TWD177006S - Cleaning brush part with polishing section for semiconductor manufacturing equipment - Google Patents

Cleaning brush part with polishing section for semiconductor manufacturing equipment

Info

Publication number
TWD177006S
TWD177006S TW104303363D01F TW104303363D01F TWD177006S TW D177006 S TWD177006 S TW D177006S TW 104303363D01 F TW104303363D01 F TW 104303363D01F TW 104303363D01 F TW104303363D01 F TW 104303363D01F TW D177006 S TWD177006 S TW D177006S
Authority
TW
Taiwan
Prior art keywords
substrate
parts
design
article
cleaning
Prior art date
Application number
TW104303363D01F
Other languages
Chinese (zh)
Inventor
Kenji Yada
Masahiro Fukuda
Taro Yamamoto
Noboru Nakashima
Original Assignee
東京威力科創股份有限公司
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司, Tokyo Electron Ltd filed Critical 東京威力科創股份有限公司
Publication of TWD177006S publication Critical patent/TWD177006S/en

Links

Abstract

【物品用途】;本設計物品為一種清洗刷,其係使用於半導體製造裝置中,以除去會對基板曝光等造成不良影響之「形成於基板背面的凸部」或是「基板背面的附著物」;本設計物品在外圍具有研磨部,在其內側具有清洗部。本設計物品,如同表示使用狀態之參考圖1所示,藉由向基板背面強力按壓,並在研磨部接觸之狀態下旋轉,以進行基板背面之研磨;又,如同表示使用狀態之參考圖2所示,藉由在清洗部接觸基板背面之狀態下旋轉,以除去由於研磨造成之研磨屑等。透過本設計物品之使用,能以一個清洗刷進行研磨及清洗,故能短縮清洗步驟所需之時間,並能防止半導體製造裝置之製造處理能力降低。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分;以實線表示之部分,則為欲主張部分設計之部分;圖中之鏈線,係表示「主張部分設計之部分」與「不主張設計之部分」的邊界。[Use of article] This designed article is a cleaning brush that is used in semiconductor manufacturing equipment to remove "convex portions formed on the back of the substrate" or "adhesives on the back of the substrate" that may adversely affect the exposure of the substrate. ”; This designed article has a grinding part on the outside and a cleaning part on the inside. This design article, as shown in the reference figure 1 showing the use state, grinds the back side of the substrate by strongly pressing the back side of the substrate and rotating with the polishing part in contact; also, as shown in the reference figure 2 showing the use state. As shown, by rotating with the cleaning part in contact with the back surface of the substrate, grinding debris etc. caused by grinding are removed. Through the use of this designed article, one cleaning brush can be used for grinding and cleaning, so the time required for the cleaning step can be shortened, and the manufacturing processing capacity of the semiconductor manufacturing device can be prevented from being reduced. ;[Design Description];The dotted line parts disclosed in the drawing are the parts of this case that do not advocate design; the parts represented by solid lines are the parts that are intended to be partially designed; the chain lines in the figure indicate "partial design is advocated" The boundary between "parts that do not advocate design" and "parts that do not advocate design".

TW104303363D01F 2014-12-25 2015-06-23 Cleaning brush part with polishing section for semiconductor manufacturing equipment TWD177006S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2014-29094F JP1528261S (en) 2014-12-25 2014-12-25

Publications (1)

Publication Number Publication Date
TWD177006S true TWD177006S (en) 2016-07-11

Family

ID=53779669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104303363D01F TWD177006S (en) 2014-12-25 2015-06-23 Cleaning brush part with polishing section for semiconductor manufacturing equipment

Country Status (2)

Country Link
JP (1) JP1528261S (en)
TW (1) TWD177006S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD931240S1 (en) 2019-07-30 2021-09-21 Applied Materials, Inc. Substrate support pedestal

Also Published As

Publication number Publication date
JP1528261S (en) 2016-06-27

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