USD931240S1 - Substrate support pedestal - Google Patents
Substrate support pedestal Download PDFInfo
- Publication number
- USD931240S1 USD931240S1 US29/700,012 US201929700012F USD931240S US D931240 S1 USD931240 S1 US D931240S1 US 201929700012 F US201929700012 F US 201929700012F US D931240 S USD931240 S US D931240S
- Authority
- US
- United States
- Prior art keywords
- substrate support
- support pedestal
- pedestal
- view
- elevation view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines in FIGS. 1-7 represent unclaimed environment forming no part of the claimed design.
Claims (1)
- The ornamental design for a substrate support pedestal, as shown and described.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/700,012 USD931240S1 (en) | 2019-07-30 | 2019-07-30 | Substrate support pedestal |
TW109300093F TWD213398S (en) | 2019-07-30 | 2020-01-08 | Substrate support pedestal |
TW109306863F TWD211589S (en) | 2019-07-30 | 2020-01-08 | Substrate support pedestal |
JPD2020-1663F JP1667763S (en) | 2019-07-30 | 2020-01-30 | |
JPD2020-1659F JP1667762S (en) | 2019-07-30 | 2020-01-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/700,012 USD931240S1 (en) | 2019-07-30 | 2019-07-30 | Substrate support pedestal |
Publications (1)
Publication Number | Publication Date |
---|---|
USD931240S1 true USD931240S1 (en) | 2021-09-21 |
Family
ID=72322262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/700,012 Active USD931240S1 (en) | 2019-07-30 | 2019-07-30 | Substrate support pedestal |
Country Status (3)
Country | Link |
---|---|
US (1) | USD931240S1 (en) |
JP (2) | JP1667762S (en) |
TW (2) | TWD213398S (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD956376S1 (en) * | 2019-12-18 | 2022-06-28 | Goldeep Ltd. | Vacuum bag valve |
USD969760S1 (en) * | 2019-12-02 | 2022-11-15 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD990533S1 (en) * | 2020-10-21 | 2023-06-27 | Bryan Ross Schmitt | Sanding table for attachment to a garbage can |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD1012051S1 (en) * | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
Citations (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD406852S (en) | 1997-11-14 | 1999-03-16 | Applied Materials, Inc. | Electrostatic chuck with improved spacing mask and workpiece detection device |
USD425919S (en) * | 1997-11-14 | 2000-05-30 | Applied Materials, Inc. | Electrostatic chuck with improved spacing mask and workpiece detection device |
USD490827S1 (en) * | 2002-12-20 | 2004-06-01 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
KR20070017255A (en) | 2005-08-06 | 2007-02-09 | 삼성전자주식회사 | Apparatus for fixing semiconductor substrates of plasma apparatus |
US20080190367A1 (en) | 2007-02-12 | 2008-08-14 | Samsung Electronics Co., Ltd. | Chuck assembly and high density plasma equipment having the same |
JP2008244079A (en) | 2007-03-27 | 2008-10-09 | Ulvac Japan Ltd | Film-forming apparatus |
USD621804S1 (en) * | 2009-08-07 | 2010-08-17 | Hon Hai Precision Industry Co., Ltd. | PCB for arranging LED lights |
US20110031111A1 (en) | 2009-08-07 | 2011-02-10 | Tokyo Electron Limited | Substrate processing apparatus, positioning method and focus ring installation method |
USD664249S1 (en) * | 2011-07-01 | 2012-07-24 | Applied Materials, Inc. | Flow blocker plate |
US20120329000A1 (en) | 2010-03-23 | 2012-12-27 | Osamu Hirakawa | Substrate processing apparatus, substrate processing method, program and computer storage medium |
US20140011153A1 (en) * | 2012-07-03 | 2014-01-09 | Watlow Electric Manufacturing Company | Pedestal construction with low coefficient of thermal expansion top |
US20140008349A1 (en) | 2012-07-03 | 2014-01-09 | Applied Materials, Inc. | Substrate support for substrate backside contamination control |
US20140144901A1 (en) | 2012-11-26 | 2014-05-29 | Applied Materials, Inc. | Substrate support with wire mesh plasma containment |
USD708651S1 (en) * | 2011-11-22 | 2014-07-08 | Applied Materials, Inc. | Electrostatic chuck |
US20140217665A1 (en) | 2013-02-01 | 2014-08-07 | Applied Materials, Inc. | Substrate support with controlled sealing gap |
TWD163540S (en) | 2013-03-28 | 2014-10-11 | 平田機工股份有限公司 | Wafer loading/unloading chamber cover |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
US20160002778A1 (en) | 2014-07-03 | 2016-01-07 | Applied Materials, Inc. | Substrate support with more uniform edge purge |
JP1547357S (en) | 2015-07-27 | 2016-04-11 | ||
TWD177006S (en) | 2014-12-25 | 2016-07-11 | 東京威力科創股份有限公司 | Cleaning brush part with polishing section for semiconductor manufacturing equipment |
US9779971B2 (en) | 2014-04-11 | 2017-10-03 | Applied Materials, Inc. | Methods and apparatus for rapidly cooling a substrate |
US20180044783A1 (en) | 2016-08-10 | 2018-02-15 | Applied Materials, Inc. | Thermally optimized rings |
USD813181S1 (en) * | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
TWD193203S (en) | 2016-12-12 | 2018-10-01 | 荏原製作所股份有限公司 | Elastic film for semiconductor surface polishing |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
US20190131163A1 (en) * | 2017-05-25 | 2019-05-02 | Ngk Insulators,Ltd. | Wafer susceptor |
TWD197827S (en) | 2017-12-19 | 2019-06-01 | 日商荏原製作所股份有限公 | Elastic film for semiconductor wafer polishing |
US20190318944A1 (en) * | 2018-04-12 | 2019-10-17 | Disco Corporation | Expanding method and expanding apparatus |
US20200343120A1 (en) | 2018-01-19 | 2020-10-29 | Ulvac, Inc. | Heater base and processing apparatus |
-
2019
- 2019-07-30 US US29/700,012 patent/USD931240S1/en active Active
-
2020
- 2020-01-08 TW TW109300093F patent/TWD213398S/en unknown
- 2020-01-08 TW TW109306863F patent/TWD211589S/en unknown
- 2020-01-30 JP JPD2020-1659F patent/JP1667762S/ja active Active
- 2020-01-30 JP JPD2020-1663F patent/JP1667763S/ja active Active
Patent Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD425919S (en) * | 1997-11-14 | 2000-05-30 | Applied Materials, Inc. | Electrostatic chuck with improved spacing mask and workpiece detection device |
USD406852S (en) | 1997-11-14 | 1999-03-16 | Applied Materials, Inc. | Electrostatic chuck with improved spacing mask and workpiece detection device |
USD490827S1 (en) * | 2002-12-20 | 2004-06-01 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
KR20070017255A (en) | 2005-08-06 | 2007-02-09 | 삼성전자주식회사 | Apparatus for fixing semiconductor substrates of plasma apparatus |
US20080190367A1 (en) | 2007-02-12 | 2008-08-14 | Samsung Electronics Co., Ltd. | Chuck assembly and high density plasma equipment having the same |
JP2008244079A (en) | 2007-03-27 | 2008-10-09 | Ulvac Japan Ltd | Film-forming apparatus |
USD621804S1 (en) * | 2009-08-07 | 2010-08-17 | Hon Hai Precision Industry Co., Ltd. | PCB for arranging LED lights |
US20110031111A1 (en) | 2009-08-07 | 2011-02-10 | Tokyo Electron Limited | Substrate processing apparatus, positioning method and focus ring installation method |
US20120329000A1 (en) | 2010-03-23 | 2012-12-27 | Osamu Hirakawa | Substrate processing apparatus, substrate processing method, program and computer storage medium |
USD664249S1 (en) * | 2011-07-01 | 2012-07-24 | Applied Materials, Inc. | Flow blocker plate |
USD708651S1 (en) * | 2011-11-22 | 2014-07-08 | Applied Materials, Inc. | Electrostatic chuck |
US20140011153A1 (en) * | 2012-07-03 | 2014-01-09 | Watlow Electric Manufacturing Company | Pedestal construction with low coefficient of thermal expansion top |
US20140008349A1 (en) | 2012-07-03 | 2014-01-09 | Applied Materials, Inc. | Substrate support for substrate backside contamination control |
US9490150B2 (en) | 2012-07-03 | 2016-11-08 | Applied Materials, Inc. | Substrate support for substrate backside contamination control |
US20140144901A1 (en) | 2012-11-26 | 2014-05-29 | Applied Materials, Inc. | Substrate support with wire mesh plasma containment |
US20140217665A1 (en) | 2013-02-01 | 2014-08-07 | Applied Materials, Inc. | Substrate support with controlled sealing gap |
TWD163540S (en) | 2013-03-28 | 2014-10-11 | 平田機工股份有限公司 | Wafer loading/unloading chamber cover |
USD716742S1 (en) * | 2013-09-13 | 2014-11-04 | Asm Ip Holding B.V. | Substrate supporter for semiconductor deposition apparatus |
USD723077S1 (en) * | 2013-12-03 | 2015-02-24 | Applied Materials, Inc. | Chuck carrier film |
US9779971B2 (en) | 2014-04-11 | 2017-10-03 | Applied Materials, Inc. | Methods and apparatus for rapidly cooling a substrate |
US20160002778A1 (en) | 2014-07-03 | 2016-01-07 | Applied Materials, Inc. | Substrate support with more uniform edge purge |
TWD177006S (en) | 2014-12-25 | 2016-07-11 | 東京威力科創股份有限公司 | Cleaning brush part with polishing section for semiconductor manufacturing equipment |
USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
JP1547357S (en) | 2015-07-27 | 2016-04-11 | ||
USD813181S1 (en) * | 2016-07-26 | 2018-03-20 | Hitachi Kokusai Electric Inc. | Cover of seal cap for reaction chamber of semiconductor |
US20180044783A1 (en) | 2016-08-10 | 2018-02-15 | Applied Materials, Inc. | Thermally optimized rings |
TWD193203S (en) | 2016-12-12 | 2018-10-01 | 荏原製作所股份有限公司 | Elastic film for semiconductor surface polishing |
USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
US20190131163A1 (en) * | 2017-05-25 | 2019-05-02 | Ngk Insulators,Ltd. | Wafer susceptor |
TWD197827S (en) | 2017-12-19 | 2019-06-01 | 日商荏原製作所股份有限公 | Elastic film for semiconductor wafer polishing |
US20200343120A1 (en) | 2018-01-19 | 2020-10-29 | Ulvac, Inc. | Heater base and processing apparatus |
US20190318944A1 (en) * | 2018-04-12 | 2019-10-17 | Disco Corporation | Expanding method and expanding apparatus |
Non-Patent Citations (5)
Title |
---|
"AMAT MCA E-Chuck". Found online Sep. 29, 2020 at ebay.com. Reference dated May 30, 2017. Retrieved from https://www.ebay.com/itm/AMAT-0010-03774-HEATER-ASSY-300mm-AMAT-MCA-E-Chuck-ESC-/262005122022. (Year: 2017). * |
"NTK Ceratec—Electrostatic Chuck". Found online Sep. 29, 2020 at dksh.com. Reference dated Aug. 7, 2017. Retrieved from https://tineye.com/search/3be6e76355441efd8d67fc67d0912dac27f2b87d?sort=crawl_date&order=asc&page=1. (Year: 2017). * |
"SemiXicon Electrostatic Chuck". Found online Sep. 29, 2020 at semixicon.com. Reference dated Jun. 17, 2017. Retrieved from https://web.archive.org/web/20170617035614/http://www.semixicon.com/. (Year: 2017). * |
International Search Report for PCT/US2020/042920, dated Nov. 6, 2020. |
Search Report for Taiwan Design Application No. 109306863, dated Jan. 19, 2021. |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1012051S1 (en) * | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
USD969760S1 (en) * | 2019-12-02 | 2022-11-15 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
USD956376S1 (en) * | 2019-12-18 | 2022-06-28 | Goldeep Ltd. | Vacuum bag valve |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD1021832S1 (en) | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
USD990533S1 (en) * | 2020-10-21 | 2023-06-27 | Bryan Ross Schmitt | Sanding table for attachment to a garbage can |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
Also Published As
Publication number | Publication date |
---|---|
JP1667763S (en) | 2020-09-07 |
TWD213398S (en) | 2021-08-21 |
JP1667762S (en) | 2020-09-07 |
TWD211589S (en) | 2021-05-11 |
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