KR19990069091A - Susceptor for semiconductor device manufacturing - Google Patents
Susceptor for semiconductor device manufacturing Download PDFInfo
- Publication number
- KR19990069091A KR19990069091A KR1019980003117A KR19980003117A KR19990069091A KR 19990069091 A KR19990069091 A KR 19990069091A KR 1019980003117 A KR1019980003117 A KR 1019980003117A KR 19980003117 A KR19980003117 A KR 19980003117A KR 19990069091 A KR19990069091 A KR 19990069091A
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- South Korea
- Prior art keywords
- vacuum
- susceptor
- vacuum chuck
- wafer
- semiconductor device
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
본 발명은 반도체소자 제조용 서셉터에 관한 것이다.The present invention relates to a susceptor for manufacturing a semiconductor device.
본 발명은, 웨이퍼를 가열하는 원통형상의 히터; 상기 히터의 내부에 위치하며 웨이퍼를 진공흡착할 수 있도록 일측에 진공홀이 형성된 진공척; 상기 진공척을 상기 히터에 위치하도록 상기 진공척이 통과하여 지지될 수 있도록 링(Ring)형상으로 형성되며, 상기 진공척의 진공홀을 따라 진공을 형성하기 위한 진공노즐이 통과할 수 있도록 일측이 개방된 진공척클립; 및 상기 개방된 부분을 통하는 진공노즐을 상기 진공척클립의 일측에 고정시키는 고정부재를 구비하여 이루어진다.The present invention is a cylindrical heater for heating a wafer; A vacuum chuck positioned inside the heater and having a vacuum hole formed at one side to vacuum-absorb the wafer; The vacuum chuck is formed in a ring shape so that the vacuum chuck can be supported by passing through the vacuum chuck, and one side of the vacuum chuck is formed to pass through the vacuum nozzle for forming a vacuum along the vacuum hole of the vacuum chuck. Vacuum chuck clip; And a fixing member for fixing the vacuum nozzle through the open portion to one side of the vacuum chuck clip.
따라서, 공정진행시 서셉터 진공노즐의 진동을 억제하므로써 상기 진공노즐의 진공이 누출되는 것을 차단하여 웨이퍼의 떨어트림 및 파티클 발생을 방지하는 효과가 있다.Therefore, by suppressing the vibration of the susceptor vacuum nozzle during the process, it is possible to block the leakage of the vacuum of the vacuum nozzle to prevent dropping of the wafer and generation of particles.
Description
본 발명은 반도체소자 제조용 서셉터에 관한 것으로서, 보다 상세하게는 진공노즐을 고정시키는 고정부재를 부착한 반도체소자 제조용 서셉터에 관한 것이다.The present invention relates to a susceptor for manufacturing a semiconductor device, and more particularly, to a susceptor for manufacturing a semiconductor device having a fixing member for fixing a vacuum nozzle.
일반적으로 반도체소자는 증착공정, 사진공정, 식각공정 및 이온주입공정 등의 일련의 공정들을 수행하여 이루어진다.Generally, a semiconductor device is formed by performing a series of processes such as a deposition process, a photo process, an etching process, and an ion implantation process.
즉, 반도체소자는 반도체 기판 위에 다결정막, 산화막, 질화막 및 금속막 등과 같은 여러 층의 박막을 증착하여 사진공정 및 식각공정 통해 패턴을 형성시켜 완성한다.That is, the semiconductor device is completed by depositing a thin film of various layers such as a polycrystalline film, an oxide film, a nitride film and a metal film on the semiconductor substrate to form a pattern through a photo process and an etching process.
상기 증착공정은 웨이퍼 상에 전열막, 산화막 및 금속막 등을 증착하는 공정으로써 주로 화학기상증착(Chemical Vapor Deposition)방법을 이용한다. 상기 화학기상증착장치의 웨이퍼를 장착하는 부분이 서셉터(Susceptor)이다The deposition process is a process of depositing a heat transfer film, an oxide film and a metal film on a wafer mainly using a chemical vapor deposition (Chemical Vapor Deposition) method. The part for mounting the wafer of the chemical vapor deposition apparatus is a susceptor.
도1은 종래의 반도체소자 제조용 서셉터를 나타내는 개략적인 구성도이다.1 is a schematic diagram illustrating a conventional susceptor for manufacturing a semiconductor device.
도2는 종래의 반도체소자 제조용 서셉터를 나타내는 평면도이다.2 is a plan view illustrating a conventional susceptor for manufacturing a semiconductor device.
도1 및 도2에서 보는 바와 같이 웨이퍼가 부착되는 서셉터(2), 상기 서셉터의 일측에 형성되는 진공구멍(6), 상기 진공구멍(6) 내로 삽입되어 상기 웨이퍼를 진공에 의해 흡입 부착하는 진공노즐(8), 상기 서셉터(2)를 지지하는 서셉터클립(4), 상기 서셉터2)와 상기 서셉터클립(4)가 장착되며 상기 웨이퍼를 가열하는 히터(10)로 구성되어 있다.1 and 2, a susceptor 2 to which a wafer is attached, a vacuum hole 6 formed at one side of the susceptor, and inserted into the vacuum hole 6 are suction-attached by vacuum. A vacuum nozzle 8, a susceptor clip 4 for supporting the susceptor 2, the susceptor 2 and the susceptor clip 4, and a heater 10 for heating the wafer. It is.
상기 진공노즐(8)은 상기 진공구멍(6)에 일직선으로 조립되지만 공정진행중 설비자체의 진동으로 인하여 상기 진공노즐(8)의 진공이 누출되는 경우가 있다. 그러므로 상기 진공의 누출로 상기 서셉터에 붙어있던 웨이퍼(12)가 떨어지거나 상기 진동에 의하여 다량의 파티클이 발생하는 문제점이 발생한다.The vacuum nozzle 8 is assembled in a straight line to the vacuum hole 6, but the vacuum of the vacuum nozzle 8 may leak due to the vibration of the equipment itself during the process. Therefore, a problem occurs that a large amount of particles are generated due to the vibration of the wafer 12 falling on the susceptor or the vibration.
본 발명의 목적은, 상기 종래기술의 문제점을 해결하기 위한 것으로서 서셉터 클립에 서셉터 진공노즐의 고정장치를 부착하여 공정중 상기 진공노즐의 진동을 방지하여 공정 진행중 웨이퍼의 떨어트림 및 파티클 발생을 방지 하여 공정의 안정적인 진행과 장비의 가동률을 향상시키는데 있다.SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art by attaching a susceptor vacuum nozzle fixing device to a susceptor clip to prevent vibration of the vacuum nozzle during the process to prevent wafer drop and particle generation during the process. This is to prevent the stable progress of the process and improve the utilization rate of the equipment.
도1은 종래의 반도체소자 제조용 서셉터를 나타내는 개략적인 구성도이다.1 is a schematic diagram illustrating a conventional susceptor for manufacturing a semiconductor device.
도2은 종래의 반도체소자 제조용 서셉터를 나타내는 평면도이다.2 is a plan view illustrating a conventional susceptor for manufacturing a semiconductor device.
도3은 본 발명에 의한 서셉터클립에 고정장치가 부착된 반도체소자 제조용 서셉터를 나타내는 개략적인 구성도이다.3 is a schematic diagram illustrating a susceptor for manufacturing a semiconductor device having a fixing device attached to a susceptor clip according to the present invention.
도4는 본 발명에 의한 서셉터클립에 고정장치가 부착된 반도체소자 제조용 서셉터를 나타내는 평면도이다.4 is a plan view illustrating a susceptor for manufacturing a semiconductor device having a fixing device attached to a susceptor clip according to the present invention.
도5a는 본 발명의 일 실시예에 의한 고정부재를 나타내는 평면도이다.Figure 5a is a plan view showing a fixing member according to an embodiment of the present invention.
도5b는 본 발명의 일 실시예에 의한 고정부재를 나타내는 측면도이다.Figure 5b is a side view showing a fixing member according to an embodiment of the present invention.
※도면의 주요부분에 대한 부호의 설명※ Explanation of symbols for main parts of drawing
2 ; 서셉터 4 ; 서셉터 클립2 ; Susceptor 4; Susceptor clips
6 ; 진공구멍 8 ; 진공노즐6; Vacuum holes 8; Vacuum nozzle
10 ; 히터 12 ; 웨이퍼10; Heater 12; wafer
14 ; 고정부재14; Fixing member
상기 목적을 달성하기 위한 본 발명에 따른 반도체소자 제조용 서셉터는 웨이퍼를 가열하는 원통형상의 히터, 상기 히터의 내부에 위치하며 웨이퍼를 진공흡착할 수 있도록 일측에 진공홀이 형성된 진공척, 상기 진공척을 상기 히터에 위치하도록 상기 진공척이 통과하여 지지될 수 있도록 링(Ring)형상으로 형성되며, 상기 진공척의 진공홀을 따라 진공을 형성하기 위한 진공노즐이 통과할 수 있도록 일측이 개방된 진공척클립 및 상기 개방된 부분을 통하는 진공노즐을 상기 진공척클립의 일측에 고정시키는 고정부재를 구비하여 이루어진다.Susceptor for manufacturing a semiconductor device according to the present invention for achieving the above object is a cylindrical heater for heating a wafer, the vacuum chuck is formed in the inside of the heater and the vacuum hole formed on one side to vacuum suction the wafer, the vacuum chuck Is formed in a ring (Ring) shape so that the vacuum chuck is passed through and supported so as to be located in the heater, the vacuum chuck with one side open so that the vacuum nozzle for forming a vacuum along the vacuum hole of the vacuum chuck can pass through And a fixing member for fixing a clip and a vacuum nozzle through the open portion to one side of the vacuum chuck clip.
이하, 본 발명의 구체적인 일 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, with reference to the accompanying drawings a specific embodiment of the present invention will be described in detail.
도3은 본 발명에 의한 서셉터클립에 고정장치가 부착된 반도체소자 제조용 서셉터를 나타내는 개략적인 구성도이다.3 is a schematic diagram illustrating a susceptor for manufacturing a semiconductor device having a fixing device attached to a susceptor clip according to the present invention.
도4는 본 발명에 의한 서셉터클립에 고정장치가 부착된 반도체소자 제조용 서셉터를 나타내는 평면도이다.4 is a plan view illustrating a susceptor for manufacturing a semiconductor device having a fixing device attached to a susceptor clip according to the present invention.
도3 및 도4에서 보는 바와 같이 웨이퍼(12)가 부착되는 진공척(2), 상기 진공척의 일측에 형성되는 진공구멍(6), 상기 진공구멍(6) 내로 삽입되어 상기 웨이퍼(12)를 진공에 의해 흡입 부착하는 진공노즐(8), 상기 진공척(2)를 지지하는 진공척클립(4), 상기 진공척클립(4)의 일측에 형성되며 상기 진공척으로 삽입되어 진공을 형성하여 상기 웨이퍼(12)를 흡입부착하는 진공노즐(8)을 공정진행중 장비의 진행에 의하여 발생하는 진동에 의해 움직여 진공능력을 떨어트려 상기 웨이퍼(12)가 아래로 떨어지는 것을 방지하기 위하여 상기 진공노즐(8)을 상기 진공척클립(4)에 고정시키는 고정부재(14) 및 상기 진공척(2)과 상기 진공척클립(4)을 내재하며 상기 웨이퍼(12)를 가열하는 원통형의 히터(10)로 구성되어 있다.As shown in FIGS. 3 and 4, the vacuum chuck 2 to which the wafer 12 is attached, the vacuum hole 6 formed on one side of the vacuum chuck, and the vacuum hole 6 are inserted to insert the wafer 12. The vacuum nozzle 8 attached by suction by vacuum, the vacuum chuck clip 4 supporting the vacuum chuck 2, and formed on one side of the vacuum chuck clip 4 are inserted into the vacuum chuck to form a vacuum In order to prevent the wafer 12 from falling down by moving the vacuum nozzle 8 which sucks and attaches the wafer 12 by the vibration generated by the progress of the equipment during the process, the vacuum capacity is reduced. 8 is a cylindrical heater 10 for heating the wafer 12 in the fixing member 14 for fixing the vacuum chuck clip 4 to the vacuum chuck clip 4 and the vacuum chuck 2 and the vacuum chuck clip 4. Consist of The.
도5a는 본 발명의 일 실시예에 의한 고정부재를 나타내는 평면도이다.Figure 5a is a plan view showing a fixing member according to an embodiment of the present invention.
도5b는 본 발명의 일 실시예에 의한 고정부재를 나타내는 측면도이다.Figure 5b is a side view showing a fixing member according to an embodiment of the present invention.
도5a 및 도5b에서 보는 바와 같이 상기 고정부재는 상기 진공노즐을 삽입하는 원형고리(16)와 상기 원형고리(16)의 일측에 형성되며 소정의 면적을 갖는 표면에 나사구멍(18)이 형성되어 있어 상기 고정부재를 상기 진공척클립(4)에 고정한다.5A and 5B, the fixing member is formed at one side of the circular ring 16 and the circular ring 16 into which the vacuum nozzle is inserted, and a screw hole 18 is formed on a surface having a predetermined area. The fixing member is fixed to the vacuum chuck clip (4).
따라서, 본 발명에 의하면 상술한 바와 같이 공정진행시 서셉터 진공노즐의 진동을 억제하므로써 상기 진공노즐의 진공이 누출되는 것을 차단하여 웨이퍼의 떨어트림 및 파티클 발생을 방지하는 효과가 있다.Therefore, according to the present invention, by suppressing the vibration of the susceptor vacuum nozzle during the process as described above, it is possible to block the leakage of the vacuum of the vacuum nozzle to prevent dropping of the wafer and generation of particles.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980003117A KR100460338B1 (en) | 1998-02-04 | 1998-02-04 | Susceptor for fabricating semiconductor device to prevent wafer from being dropped during fabricating process and avoid generation of particles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980003117A KR100460338B1 (en) | 1998-02-04 | 1998-02-04 | Susceptor for fabricating semiconductor device to prevent wafer from being dropped during fabricating process and avoid generation of particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990069091A true KR19990069091A (en) | 1999-09-06 |
| KR100460338B1 KR100460338B1 (en) | 2005-01-17 |
Family
ID=37376985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980003117A KR100460338B1 (en) | 1998-02-04 | 1998-02-04 | Susceptor for fabricating semiconductor device to prevent wafer from being dropped during fabricating process and avoid generation of particles |
Country Status (1)
| Country | Link |
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| KR (1) | KR100460338B1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010016964A2 (en) * | 2008-08-07 | 2010-02-11 | Asm America, Inc. | Susceptor ring |
| USD958764S1 (en) | 2019-01-17 | 2022-07-26 | Asm Ip Holding B.V. | Higher temperature vented susceptor |
| US11404302B2 (en) | 2019-05-22 | 2022-08-02 | Asm Ip Holding B.V. | Substrate susceptor using edge purging |
| US11764101B2 (en) | 2019-10-24 | 2023-09-19 | ASM IP Holding, B.V. | Susceptor for semiconductor substrate processing |
| US11961756B2 (en) | 2019-01-17 | 2024-04-16 | Asm Ip Holding B.V. | Vented susceptor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD914620S1 (en) | 2019-01-17 | 2021-03-30 | Asm Ip Holding B.V. | Vented susceptor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0156691B1 (en) * | 1992-11-30 | 1998-10-15 | 윤종용 | Trimming device |
| EP0707938A3 (en) * | 1994-10-19 | 1997-01-08 | Hoechst Diafoil Gmbh | Process for producing thermoplastic film by lateral coextrusion |
| JPH09181156A (en) * | 1995-12-25 | 1997-07-11 | Sony Corp | Vacuum chuck |
| KR19990028074A (en) * | 1997-09-30 | 1999-04-15 | 윤종용 | Chuck Assembly of Semiconductor Device Manufacturing Equipment |
| KR19990069084A (en) * | 1998-02-04 | 1999-09-06 | 윤종용 | Susceptor for semiconductor device manufacturing |
-
1998
- 1998-02-04 KR KR1019980003117A patent/KR100460338B1/en not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010016964A2 (en) * | 2008-08-07 | 2010-02-11 | Asm America, Inc. | Susceptor ring |
| WO2010016964A3 (en) * | 2008-08-07 | 2010-05-20 | Asm America, Inc. | Susceptor ring |
| USD958764S1 (en) | 2019-01-17 | 2022-07-26 | Asm Ip Holding B.V. | Higher temperature vented susceptor |
| US11961756B2 (en) | 2019-01-17 | 2024-04-16 | Asm Ip Holding B.V. | Vented susceptor |
| US11404302B2 (en) | 2019-05-22 | 2022-08-02 | Asm Ip Holding B.V. | Substrate susceptor using edge purging |
| US11764101B2 (en) | 2019-10-24 | 2023-09-19 | ASM IP Holding, B.V. | Susceptor for semiconductor substrate processing |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100460338B1 (en) | 2005-01-17 |
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