TWD180129S - sealing ring part - Google Patents

sealing ring part

Info

Publication number
TWD180129S
TWD180129S TW105302078D01F TW105302078D01F TWD180129S TW D180129 S TWD180129 S TW D180129S TW 105302078D01 F TW105302078D01 F TW 105302078D01F TW 105302078D01 F TW105302078D01 F TW 105302078D01F TW D180129 S TWD180129 S TW D180129S
Authority
TW
Taiwan
Prior art keywords
design
case
wafer
advocated
item
Prior art date
Application number
TW105302078D01F
Other languages
Chinese (zh)
Inventor
Matsutaro Miyamoto
Original Assignee
荏原製作所股份有限公司
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司, Ebara Corp filed Critical 荏原製作所股份有限公司
Publication of TWD180129S publication Critical patent/TWD180129S/en

Links

Abstract

【物品用途】;本設計的物品是密封環。;【設計說明】;本物品如「使用狀態參考圖」所示,是覆蓋在晶圓的周端部(邊緣部)的構件,該晶圓是被保持在基板電鍍裝置等的基板座的支承面上;該物品是當將晶圓被浸漬於電鍍液時,防止要進行電鍍的面以外的邊緣部、背面等接觸到電鍍液。本物品因應晶圓的尺寸而製作成直徑約20cm~45cm的大小供使用。;後視圖與前視圖對稱,後視圖省略。;圖式所揭露之實線部分,為本案主張設計之部分,虛線部分為本案不主張設計之部分。;圖式所揭露之一點鏈線,係界定本案所欲主張之範圍,該一點鏈線本身為本案不主張設計之部分。;與原設計的差異在於:如「B部放大圖」所示,本案斷面形狀原設計略異,該等差異細微,不影響兩案的近似。[Use of item]; The item in this design is a sealing ring. ;[Design Description];As shown in the "Usage Reference Picture", this article is a member that covers the peripheral end portion (edge portion) of a wafer that is held by a substrate holder in a substrate plating device or the like. Surface; This article is used to prevent the edges and back surfaces other than the surface to be plated from coming into contact with the plating solution when the wafer is immersed in the plating solution. This product is produced with a diameter of about 20cm~45cm according to the size of the wafer for use. ;The rear view is symmetrical to the front view, and the rear view is omitted. ; The solid line part disclosed in the drawing is the part where the design of this case is advocated, and the dotted line part is the part of the case where the design is not advocated. ;The dotted chain line disclosed in the diagram defines the scope of the claim in this case. The dotted chain line itself is a part of the design that is not claimed in this case. ; The difference from the original design is: as shown in the "enlarged view of Part B", the cross-sectional shape of this case is slightly different from the original design. These differences are subtle and do not affect the similarity between the two cases.

TW105302078D01F 2015-11-27 2016-04-20 sealing ring part TWD180129S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-26517F JP1556538S (en) 2015-11-27 2015-11-27

Publications (1)

Publication Number Publication Date
TWD180129S true TWD180129S (en) 2016-12-11

Family

ID=56612427

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105302078D01F TWD180129S (en) 2015-11-27 2016-04-20 sealing ring part

Country Status (2)

Country Link
JP (1) JP1556538S (en)
TW (1) TWD180129S (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD821552S1 (en) 2016-11-29 2018-06-26 Nippon Valqua Industries, Ltd. Composite seal
USD822181S1 (en) 2016-11-29 2018-07-03 Nippon Valqua Industries, Ltd. Composite seal
USD864361S1 (en) 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD871561S1 (en) 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD877865S1 (en) 2016-11-29 2020-03-10 Valqua, Ltd. Seal
USD885444S1 (en) 2017-12-19 2020-05-26 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD897504S1 (en) 2017-11-17 2020-09-29 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD898171S1 (en) 2017-12-19 2020-10-06 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD905761S1 (en) 2018-07-24 2020-12-22 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909323S1 (en) 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD821552S1 (en) 2016-11-29 2018-06-26 Nippon Valqua Industries, Ltd. Composite seal
USD822181S1 (en) 2016-11-29 2018-07-03 Nippon Valqua Industries, Ltd. Composite seal
USD877865S1 (en) 2016-11-29 2020-03-10 Valqua, Ltd. Seal
USD864361S1 (en) 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD871561S1 (en) 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD923159S1 (en) 2017-11-17 2021-06-22 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD897504S1 (en) 2017-11-17 2020-09-29 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD923158S1 (en) 2017-11-17 2021-06-22 Valqua, Ltd. Seal members for use in semiconductor production apparatus
USD922545S1 (en) 2017-11-17 2021-06-15 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD922547S1 (en) 2017-12-19 2021-06-15 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD898171S1 (en) 2017-12-19 2020-10-06 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD885444S1 (en) 2017-12-19 2020-05-26 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD919669S1 (en) 2018-07-24 2021-05-18 Valqua, Ltd. Seal member for semiconductor production apparatus
USD919670S1 (en) 2018-07-24 2021-05-18 Valqua, Ltd. Seal member for semiconductor production apparatus
USD905761S1 (en) 2018-07-24 2020-12-22 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909323S1 (en) 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus

Also Published As

Publication number Publication date
JP1556538S (en) 2016-08-15

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