TWD180127S - sealing ring - Google Patents
sealing ringInfo
- Publication number
- TWD180127S TWD180127S TW105302077D01F TW105302077D01F TWD180127S TW D180127 S TWD180127 S TW D180127S TW 105302077D01 F TW105302077D01 F TW 105302077D01F TW 105302077D01 F TW105302077D01 F TW 105302077D01F TW D180127 S TWD180127 S TW D180127S
- Authority
- TW
- Taiwan
- Prior art keywords
- view
- wafer
- design
- sealing ring
- symmetrical
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title abstract 2
- 238000007747 plating Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是密封環。;【設計說明】;本物品如「使用狀態參考圖」所示,是覆蓋在晶圓的周端部(邊緣部)的構件,該晶圓是被保持在基板電鍍裝置等的基板座的支承面上;該物品是當將晶圓被浸漬於電鍍液時,防止要進行電鍍的面以外的邊緣部、背面等接觸到電鍍液。本物品因應晶圓的尺寸而製作成直徑約20cm~45cm的大小供使用。;後視圖與前視圖對稱、左側視圖與右側視圖對稱,均省略之。;與原設計的差異在於:如「C-D部放大圖」所示,本案於該部位較原設計略為突出,該等差異細微,不影響兩案的近似。[Use of item]; The item in this design is a sealing ring. ;[Design Description];As shown in the "Usage Reference Picture", this article is a member that covers the peripheral end portion (edge portion) of a wafer that is held by a substrate holder in a substrate plating device or the like. Surface; This article is used to prevent the edges and back surfaces other than the surface to be plated from coming into contact with the plating solution when the wafer is immersed in the plating solution. This product is produced with a diameter of about 20cm~45cm according to the size of the wafer for use. ;The rear view is symmetrical with the front view, and the left view is symmetrical with the right view, so they are omitted. ; The difference from the original design is: as shown in the "enlarged view of Part C-D", this part of the case is slightly more prominent than the original design. These differences are subtle and do not affect the similarity of the two cases.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-26516F JP1556537S (en) | 2015-11-27 | 2015-11-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD180127S true TWD180127S (en) | 2016-12-11 |
Family
ID=56612379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105302077D01F TWD180127S (en) | 2015-11-27 | 2016-04-20 | sealing ring |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP1556537S (en) |
TW (1) | TWD180127S (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD871561S1 (en) | 2017-11-17 | 2019-12-31 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD897504S1 (en) | 2017-11-17 | 2020-09-29 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD927656S1 (en) | 2018-09-11 | 2021-08-10 | Valqua, Ltd. | Seal for vacuum gate valve |
-
2015
- 2015-11-27 JP JPD2015-26516F patent/JP1556537S/ja active Active
-
2016
- 2016-04-20 TW TW105302077D01F patent/TWD180127S/en unknown
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD871561S1 (en) | 2017-11-17 | 2019-12-31 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD897504S1 (en) | 2017-11-17 | 2020-09-29 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD922545S1 (en) | 2017-11-17 | 2021-06-15 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD923159S1 (en) | 2017-11-17 | 2021-06-22 | Valqua, Ltd. | Seal member for use in semiconductor production apparatus |
USD923158S1 (en) | 2017-11-17 | 2021-06-22 | Valqua, Ltd. | Seal members for use in semiconductor production apparatus |
USD927656S1 (en) | 2018-09-11 | 2021-08-10 | Valqua, Ltd. | Seal for vacuum gate valve |
Also Published As
Publication number | Publication date |
---|---|
JP1556537S (en) | 2016-08-15 |
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