USD931240S1 - Substrate support pedestal - Google Patents

Substrate support pedestal Download PDF

Info

Publication number
USD931240S1
USD931240S1 US29/700,012 US201929700012F USD931240S US D931240 S1 USD931240 S1 US D931240S1 US 201929700012 F US201929700012 F US 201929700012F US D931240 S USD931240 S US D931240S
Authority
US
United States
Prior art keywords
substrate support
support pedestal
pedestal
view
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/700,012
Inventor
Changhun Lee
Michael D. Willwerth
Jeffrey Ludwig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/700,012 priority Critical patent/USD931240S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, CHANGHUN, LUDWIG, Jeffrey, WILLWERTH, MICHAEL D.
Priority to TW109300093F priority patent/TWD213398S/en
Priority to TW109306863F priority patent/TWD211589S/en
Priority to JPD2020-1663F priority patent/JP1667763S/ja
Priority to JPD2020-1659F priority patent/JP1667762S/ja
Application granted granted Critical
Publication of USD931240S1 publication Critical patent/USD931240S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top, front, right side perspective view of a substrate support pedestal, showing our new design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a left side elevation view thereof.
The broken lines in FIGS. 1-7 represent unclaimed environment forming no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a substrate support pedestal, as shown and described.
US29/700,012 2019-07-30 2019-07-30 Substrate support pedestal Active USD931240S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/700,012 USD931240S1 (en) 2019-07-30 2019-07-30 Substrate support pedestal
TW109300093F TWD213398S (en) 2019-07-30 2020-01-08 Substrate support pedestal
TW109306863F TWD211589S (en) 2019-07-30 2020-01-08 Substrate support pedestal
JPD2020-1663F JP1667763S (en) 2019-07-30 2020-01-30
JPD2020-1659F JP1667762S (en) 2019-07-30 2020-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/700,012 USD931240S1 (en) 2019-07-30 2019-07-30 Substrate support pedestal

Publications (1)

Publication Number Publication Date
USD931240S1 true USD931240S1 (en) 2021-09-21

Family

ID=72322262

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/700,012 Active USD931240S1 (en) 2019-07-30 2019-07-30 Substrate support pedestal

Country Status (3)

Country Link
US (1) USD931240S1 (en)
JP (2) JP1667762S (en)
TW (2) TWD213398S (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD956376S1 (en) * 2019-12-18 2022-06-28 Goldeep Ltd. Vacuum bag valve
USD969760S1 (en) * 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD990533S1 (en) * 2020-10-21 2023-06-27 Bryan Ross Schmitt Sanding table for attachment to a garbage can
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device

Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD406852S (en) 1997-11-14 1999-03-16 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
KR20070017255A (en) 2005-08-06 2007-02-09 삼성전자주식회사 Apparatus for fixing semiconductor substrates of plasma apparatus
US20080190367A1 (en) 2007-02-12 2008-08-14 Samsung Electronics Co., Ltd. Chuck assembly and high density plasma equipment having the same
JP2008244079A (en) 2007-03-27 2008-10-09 Ulvac Japan Ltd Film-forming apparatus
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
US20110031111A1 (en) 2009-08-07 2011-02-10 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate
US20120329000A1 (en) 2010-03-23 2012-12-27 Osamu Hirakawa Substrate processing apparatus, substrate processing method, program and computer storage medium
US20140011153A1 (en) * 2012-07-03 2014-01-09 Watlow Electric Manufacturing Company Pedestal construction with low coefficient of thermal expansion top
US20140008349A1 (en) 2012-07-03 2014-01-09 Applied Materials, Inc. Substrate support for substrate backside contamination control
US20140144901A1 (en) 2012-11-26 2014-05-29 Applied Materials, Inc. Substrate support with wire mesh plasma containment
USD708651S1 (en) * 2011-11-22 2014-07-08 Applied Materials, Inc. Electrostatic chuck
US20140217665A1 (en) 2013-02-01 2014-08-07 Applied Materials, Inc. Substrate support with controlled sealing gap
TWD163540S (en) 2013-03-28 2014-10-11 平田機工股份有限公司 Wafer loading/unloading chamber cover
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
US20160002778A1 (en) 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
JP1547357S (en) 2015-07-27 2016-04-11
TWD177006S (en) 2014-12-25 2016-07-11 東京威力科創股份有限公司 Cleaning brush part with polishing section for semiconductor manufacturing equipment
US9779971B2 (en) 2014-04-11 2017-10-03 Applied Materials, Inc. Methods and apparatus for rapidly cooling a substrate
US20180044783A1 (en) 2016-08-10 2018-02-15 Applied Materials, Inc. Thermally optimized rings
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD193203S (en) 2016-12-12 2018-10-01 荏原製作所股份有限公司 Elastic film for semiconductor surface polishing
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US20190131163A1 (en) * 2017-05-25 2019-05-02 Ngk Insulators,Ltd. Wafer susceptor
TWD197827S (en) 2017-12-19 2019-06-01 日商荏原製作所股份有限公&#x5 Elastic film for semiconductor wafer polishing
US20190318944A1 (en) * 2018-04-12 2019-10-17 Disco Corporation Expanding method and expanding apparatus
US20200343120A1 (en) 2018-01-19 2020-10-29 Ulvac, Inc. Heater base and processing apparatus

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD425919S (en) * 1997-11-14 2000-05-30 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD406852S (en) 1997-11-14 1999-03-16 Applied Materials, Inc. Electrostatic chuck with improved spacing mask and workpiece detection device
USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
KR20070017255A (en) 2005-08-06 2007-02-09 삼성전자주식회사 Apparatus for fixing semiconductor substrates of plasma apparatus
US20080190367A1 (en) 2007-02-12 2008-08-14 Samsung Electronics Co., Ltd. Chuck assembly and high density plasma equipment having the same
JP2008244079A (en) 2007-03-27 2008-10-09 Ulvac Japan Ltd Film-forming apparatus
USD621804S1 (en) * 2009-08-07 2010-08-17 Hon Hai Precision Industry Co., Ltd. PCB for arranging LED lights
US20110031111A1 (en) 2009-08-07 2011-02-10 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
US20120329000A1 (en) 2010-03-23 2012-12-27 Osamu Hirakawa Substrate processing apparatus, substrate processing method, program and computer storage medium
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate
USD708651S1 (en) * 2011-11-22 2014-07-08 Applied Materials, Inc. Electrostatic chuck
US20140011153A1 (en) * 2012-07-03 2014-01-09 Watlow Electric Manufacturing Company Pedestal construction with low coefficient of thermal expansion top
US20140008349A1 (en) 2012-07-03 2014-01-09 Applied Materials, Inc. Substrate support for substrate backside contamination control
US9490150B2 (en) 2012-07-03 2016-11-08 Applied Materials, Inc. Substrate support for substrate backside contamination control
US20140144901A1 (en) 2012-11-26 2014-05-29 Applied Materials, Inc. Substrate support with wire mesh plasma containment
US20140217665A1 (en) 2013-02-01 2014-08-07 Applied Materials, Inc. Substrate support with controlled sealing gap
TWD163540S (en) 2013-03-28 2014-10-11 平田機工股份有限公司 Wafer loading/unloading chamber cover
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD723077S1 (en) * 2013-12-03 2015-02-24 Applied Materials, Inc. Chuck carrier film
US9779971B2 (en) 2014-04-11 2017-10-03 Applied Materials, Inc. Methods and apparatus for rapidly cooling a substrate
US20160002778A1 (en) 2014-07-03 2016-01-07 Applied Materials, Inc. Substrate support with more uniform edge purge
TWD177006S (en) 2014-12-25 2016-07-11 東京威力科創股份有限公司 Cleaning brush part with polishing section for semiconductor manufacturing equipment
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
JP1547357S (en) 2015-07-27 2016-04-11
USD813181S1 (en) * 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
US20180044783A1 (en) 2016-08-10 2018-02-15 Applied Materials, Inc. Thermally optimized rings
TWD193203S (en) 2016-12-12 2018-10-01 荏原製作所股份有限公司 Elastic film for semiconductor surface polishing
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
US20190131163A1 (en) * 2017-05-25 2019-05-02 Ngk Insulators,Ltd. Wafer susceptor
TWD197827S (en) 2017-12-19 2019-06-01 日商荏原製作所股份有限公&#x5 Elastic film for semiconductor wafer polishing
US20200343120A1 (en) 2018-01-19 2020-10-29 Ulvac, Inc. Heater base and processing apparatus
US20190318944A1 (en) * 2018-04-12 2019-10-17 Disco Corporation Expanding method and expanding apparatus

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
"AMAT MCA E-Chuck". Found online Sep. 29, 2020 at ebay.com. Reference dated May 30, 2017. Retrieved from https://www.ebay.com/itm/AMAT-0010-03774-HEATER-ASSY-300mm-AMAT-MCA-E-Chuck-ESC-/262005122022. (Year: 2017). *
"NTK Ceratec—Electrostatic Chuck". Found online Sep. 29, 2020 at dksh.com. Reference dated Aug. 7, 2017. Retrieved from https://tineye.com/search/3be6e76355441efd8d67fc67d0912dac27f2b87d?sort=crawl_date&order=asc&page=1. (Year: 2017). *
"SemiXicon Electrostatic Chuck". Found online Sep. 29, 2020 at semixicon.com. Reference dated Jun. 17, 2017. Retrieved from https://web.archive.org/web/20170617035614/http://www.semixicon.com/. (Year: 2017). *
International Search Report for PCT/US2020/042920, dated Nov. 6, 2020.
Search Report for Taiwan Design Application No. 109306863, dated Jan. 19, 2021.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device
USD969760S1 (en) * 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD956376S1 (en) * 2019-12-18 2022-06-28 Goldeep Ltd. Vacuum bag valve
USD989012S1 (en) * 2020-09-17 2023-06-13 Ebara Corporation Elastic membrane
USD1021832S1 (en) 2020-09-17 2024-04-09 Ebara Corporation Elastic membrane
USD990533S1 (en) * 2020-10-21 2023-06-27 Bryan Ross Schmitt Sanding table for attachment to a garbage can
USD1006768S1 (en) * 2021-01-07 2023-12-05 Solaero Technologies Corp. Semiconductor wafer for mosaic solar cell fabrication

Also Published As

Publication number Publication date
JP1667763S (en) 2020-09-07
TWD213398S (en) 2021-08-21
JP1667762S (en) 2020-09-07
TWD211589S (en) 2021-05-11

Similar Documents

Publication Publication Date Title
USD882989S1 (en) Console
USD906020S1 (en) Console
USD914400S1 (en) Console
USD904803S1 (en) Console
USD909797S1 (en) Console
USD927898S1 (en) Console
USD908404S1 (en) Cabinet
USD904802S1 (en) Console
USD894641S1 (en) Stand
USD905069S1 (en) Mount for electronic devices
USD927151S1 (en) Footwear
USD904079S1 (en) Console
USD931240S1 (en) Substrate support pedestal
USD877543S1 (en) Desk
USD915801S1 (en) Bookshelf
USD895631S1 (en) Computer monitor stand
USD905021S1 (en) Mount for headphones
USD915799S1 (en) Table
USD945797S1 (en) Desk
USD931595S1 (en) Rotatable base for an umbrella
USD942190S1 (en) Support
USD981883S1 (en) Calibration support
USD917387S1 (en) Base
USD960597S1 (en) Chair
USD898537S1 (en) Fixture

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY