TWD177006S - Cleaning brush part with polishing section for semiconductor manufacturing equipment - Google Patents
Cleaning brush part with polishing section for semiconductor manufacturing equipmentInfo
- Publication number
- TWD177006S TWD177006S TW104303363D01F TW104303363D01F TWD177006S TW D177006 S TWD177006 S TW D177006S TW 104303363D01 F TW104303363D01 F TW 104303363D01F TW 104303363D01 F TW104303363D01 F TW 104303363D01F TW D177006 S TWD177006 S TW D177006S
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- parts
- design
- article
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 6
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000002411 adverse Effects 0.000 abstract 1
Abstract
【物品用途】;本設計物品為一種清洗刷,其係使用於半導體製造裝置中,以除去會對基板曝光等造成不良影響之「形成於基板背面的凸部」或是「基板背面的附著物」;本設計物品在外圍具有研磨部,在其內側具有清洗部。本設計物品,如同表示使用狀態之參考圖1所示,藉由向基板背面強力按壓,並在研磨部接觸之狀態下旋轉,以進行基板背面之研磨;又,如同表示使用狀態之參考圖2所示,藉由在清洗部接觸基板背面之狀態下旋轉,以除去由於研磨造成之研磨屑等。透過本設計物品之使用,能以一個清洗刷進行研磨及清洗,故能短縮清洗步驟所需之時間,並能防止半導體製造裝置之製造處理能力降低。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分;以實線表示之部分,則為欲主張部分設計之部分;圖中之鏈線,係表示「主張部分設計之部分」與「不主張設計之部分」的邊界。[Use of article] This designed article is a cleaning brush that is used in semiconductor manufacturing equipment to remove "convex portions formed on the back of the substrate" or "adhesives on the back of the substrate" that may adversely affect the exposure of the substrate. ”; This designed article has a grinding part on the outside and a cleaning part on the inside. This design article, as shown in the reference figure 1 showing the use state, grinds the back side of the substrate by strongly pressing the back side of the substrate and rotating with the polishing part in contact; also, as shown in the reference figure 2 showing the use state. As shown, by rotating with the cleaning part in contact with the back surface of the substrate, grinding debris etc. caused by grinding are removed. Through the use of this designed article, one cleaning brush can be used for grinding and cleaning, so the time required for the cleaning step can be shortened, and the manufacturing processing capacity of the semiconductor manufacturing device can be prevented from being reduced. ;[Design Description];The dotted line parts disclosed in the drawing are the parts of this case that do not advocate design; the parts represented by solid lines are the parts that are intended to be partially designed; the chain lines in the figure indicate "partial design is advocated" The boundary between "parts that do not advocate design" and "parts that do not advocate design".
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2014-29094F JP1528261S (en) | 2014-12-25 | 2014-12-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD177006S true TWD177006S (en) | 2016-07-11 |
Family
ID=53779669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104303363D01F TWD177006S (en) | 2014-12-25 | 2015-06-23 | Cleaning brush part with polishing section for semiconductor manufacturing equipment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP1528261S (en) |
TW (1) | TWD177006S (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD931240S1 (en) | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
-
2014
- 2014-12-25 JP JPD2014-29094F patent/JP1528261S/ja active Active
-
2015
- 2015-06-23 TW TW104303363D01F patent/TWD177006S/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD931240S1 (en) | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
Also Published As
Publication number | Publication date |
---|---|
JP1528261S (en) | 2016-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWD179672S (en) | Part of the substrate retaining ring | |
USD808349S1 (en) | Elastic membrane for semiconductor wafer polishing apparatus | |
TWD180337S (en) | Dresser disc | |
TWD188262S (en) | Part of the cleaning brush with the grinding part for the semiconductor manufacturing equipment | |
EP2762274A3 (en) | Method of polishing back surface of substrate and substrate processing apparatus | |
TWD179095S (en) | Substrate retaining ring | |
TWD169067S (en) | Part of the cleaning component of the substrate transfer machine for semiconductor processing machines | |
JP2015160250A5 (en) | ||
TWD179673S (en) | Sponge part for cleaning the substrate | |
TWD162134S (en) | Roller shaft for substrate cleaning | |
TWD191550S (en) | Cleaning article | |
TWD184278S (en) | Sponge part for cleaning the substrate | |
TWD167109S (en) | Substrate retaining ring | |
TWD177006S (en) | Cleaning brush part with polishing section for semiconductor manufacturing equipment | |
TWD173082S (en) | Cleaning brush part with polishing section for semiconductor manufacturing equipment | |
TWD173084S (en) | Cleaning brush part with polishing section for semiconductor manufacturing equipment | |
TWD172247S (en) | Part of the cleaning component of the substrate transfer machine for semiconductor processing machines | |
TWD179918S (en) | Part of the roller used for cleaning the substrate | |
TWD170203S (en) | Roller shaft for semiconductor cleaning | |
TWD177222S (en) | Roller shaft for semiconductor cleaning | |
TWD179916S (en) | Part of the roller used for cleaning the substrate | |
TWD179919S (en) | Part of the roller used for cleaning the substrate | |
TWD179917S (en) | Part of the roller used for cleaning the substrate | |
TWD168373S (en) | Part of the elastic film used in semiconductor wafer grinding equipment | |
TWD177223S (en) | Roller shaft for semiconductor cleaning |