TWD167110S - Substrate retaining ring - Google Patents
Substrate retaining ringInfo
- Publication number
- TWD167110S TWD167110S TW102307326D01F TW102307326D01F TWD167110S TW D167110 S TWD167110 S TW D167110S TW 102307326D01 F TW102307326D01 F TW 102307326D01F TW 102307326D01 F TW102307326D01 F TW 102307326D01F TW D167110 S TWD167110 S TW D167110S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- view
- substrate
- retaining ring
- original
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是基板保持環，如「使用狀態參考圖」所示，應用於半導體等製造時的基板研磨工程中，將晶圓等基板保持在環內，用以研磨基板的單面。;【設計說明】;本衍生設計與原設計之外觀差異在於：如底面立體圖、仰視圖及前視圖所示，本設計與原設計的底部溝槽及邊緣等略有所不同，因此本案與原設計案之差異些微，不影響原設計與衍生設計之近似。;後視圖、右側視圖及左側視圖均與前視圖相同，皆予省略。[Use of article]; The article designed in this design is a substrate retaining ring. As shown in the "Usage Reference Picture", it is used in the substrate polishing process during the manufacturing of semiconductors, etc., to hold substrates such as wafers in the ring and to polish the substrate. of one side. ;[Design Description];The difference in appearance between this derivative design and the original design is: as shown in the bottom perspective view, bottom view and front view, the bottom grooves and edges of this design are slightly different from the original design. Therefore, this design is different from the original design. The differences between the designs are slight and do not affect the similarity between the original design and the derived design. ;The rear view, right side view and left side view are all the same as the front view and are omitted.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2013-13457F JP1495083S (en) | 2013-06-14 | 2013-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD167110S true TWD167110S (en) | 2015-04-11 |
Family
ID=58418611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102307326D01F TWD167110S (en) | 2013-06-14 | 2013-11-14 | Substrate retaining ring |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1495083S (en) |
| TW (1) | TWD167110S (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11049760B2 (en) | 2016-03-04 | 2021-06-29 | Applied Materials, Inc. | Universal process kit |
-
2013
- 2013-06-14 JP JPD2013-13457F patent/JP1495083S/ja active Active
- 2013-11-14 TW TW102307326D01F patent/TWD167110S/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11049760B2 (en) | 2016-03-04 | 2021-06-29 | Applied Materials, Inc. | Universal process kit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1495083S (en) | 2017-04-03 |
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