TWD179095S - Substrate retaining ring - Google Patents
Substrate retaining ringInfo
- Publication number
- TWD179095S TWD179095S TW105300718F TW105300718F TWD179095S TW D179095 S TWD179095 S TW D179095S TW 105300718 F TW105300718 F TW 105300718F TW 105300718 F TW105300718 F TW 105300718F TW D179095 S TWD179095 S TW D179095S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- retaining ring
- substrate
- substrate retaining
- same
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是基板保持環,例如:如「使用狀態之參考圖」所示,應用於半導體等製造時的基板研磨工程中,將晶圓等基板保持在環內,來研磨基板的單面。;【設計說明】;後視圖與前視圖相同,後視圖省略。;左側視圖與右側視圖相同,左側視圖省略。[Use of article]; The article designed in this design is a substrate retaining ring. For example, as shown in the "Reference Picture of Used State", it is used in the substrate polishing process during the manufacturing of semiconductors, etc., to hold substrates such as wafers in the ring. Grind one side of the substrate. ;[Design Description];The rear view is the same as the front view, and the rear view is omitted. ;The left view is the same as the right view, and the left view is omitted.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015018612 | 2015-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD179095S true TWD179095S (en) | 2016-10-21 |
Family
ID=59981668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105300718F TWD179095S (en) | 2015-08-25 | 2016-02-17 | Substrate retaining ring |
Country Status (2)
Country | Link |
---|---|
US (1) | USD799437S1 (en) |
TW (1) | TWD179095S (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1544543S (en) * | 2015-05-14 | 2019-02-18 | ||
JP1584784S (en) * | 2017-01-31 | 2017-08-28 | ||
USD861449S1 (en) * | 2018-02-05 | 2019-10-01 | QuickCinch, LLC | Wire repair and refurbishment tool |
USD949116S1 (en) * | 2019-05-03 | 2022-04-19 | Lumileds Holding B.V. | Flexible circuit board with connectors |
USD940670S1 (en) * | 2019-09-26 | 2022-01-11 | Willbe S&T Co., Ltd. | Retainer ring for chemical mechanical polishing device |
USD998575S1 (en) * | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
USD1013841S1 (en) * | 2020-04-20 | 2024-02-06 | Reliance Worldwide Corporation | Retaining ring |
JP1671171S (en) * | 2020-05-22 | 2020-10-26 | ||
USD981459S1 (en) * | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
USD997111S1 (en) * | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6068548A (en) * | 1997-12-17 | 2000-05-30 | Intel Corporation | Mechanically stabilized retaining ring for chemical mechanical polishing |
US6186880B1 (en) * | 1999-09-29 | 2001-02-13 | Semiconductor Equipment Technology | Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
JP4605853B2 (en) * | 2000-04-20 | 2011-01-05 | 東京エレクトロン株式会社 | Heat treatment apparatus, heat treatment system, and heat treatment method |
US20030070757A1 (en) * | 2001-09-07 | 2003-04-17 | Demeyer Dale E. | Method and apparatus for two-part CMP retaining ring |
DE10247179A1 (en) * | 2002-10-02 | 2004-04-15 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing device |
AU2003300375A1 (en) * | 2002-10-11 | 2004-05-04 | Semplastics, L.L.C. | Retaining ring for use on a carrier of a polishing apparatus |
JP5296985B2 (en) * | 2003-11-13 | 2013-09-25 | アプライド マテリアルズ インコーポレイテッド | Retaining ring with shaping surface |
US7029386B2 (en) * | 2004-06-10 | 2006-04-18 | R & B Plastics, Inc. | Retaining ring assembly for use in chemical mechanical polishing |
KR20080031870A (en) * | 2005-05-24 | 2008-04-11 | 엔테그리스, 아이엔씨. | Cmp retaining ring |
US7789736B2 (en) * | 2006-10-13 | 2010-09-07 | Applied Materials, Inc. | Stepped retaining ring |
USD605206S1 (en) * | 2008-05-07 | 2009-12-01 | Komatsu Ltd. | Fan shroud for construction machinery |
US8298046B2 (en) * | 2009-10-21 | 2012-10-30 | SPM Technology, Inc. | Retaining rings |
USD638951S1 (en) * | 2009-11-13 | 2011-05-31 | 3M Innovative Properties Company | Sample processing disk cover |
USD667561S1 (en) * | 2009-11-13 | 2012-09-18 | 3M Innovative Properties Company | Sample processing disk cover |
US8491267B2 (en) * | 2010-08-27 | 2013-07-23 | Pratt & Whitney Canada Corp. | Retaining ring arrangement for a rotary assembly |
USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
USD709536S1 (en) * | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
KR101328411B1 (en) * | 2012-11-05 | 2013-11-13 | 한상효 | Method of manufacturing retainer ring for polishing wafer |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
KR101455311B1 (en) * | 2013-07-11 | 2014-10-27 | 주식회사 윌비에스엔티 | Retainner Ring of Chemical Mechanical Polishing Apparatus |
JP6403981B2 (en) | 2013-11-13 | 2018-10-10 | 株式会社荏原製作所 | Substrate holding device, polishing device, polishing method, and retainer ring |
JP6475518B2 (en) * | 2015-03-03 | 2019-02-27 | 株式会社ディスコ | Wafer processing method |
JP1546800S (en) * | 2015-06-12 | 2016-03-28 |
-
2016
- 2016-02-17 TW TW105300718F patent/TWD179095S/en unknown
- 2016-02-24 US US29/555,718 patent/USD799437S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD799437S1 (en) | 2017-10-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWD179095S (en) | Substrate retaining ring | |
TWD181303S (en) | Wafer carrier | |
TWD166332S (en) | Part of the wafer boat for substrate processing equipment | |
TWD179672S (en) | Part of the substrate retaining ring | |
TWD165429S (en) | Wafer boats for semiconductor manufacturing equipment | |
TWD175852S (en) | Upper chamber for plasma treatment device | |
TWD181302S (en) | Wafer carrier | |
TWD175855S (en) | Lower chamber for plasma treatment device | |
TWD167109S (en) | Substrate retaining ring | |
TWD161688S (en) | Semiconductor manufacturing equipment wafer boat | |
TWD181304S (en) | Wafer carrier | |
TWD179673S (en) | Sponge part for cleaning the substrate | |
TWD162133S (en) | Roller shaft for substrate cleaning | |
TWD163542S (en) | Wafer boat for substrate processing equipment | |
TWD184278S (en) | Sponge part for cleaning the substrate | |
TWD174920S (en) | Gas supply nozzle for substrate processing equipment | |
TWD162134S (en) | Roller shaft for substrate cleaning | |
TWD165013S (en) | Portion of electrostatic chuck | |
TWD175120S (en) | Substrate retaining ring | |
TWD167110S (en) | Substrate retaining ring | |
TWD175850S (en) | Substrate retaining ring | |
TWD179918S (en) | Part of the roller used for cleaning the substrate | |
TWD186397S (en) | Discharge chamber for plasma processing equipment | |
TWD215851S (en) | Substrate retaining ring | |
TWD167983S (en) | Substrate retaining ring |