USD940670S1 - Retainer ring for chemical mechanical polishing device - Google Patents

Retainer ring for chemical mechanical polishing device Download PDF

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Publication number
USD940670S1
USD940670S1 US29/728,917 US202029728917F USD940670S US D940670 S1 USD940670 S1 US D940670S1 US 202029728917 F US202029728917 F US 202029728917F US D940670 S USD940670 S US D940670S
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US
United States
Prior art keywords
mechanical polishing
chemical mechanical
retainer ring
polishing device
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/728,917
Inventor
Jinwoo Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Willbe S&t Co Ltd
Original Assignee
Willbe S&t Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Willbe S&t Co Ltd filed Critical Willbe S&t Co Ltd
Assigned to WILLBE S&T CO., LTD. reassignment WILLBE S&T CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, JINWOO
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Publication of USD940670S1 publication Critical patent/USD940670S1/en
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Description

FIG. 1 is a top perspective view of a retainer ring for chemical mechanical polishing device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a bottom perspective view thereof.
The broken lines in the figures depict portions of the retainer ring for chemical mechanical polishing device which form no part of the claimed design.

Claims (1)

    CLAIM
  1. I claim the ornamental design for a retainer ring for chemical mechanical polishing device, as shown and described.
US29/728,917 2019-09-26 2020-03-23 Retainer ring for chemical mechanical polishing device Active USD940670S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR30-2019-0046507 2019-09-26
KR20190046507 2019-09-26

Publications (1)

Publication Number Publication Date
USD940670S1 true USD940670S1 (en) 2022-01-11

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ID=79168095

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/728,917 Active USD940670S1 (en) 2019-09-26 2020-03-23 Retainer ring for chemical mechanical polishing device

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US (1) USD940670S1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040065412A1 (en) * 2002-10-02 2004-04-08 Ensinger Kunststofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
US20080171500A1 (en) * 2007-01-16 2008-07-17 Tokyo Seimitsu Co., Ltd Retainer ring for polishing head
US20110065368A1 (en) * 2009-09-16 2011-03-17 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US20120309276A1 (en) * 2011-05-31 2012-12-06 Kim Choon-Goang Retainer rings of chemical mechanical polishing apparatus and methods of manufacturing the same
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US20150050870A1 (en) * 2013-08-13 2015-02-19 Cnus Co., Ltd. Retainer ring structure for chemical-mechanical polishing machine
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD767234S1 (en) * 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD783922S1 (en) * 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD815385S1 (en) * 2016-10-13 2018-04-10 Entegris, Inc. Wafer support ring
US20180264621A1 (en) * 2014-12-08 2018-09-20 Hyun Jeong Yoo Retainer ring for carrier head for chemical polishing apparatus and carrier head comprising same
USD917825S1 (en) * 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040065412A1 (en) * 2002-10-02 2004-04-08 Ensinger Kunststofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040077167A1 (en) * 2002-10-11 2004-04-22 Willis George D. Retaining ring for use on a carrier of a polishing apparatus
US20080171500A1 (en) * 2007-01-16 2008-07-17 Tokyo Seimitsu Co., Ltd Retainer ring for polishing head
US20110065368A1 (en) * 2009-09-16 2011-03-17 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US8517803B2 (en) * 2009-09-16 2013-08-27 SPM Technology, Inc. Retaining ring for chemical mechanical polishing
US20120309276A1 (en) * 2011-05-31 2012-12-06 Kim Choon-Goang Retainer rings of chemical mechanical polishing apparatus and methods of manufacturing the same
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
US20150050870A1 (en) * 2013-08-13 2015-02-19 Cnus Co., Ltd. Retainer ring structure for chemical-mechanical polishing machine
USD724553S1 (en) * 2013-09-13 2015-03-17 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD716742S1 (en) * 2013-09-13 2014-11-04 Asm Ip Holding B.V. Substrate supporter for semiconductor deposition apparatus
USD783922S1 (en) * 2014-12-08 2017-04-11 Entegris, Inc. Wafer support ring
US20180264621A1 (en) * 2014-12-08 2018-09-20 Hyun Jeong Yoo Retainer ring for carrier head for chemical polishing apparatus and carrier head comprising same
USD767234S1 (en) * 2015-03-02 2016-09-20 Entegris, Inc. Wafer support ring
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD815385S1 (en) * 2016-10-13 2018-04-10 Entegris, Inc. Wafer support ring
USD917825S1 (en) * 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Kyodo International CMP Retaining Ring", Aug. 27, 2015, Kyodo-Inc.co.jp, site visited Nov. 1, 2021: https://web.archive.org/web/20150827052115/http://www.kyodo-inc.co.jp/english/electronics/parts/index.html (Year: 2015). *
"Novellus Wafer Retaining Ring CMP Polishing", Apr. 17, 2017, Ebay.com, site visited Nov. 1, 2021: https://www.ebay.com/itm/301515679216 (Year: 2017). *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD962183S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD962184S1 (en) * 2019-07-11 2022-08-30 Kokusai Electric Corporation Retainer plate of top heater for wafer processing furnace
USD981459S1 (en) * 2021-06-16 2023-03-21 Ebara Corporation Retaining ring for substrate

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