Method and apparatus for thermally insulating a wafer support
US6402850B1 (en) 1993-01-13 2002-06-11 Applied Materials, Inc. Depositing polysilicon films having improved uniformity and apparatus therefor
US5444217A (en) 1993-01-21 1995-08-22 Moore Epitaxial Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5683518A (en) 1993-01-21 1997-11-04 Moore Epitaxial, Inc. Rapid thermal processing apparatus for processing semiconductor wafers
US5492566A (en) 1993-02-08 1996-02-20 Sumnitsch; Franz Support for disk-shaped articles using the Bernoulli principle
US5421893A (en) 1993-02-26 1995-06-06 Applied Materials, Inc. Susceptor drive and wafer displacement mechanism
US5403401A (en) 1993-03-04 1995-04-04 Xycarb B.V. Substrate carrier
US5738165A (en) 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
US5456757A (en) 1993-05-27 1995-10-10 Applied Materials, Inc. Susceptor for vapor deposition
EP0634785A1 (en) 1993-07-13 1995-01-18 Applied Materials, Inc. Improved susceptor design
JPH0758039A (en) 1993-08-20 1995-03-03 Toshiba Ceramics Co Ltd Susceptor
US5588827A (en) 1993-12-17 1996-12-31 Brooks Automation Inc. Passive gas substrate thermal conditioning apparatus and method
US5549756A (en) 1994-02-02 1996-08-27 Applied Materials, Inc. Optical pyrometer for a thin film deposition system
US5467220A (en) 1994-02-18 1995-11-14 Applied Materials, Inc. Method and apparatus for improving semiconductor wafer surface temperature uniformity
EP0669640A1 (en) 1994-02-25 1995-08-30 Applied Materials, Inc. Susceptor for deposition apparatus
US5645646A (en) 1994-02-25 1997-07-08 Applied Materials, Inc. Susceptor for deposition apparatus
US5690742A (en) 1994-09-06 1997-11-25 Komatsu Electronic Metals Co., Ltd. Susceptor for an epitaxial growth apparatus
US5514439A (en) 1994-10-14 1996-05-07 Sibley; Thomas Wafer support fixtures for rapid thermal processing
US5558717A (en) 1994-11-30 1996-09-24 Applied Materials CVD Processing chamber
WO1996030713A1 (en) 1995-03-30 1996-10-03 Helpman Intellectual Properties B.V. Heat exchanger
US5834737A (en) 1995-05-12 1998-11-10 Tokyo Electron Limited Heat treating apparatus
US6020212A (en) 1995-06-09 2000-02-01 Cis Bio International Phycobiliprotein-linker peptide complex fluorescent tracer and methods of using the same
US5700725A (en) 1995-06-26 1997-12-23 Lucent Technologies Inc. Apparatus and method for making integrated circuits
US5800622A (en) 1995-07-21 1998-09-01 Mitsubishi Denki Kabushiki Kaisha Vapor-phase growth apparatus and compound semiconductor device fabricated thereby
US6608287B2 (en) 1995-08-03 2003-08-19 Asm America, Inc. Process chamber with rectangular temperature compensation ring
US6093252A (en) 1995-08-03 2000-07-25 Asm America, Inc. Process chamber with inner support
US5938850A (en) 1995-08-04 1999-08-17 Tokyo Electron Limited Single wafer heat treatment apparatus
US5551985A (en) 1995-08-18 1996-09-03 Torrex Equipment Corporation Method and apparatus for cold wall chemical vapor deposition
WO1997008743A1 (en) 1995-08-22 1997-03-06 Advanced Semiconductor Materials America, Inc. Low mass susceptor
US6086680A (en) 1995-08-22 2000-07-11 Asm America, Inc. Low-mass susceptor
US6343183B1 (en) 1995-09-01 2002-01-29 Asm America, Inc. Wafer support system
EP0766289A2 (en) 1995-09-29 1997-04-02 Applied Materials, Inc. Susceptor for deposition apparatus
US5584936A (en) 1995-12-14 1996-12-17 Cvd, Incorporated Susceptor for semiconductor wafer processing
US5895530A (en) 1996-02-26 1999-04-20 Applied Materials, Inc. Method and apparatus for directing fluid through a semiconductor processing chamber
US5656093A (en) 1996-03-08 1997-08-12 Applied Materials, Inc. Wafer spacing mask for a substrate support chuck and method of fabricating same
US5761023A (en) 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
US6001183A (en) 1996-06-10 1999-12-14 Emcore Corporation Wafer carriers for epitaxial growth processes
EP0840358A2 (en) 1996-11-05 1998-05-06 Applied Materials, Inc. Sloped substrate support
US6394797B1 (en) 1997-04-02 2002-05-28 Hitachi, Ltd. Substrate temperature control system and method for controlling temperature of substrate
US6077357A (en) 1997-05-29 2000-06-20 Applied Materials, Inc. Orientless wafer processing on an electrostatic chuck
US6464790B1 (en) 1997-07-11 2002-10-15 Applied Materials, Inc. Substrate support member
US6090212A (en) 1997-08-15 2000-07-18 Micro C Technologies, Inc. Substrate platform for a semiconductor substrate during rapid high temperature processing and method of supporting a substrate
USD404370S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US5960159A (en) 1997-10-14 1999-09-28 Kokusai Electric Co., Ltd. Heat treatment of semiconductor wafers where upper heater directly heats upper wafer in its entirety and lower heater directly heats lower wafer in its entirety
US6893507B2 (en) 1997-11-03 2005-05-17 Asm America, Inc. Self-centering wafer support system
US6325858B1 (en) 1997-11-03 2001-12-04 Asm America, Inc. Long life high temperature process chamber
US20020043337A1 (en) 1997-11-03 2002-04-18 Goodman Matthew G. Low mass wafer support system
US6293749B1 (en) 1997-11-21 2001-09-25 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
KR19990069091A (en) 1998-02-04 1999-09-06 윤종용 Susceptor for semiconductor device manufacturing
KR100460338B1 (en) 1998-02-04 2005-01-17 삼성전자주식회사 Susceptor for fabricating semiconductor device to prevent wafer from being dropped during fabricating process and avoid generation of particles
KR19990069084A (en) 1998-02-04 1999-09-06 윤종용 Susceptor for semiconductor device manufacturing
JP2002526915A (en) 1998-09-30 2002-08-20 アプライド マテリアルズ インコーポレイテッド Cathode assembly with built-in electrostatic chuck for holding wafers in semiconductor wafer processing equipment
JP2000269310A (en) 1999-03-15 2000-09-29 Toshiba Corp Semiconductor wafer support device
US6331023B1 (en) 2000-01-14 2001-12-18 Asm America, Inc. Gridded substrate transport spatula
US20020011211A1 (en) 2000-04-06 2002-01-31 Halpin Michael W. Barrier coating for vitreous materials
JP2002184843A (en) 2000-12-13 2002-06-28 Sharp Corp Semiconductor substrate holder
US6634882B2 (en) 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
US20030049580A1 (en) 2000-12-22 2003-03-13 Goodman Matthew G. Susceptor pocket profile to improve process performance
US20030000472A1 (en) 2001-06-26 2003-01-02 Yu-Dong Lim Vacuum plate having a symmetrical air-load block
JP2003124167A (en) 2001-10-10 2003-04-25 Sumitomo Heavy Ind Ltd Wafer support member and double-ended grinding device using the same
US7033445B2 (en) 2001-12-27 2006-04-25 Asm America, Inc. Gridded susceptor
US7601224B2 (en) 2002-03-08 2009-10-13 Asm America, Inc. Method of supporting a substrate in a gas cushion susceptor system
US20040060512A1 (en) 2002-09-30 2004-04-01 Waldhauer Ann P. High temperature anneal with improved substrate support
US20060057826A1 (en) 2002-12-09 2006-03-16 Koninklijke Philips Electronics N.V. System and method for suppression of wafer temperature drift in cold-wall cvd systems
USD496008S1 (en) 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US6709267B1 (en) 2002-12-27 2004-03-23 Asm America, Inc. Substrate holder with deep annular groove to prevent edge heat loss
US8366830B2 (en) 2003-03-04 2013-02-05 Cree, Inc. Susceptor apparatus for inverted type MOCVD reactor
US7740703B2 (en) * 2003-03-18 2010-06-22 Hitachi Cable, Ltd. Semiconductor film formation device
US20040229002A1 (en) 2003-05-15 2004-11-18 3D Systems, Inc. Stereolithographic seal and support structure for semiconductor wafer
JP2007502022A (en) 2003-05-15 2007-02-01 スリーディー システムズ インコーポレーテッド Stereolithography seal and support structure for semiconductor wafers
US20050092439A1 (en) 2003-10-29 2005-05-05 Keeton Tony J. Low/high temperature substrate holder to reduce edge rolloff and backside damage
US7648579B2 (en) 2004-02-13 2010-01-19 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
US8088225B2 (en) 2004-02-13 2012-01-03 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition
USD525127S1 (en) 2004-03-01 2006-07-18 Kraft Foods Holdings, Inc. Susceptor ring
US20050284372A1 (en) 2004-06-28 2005-12-29 Applied Materials, Inc. Chamber component having grooved surface with depressions
JP2006228802A (en) 2005-02-15 2006-08-31 Dainippon Screen Mfg Co Ltd Wafer end surface protective device
US7722441B2 (en) * 2005-10-07 2010-05-25 Rohm And Haas Electronic Materials Llc Semiconductor processing
KR20070098025A (en) 2006-03-30 2007-10-05 삼성전자주식회사 Apparatus for fabricating semiconductor device
US7602224B2 (en) 2007-05-16 2009-10-13 Hynix Semiconductor, Inc. Semiconductor device having delay locked loop and method for driving the same
US20090280248A1 (en) 2008-05-06 2009-11-12 Asm America, Inc. Porous substrate holder with thinned portions
US20100031884A1 (en) 2008-08-07 2010-02-11 Asm America, Inc. Susceptor ring
WO2010016964A2 (en) 2008-08-07 2010-02-11 Asm America, Inc. Susceptor ring
USD600223S1 (en) 2008-08-07 2009-09-15 Ravinder Aggarwal Susceptor ring
US8394229B2 (en) 2008-08-07 2013-03-12 Asm America, Inc. Susceptor ring
US8801857B2 (en) 2008-10-31 2014-08-12 Asm America, Inc. Self-centering susceptor ring assembly
US20100107974A1 (en) 2008-11-06 2010-05-06 Asm America, Inc. Substrate holder with varying density
US20130109192A1 (en) 2011-10-28 2013-05-02 Asm America, Inc. Susceptor with ring to limit backside deposition
US9558985B2 (en) 2012-03-28 2017-01-31 Acm Research (Shanghai) Inc. Vacuum chuck
US10376916B2 (en) * 2012-03-30 2019-08-13 Applied Materials, Inc Substrate processing system having susceptorless substrate support with enhanced substrate heating control
USD743357S1 (en) 2013-03-01 2015-11-17 Asm Ip Holding B.V. Susceptor
US9633889B2 (en) 2013-03-06 2017-04-25 Applied Materials, Inc. Substrate support with integrated vacuum and edge purge conduits
US10068791B2 (en) * 2013-03-08 2018-09-04 Semiconductor Components Industries, Llc Wafer susceptor for forming a semiconductor device and method therefor
USD784276S1 (en) 2013-08-06 2017-04-18 Applied Materials, Inc. Susceptor assembly
US20160133504A1 (en) 2014-11-12 2016-05-12 Applied Materials, Inc. Susceptor design to reduce edge thermal peak
JP1547357S (en) 2015-07-27 2016-04-11
TWD184695S (en) 2016-04-08 2017-08-01 應用材料股份有限公司 Patterned heater pedestal
JP1570748S (en) 2016-04-27 2018-02-19
JP1570747S (en) 2016-04-27 2018-02-19
US20180094350A1 (en) 2016-09-30 2018-04-05 Asm Ip Holding B.V. Reactant vaporizer and related systems and methods
US20190355612A1 (en) 2017-02-02 2019-11-21 Sumco Corporation Lift pin, and epitaxial growth apparatus and method of producing silicon epitaxial wafer using the lift pin
TWD191199S (en) 2017-03-31 2018-06-21 荏原製作所股份有限公司 Part of the vacuum injection pad
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
USD864134S1 (en) 2018-10-24 2019-10-22 Asm Ip Holding B.V. Susceptor
US20200234996A1 (en) 2019-01-17 2020-07-23 Asm Ip Holding Bv Vented susceptor
USD914620S1 (en) * 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
USD920936S1 (en) * 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
US20200373187A1 (en) 2019-05-22 2020-11-26 Asm Ip Holding B.V. Substrate susceptor using edge purging
US20210125853A1 (en) 2019-10-24 2021-04-29 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Shaping the Future in Semiconductor Processing." Advertisement for Morton International, Inc., Ceramic Solutions. vol. 73, No. 7, Jul. 1994: advertisements (circa 1993).

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device
US20210125853A1 (en) * 2019-10-24 2021-04-29 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing
US11764101B2 (en) * 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1021832S1 (en) 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD1012873S1 (en) * 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus

Also Published As

Publication number Publication date
USD920936S1 (en) 2021-06-01
TWD206688S (en) 2020-08-21

Similar Documents

Publication Publication Date Title
USD958764S1 (en) Higher temperature vented susceptor
USD891297S1 (en) Hoverboard
USD929379S1 (en) Wireless earphone
USD910594S1 (en) Headphone
USD892080S1 (en) Headphones
USD935915S1 (en) Lidar
USD917209S1 (en) Display unit
USD885899S1 (en) Closure
USD885900S1 (en) Closure
USD886607S1 (en) Closure
USD947913S1 (en) Susceptor shaft
USD942190S1 (en) Support
USD885897S1 (en) Closure
USD938935S1 (en) Wireless earphone
USD935446S1 (en) Wireless earphone
USD891160S1 (en) Table
USD883799S1 (en) Bottle
USD899261S1 (en) Bottle
USD866200S1 (en) Hanger
USD990176S1 (en) Lounge
USD853446S1 (en) Controlled-release spreader
USD885896S1 (en) Closure
USD996822S1 (en) Packaging for jewelry
USD889244S1 (en) Door operator
USD885898S1 (en) Closure

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY