USD981459S1 - Retaining ring for substrate - Google Patents

Retaining ring for substrate Download PDF

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Publication number
USD981459S1
USD981459S1 US35/355,131 US35513172F USD981459S US D981459 S1 USD981459 S1 US D981459S1 US 35513172 F US35513172 F US 35513172F US D981459 S USD981459 S US D981459S
Authority
US
United States
Prior art keywords
substrate
retaining ring
view
ring
cross sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,131
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USD993654S1 (en
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USD985867S1 (en
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Inventor
Kenichi AKAZAWA
Osamu Nabeya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to US35/355,131 priority Critical patent/USD981459S1/en
Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AKAZAWA, KENICHI, NABEYA, OSAMU
Application granted granted Critical
Publication of USD981459S1 publication Critical patent/USD981459S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

1. Retaining ring for substrate
1.1 : Perspective
1.2 : Perspective
1.3 : Bottom
1.4 : Top
1.5 : Front
1.6 : Cross sectional
1.7 : Cross sectional
1.8 : Cross sectional
This article is used to hold a substrate in a ring and polish one side of the substrate during the polishing process of wafers and other substrates in the manufacture of semiconductors and other products; the rear view, right side view, and left side view are all represented identically to the front view.

Claims (1)

    CLAIM
  1. The ornamental design for a retainer ring for substrate, as shown and described.
US35/355,131 2021-06-16 2021-06-16 Retaining ring for substrate Active USD981459S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US35/355,131 USD981459S1 (en) 2021-06-16 2021-06-16 Retaining ring for substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35/355,131 USD981459S1 (en) 2021-06-16 2021-06-16 Retaining ring for substrate

Publications (1)

Publication Number Publication Date
USD981459S1 true USD981459S1 (en) 2023-03-21

Family

ID=85557265

Family Applications (1)

Application Number Title Priority Date Filing Date
US35/355,131 Active USD981459S1 (en) 2021-06-16 2021-06-16 Retaining ring for substrate

Country Status (1)

Country Link
US (1) USD981459S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1008268S1 (en) * 2021-06-22 2023-12-19 Wiretronic Ab Scanning arrangement

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
JP1494712S (en) 2013-05-15 2017-04-03
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD845568S1 (en) * 2015-05-14 2019-04-09 Ebara Corporation Pad holder for polishing apparatus
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
USD922229S1 (en) * 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
US11390945B2 (en) * 2019-07-03 2022-07-19 Asm Ip Holding B.V. Temperature control assembly for substrate processing apparatus and method of using same
US11396082B2 (en) * 2017-11-13 2022-07-26 Ebara Corporation Substrate holding device and substrate processing apparatus including the same

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD638951S1 (en) * 2009-11-13 2011-05-31 3M Innovative Properties Company Sample processing disk cover
USD667561S1 (en) * 2009-11-13 2012-09-18 3M Innovative Properties Company Sample processing disk cover
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
JP1494712S (en) 2013-05-15 2017-04-03
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD845568S1 (en) * 2015-05-14 2019-04-09 Ebara Corporation Pad holder for polishing apparatus
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD876504S1 (en) * 2017-04-03 2020-02-25 Asm Ip Holding B.V. Exhaust flow control ring for semiconductor deposition apparatus
US11396082B2 (en) * 2017-11-13 2022-07-26 Ebara Corporation Substrate holding device and substrate processing apparatus including the same
USD922229S1 (en) * 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
US11390945B2 (en) * 2019-07-03 2022-07-19 Asm Ip Holding B.V. Temperature control assembly for substrate processing apparatus and method of using same
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1008268S1 (en) * 2021-06-22 2023-12-19 Wiretronic Ab Scanning arrangement

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