TWD179095S - Substrate retaining ring - Google Patents

Substrate retaining ring

Info

Publication number
TWD179095S
TWD179095S TW105300718F TW105300718F TWD179095S TW D179095 S TWD179095 S TW D179095S TW 105300718 F TW105300718 F TW 105300718F TW 105300718 F TW105300718 F TW 105300718F TW D179095 S TWD179095 S TW D179095S
Authority
TW
Taiwan
Prior art keywords
view
retaining ring
substrate
substrate retaining
same
Prior art date
Application number
TW105300718F
Other languages
Chinese (zh)
Inventor
Osamu Nabeya
Hozumi Yasuda
Makoto Fukushima
Shingo Togashi
Keisuke Namiki
Satoru Yamaki
Original Assignee
荏原製作所股份有限公司
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司, Ebara Corp filed Critical 荏原製作所股份有限公司
Publication of TWD179095S publication Critical patent/TWD179095S/en

Links

Abstract

【物品用途】;本設計的物品是基板保持環,例如:如「使用狀態之參考圖」所示,應用於半導體等製造時的基板研磨工程中,將晶圓等基板保持在環內,來研磨基板的單面。;【設計說明】;後視圖與前視圖相同,後視圖省略。;左側視圖與右側視圖相同,左側視圖省略。[Use of article]; The article designed in this design is a substrate retaining ring. For example, as shown in the "Reference Picture of Used State", it is used in the substrate polishing process during the manufacturing of semiconductors, etc., to hold substrates such as wafers in the ring. Grind one side of the substrate. ;[Design Description];The rear view is the same as the front view, and the rear view is omitted. ;The left view is the same as the right view, and the left view is omitted.

TW105300718F 2015-08-25 2016-02-17 Substrate retaining ring TWD179095S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015018612 2015-08-25

Publications (1)

Publication Number Publication Date
TWD179095S true TWD179095S (en) 2016-10-21

Family

ID=59981668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105300718F TWD179095S (en) 2015-08-25 2016-02-17 Substrate retaining ring

Country Status (2)

Country Link
US (1) USD799437S1 (en)
TW (1) TWD179095S (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1544543S (en) * 2015-05-14 2019-02-18
JP1584784S (en) * 2017-01-31 2017-08-28
USD861449S1 (en) * 2018-02-05 2019-10-01 QuickCinch, LLC Wire repair and refurbishment tool
USD949116S1 (en) * 2019-05-03 2022-04-19 Lumileds Holding B.V. Flexible circuit board with connectors
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1013841S1 (en) * 2020-04-20 2024-02-06 Reliance Worldwide Corporation Retaining ring
JP1671171S (en) * 2020-05-22 2020-10-26
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6186880B1 (en) * 1999-09-29 2001-02-13 Semiconductor Equipment Technology Recyclable retaining ring assembly for a chemical mechanical polishing apparatus
JP4605853B2 (en) * 2000-04-20 2011-01-05 東京エレクトロン株式会社 Heat treatment apparatus, heat treatment system, and heat treatment method
US20030070757A1 (en) * 2001-09-07 2003-04-17 Demeyer Dale E. Method and apparatus for two-part CMP retaining ring
DE10247179A1 (en) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing device
AU2003300375A1 (en) * 2002-10-11 2004-05-04 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
JP5296985B2 (en) * 2003-11-13 2013-09-25 アプライド マテリアルズ インコーポレイテッド Retaining ring with shaping surface
US7029386B2 (en) * 2004-06-10 2006-04-18 R & B Plastics, Inc. Retaining ring assembly for use in chemical mechanical polishing
KR20080031870A (en) * 2005-05-24 2008-04-11 엔테그리스, 아이엔씨. Cmp retaining ring
US7789736B2 (en) * 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring
USD605206S1 (en) * 2008-05-07 2009-12-01 Komatsu Ltd. Fan shroud for construction machinery
US8298046B2 (en) * 2009-10-21 2012-10-30 SPM Technology, Inc. Retaining rings
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
US8491267B2 (en) * 2010-08-27 2013-07-23 Pratt & Whitney Canada Corp. Retaining ring arrangement for a rotary assembly
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
KR101328411B1 (en) * 2012-11-05 2013-11-13 한상효 Method of manufacturing retainer ring for polishing wafer
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
KR101455311B1 (en) * 2013-07-11 2014-10-27 주식회사 윌비에스엔티 Retainner Ring of Chemical Mechanical Polishing Apparatus
JP6403981B2 (en) 2013-11-13 2018-10-10 株式会社荏原製作所 Substrate holding device, polishing device, polishing method, and retainer ring
JP6475518B2 (en) * 2015-03-03 2019-02-27 株式会社ディスコ Wafer processing method
JP1546800S (en) * 2015-06-12 2016-03-28

Also Published As

Publication number Publication date
USD799437S1 (en) 2017-10-10

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