USD767234S1 - Wafer support ring - Google Patents

Wafer support ring Download PDF

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Publication number
USD767234S1
USD767234S1 US29/519,122 US201529519122F USD767234S US D767234 S1 USD767234 S1 US D767234S1 US 201529519122 F US201529519122 F US 201529519122F US D767234 S USD767234 S US D767234S
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US
United States
Prior art keywords
support ring
wafer support
view
wafer
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/519,122
Inventor
Eric A. KIRKLAND
Russ V. Raschke
Jason T. STEFFENS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Priority to US29/519,122 priority Critical patent/USD767234S1/en
Assigned to ENTEGRIS, INC. reassignment ENTEGRIS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIRKLAND, ERIC A., RASCHKE, RUSS V., STEFFENS, JASON T.
Priority to TW104304797F priority patent/TWD175851S/en
Application granted granted Critical
Publication of USD767234S1 publication Critical patent/USD767234S1/en
Assigned to GOLDMAN SACHS BANK USA reassignment GOLDMAN SACHS BANK USA SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ENTEGRIS, INC., SAES PURE GAS, INC.
Assigned to MORGAN STANLEY SENIOR FUNDING, INC. reassignment MORGAN STANLEY SENIOR FUNDING, INC. ASSIGNMENT OF PATENT SECURITY INTEREST RECORDED AT REEL/FRAME 048811/0679 Assignors: GOLDMAN SACHS BANK USA
Assigned to TRUIST BANK, AS NOTES COLLATERAL AGENT reassignment TRUIST BANK, AS NOTES COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CMC MATERIALS, INC., ENTEGRIS GP, INC., ENTEGRIS, INC., INTERNATIONAL TEST SOLUTIONS, LLC, POCO GRAPHITE, INC., QED TECHNOLOGIES INTERNATIONAL, INC.
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Description

FIG. 1 is a top perspective view of a wafer support ring showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevational view, with the rear being a mirror image thereof;
FIG. 6 is a cross sectional view taken at line 6-6 of FIG. 3; and,
FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 3.

Claims (1)

    CLAIM
  1. The ornamental design for a wafer support ring, as shown and described.
US29/519,122 2015-03-02 2015-03-02 Wafer support ring Active USD767234S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/519,122 USD767234S1 (en) 2015-03-02 2015-03-02 Wafer support ring
TW104304797F TWD175851S (en) 2015-03-02 2015-09-02 Portion of a wafer support ring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/519,122 USD767234S1 (en) 2015-03-02 2015-03-02 Wafer support ring

Publications (1)

Publication Number Publication Date
USD767234S1 true USD767234S1 (en) 2016-09-20

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ID=56895806

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/519,122 Active USD767234S1 (en) 2015-03-02 2015-03-02 Wafer support ring

Country Status (2)

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US (1) USD767234S1 (en)
TW (1) TWD175851S (en)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD802723S1 (en) * 2015-11-27 2017-11-14 Ebara Corporation Sealing ring
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD864361S1 (en) * 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD917825S1 (en) 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
USD932721S1 (en) * 2020-02-26 2021-10-05 Bway Corporation Container ring
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD942596S1 (en) * 2015-12-24 2022-02-01 Valqua, Ltd. Seal material
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1011671S1 (en) 1991-07-02 2024-01-16 Bway Corporation Container
USD1015669S1 (en) 2020-02-26 2024-02-20 Bway Corporation Container ring

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893649A (en) * 1971-08-09 1975-07-08 Dynamic Form Systems Inc Bag holder
US4867401A (en) * 1988-08-04 1989-09-19 Graff Frederick E Bag holder
US4899967A (en) * 1989-01-17 1990-02-13 Johnson Austin E Portable flexible bag holder
USD457283S1 (en) * 1995-04-05 2002-05-14 Jay L. Wayt Refuse bag retainer ring
US20040048474A1 (en) * 2000-12-15 2004-03-11 Hiroshi Asano Wafer holding
US20060166503A1 (en) * 2003-07-02 2006-07-27 Tatsuya Sasaki Polishing apparatus and polishing method
USD591924S1 (en) * 2007-10-03 2009-05-05 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor wafers
US8016542B2 (en) * 2007-05-31 2011-09-13 Applied Materials, Inc. Methods and apparatus for extending the reach of a dual scara robot linkage
USD646764S1 (en) * 2010-11-04 2011-10-11 Faster S.P.A. Sealing gasket
USD655401S1 (en) * 2009-08-10 2012-03-06 Nippon Valqua Industries, Ltd. Hybrid seal member
USD667601S1 (en) * 2011-06-21 2012-09-18 Garbo Grabber, LLC Trash collecting device
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
US20130330165A1 (en) * 2010-12-20 2013-12-12 Ev Group E. Thallner Gmbh Accommodating device for retaining wafers
US20140154038A1 (en) * 2012-11-30 2014-06-05 Applied Materials, Inc. Multi-axis robot apparatus with unequal length forearms, electronic device manufacturing systems, and methods for transporting substrates in electronic device manufacturing
USD723239S1 (en) * 2012-08-30 2015-02-24 Entegris, Inc. Wafer carrier ring
USD743513S1 (en) * 2014-06-13 2015-11-17 Asm Ip Holding B.V. Seal ring
USD754308S1 (en) * 2012-08-07 2016-04-19 Nippon Valqua Industries, Ltd. Composite sealing material

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893649A (en) * 1971-08-09 1975-07-08 Dynamic Form Systems Inc Bag holder
US4867401A (en) * 1988-08-04 1989-09-19 Graff Frederick E Bag holder
US4899967A (en) * 1989-01-17 1990-02-13 Johnson Austin E Portable flexible bag holder
USD457283S1 (en) * 1995-04-05 2002-05-14 Jay L. Wayt Refuse bag retainer ring
US20040048474A1 (en) * 2000-12-15 2004-03-11 Hiroshi Asano Wafer holding
US20060166503A1 (en) * 2003-07-02 2006-07-27 Tatsuya Sasaki Polishing apparatus and polishing method
US8016542B2 (en) * 2007-05-31 2011-09-13 Applied Materials, Inc. Methods and apparatus for extending the reach of a dual scara robot linkage
USD591924S1 (en) * 2007-10-03 2009-05-05 Tokyo Electron Limited Arm for wafer transportation for manufacturing semiconductor wafers
USD655401S1 (en) * 2009-08-10 2012-03-06 Nippon Valqua Industries, Ltd. Hybrid seal member
USD646764S1 (en) * 2010-11-04 2011-10-11 Faster S.P.A. Sealing gasket
US20130330165A1 (en) * 2010-12-20 2013-12-12 Ev Group E. Thallner Gmbh Accommodating device for retaining wafers
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD667601S1 (en) * 2011-06-21 2012-09-18 Garbo Grabber, LLC Trash collecting device
USD754308S1 (en) * 2012-08-07 2016-04-19 Nippon Valqua Industries, Ltd. Composite sealing material
USD723239S1 (en) * 2012-08-30 2015-02-24 Entegris, Inc. Wafer carrier ring
US20140154038A1 (en) * 2012-11-30 2014-06-05 Applied Materials, Inc. Multi-axis robot apparatus with unequal length forearms, electronic device manufacturing systems, and methods for transporting substrates in electronic device manufacturing
USD743513S1 (en) * 2014-06-13 2015-11-17 Asm Ip Holding B.V. Seal ring

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1011671S1 (en) 1991-07-02 2024-01-16 Bway Corporation Container
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD835760S1 (en) 2015-11-27 2018-12-11 Ebara Corporation Sealing ring
USD802723S1 (en) * 2015-11-27 2017-11-14 Ebara Corporation Sealing ring
USD942596S1 (en) * 2015-12-24 2022-02-01 Valqua, Ltd. Seal material
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD864361S1 (en) * 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933032S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933031S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD917825S1 (en) 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
USD932721S1 (en) * 2020-02-26 2021-10-05 Bway Corporation Container ring
USD1015669S1 (en) 2020-02-26 2024-02-20 Bway Corporation Container ring
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

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Publication number Publication date
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