USD770992S1 - Electrode cover for a plasma processing apparatus - Google Patents
Electrode cover for a plasma processing apparatus Download PDFInfo
- Publication number
- USD770992S1 USD770992S1 US29/544,070 US201529544070F USD770992S US D770992 S1 USD770992 S1 US D770992S1 US 201529544070 F US201529544070 F US 201529544070F US D770992 S USD770992 S US D770992S
- Authority
- US
- United States
- Prior art keywords
- processing apparatus
- plasma processing
- electrode cover
- view
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
Claims (1)
- The ornamental design for an electrode cover for a plasma processing apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-013037 | 2015-06-12 | ||
JPD2015-13037F JP1546800S (en) | 2015-06-12 | 2015-06-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD770992S1 true USD770992S1 (en) | 2016-11-08 |
Family
ID=55539624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/544,070 Active USD770992S1 (en) | 2015-06-12 | 2015-10-30 | Electrode cover for a plasma processing apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD770992S1 (en) |
JP (1) | JP1546800S (en) |
TW (1) | TWD175854S (en) |
Cited By (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD793572S1 (en) * | 2015-06-10 | 2017-08-01 | Tokyo Electron Limited | Electrode plate for plasma processing apparatus |
USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD799437S1 (en) * | 2015-08-25 | 2017-10-10 | Ebara Corporation | Substrate retaining ring |
USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD802472S1 (en) * | 2015-08-06 | 2017-11-14 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD802545S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Lower chamber for a plasma processing apparatus |
USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD803917S1 (en) * | 2015-06-16 | 2017-11-28 | Hitachi Kokusai Electric, Inc. | Heat reflector for substrate processing apparatus |
USD804556S1 (en) * | 2015-06-16 | 2017-12-05 | Hitachi Kokusai Electric Inc. | Heat reflector for substrate processing apparatus |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD827592S1 (en) | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD828419S1 (en) * | 2016-02-23 | 2018-09-11 | Joy Global Underground Mining Llc | Idler roller |
USD830435S1 (en) | 2015-12-28 | 2018-10-09 | Ntn Corporation | Inner ring for tapered roller bearing |
USD836573S1 (en) | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD840364S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD840365S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD847982S1 (en) * | 2016-02-04 | 2019-05-07 | Atos Medical Ab | Heat exchanger base plate |
USD851613S1 (en) | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD862404S1 (en) * | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD870314S1 (en) * | 2017-08-31 | 2019-12-17 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD871609S1 (en) * | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD891923S1 (en) * | 2017-11-12 | 2020-08-04 | Yun Lin | Container lid |
TWD208174S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
TWD208176S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
TWD208175S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
TWD208177S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
TWD208178S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
USD904305S1 (en) * | 2019-02-25 | 2020-12-08 | Petram Technologies, Inc. | Electrode cage for a plasma blasting probe |
USD907593S1 (en) * | 2017-01-20 | 2021-01-12 | Hitachi High-Tech Corporation | Discharge chamber for a plasma processing apparatus |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD916038S1 (en) * | 2019-03-19 | 2021-04-13 | Hitachi High-Tech Corporation | Grounded electrode for a plasma processing apparatus |
USD920521S1 (en) | 2019-05-08 | 2021-05-25 | Reza Jalinous | Double coil |
USD922589S1 (en) | 2020-09-08 | 2021-06-15 | Reza Jalinous | Coil |
USD926996S1 (en) | 2019-05-14 | 2021-08-03 | Reza Jalinous | Coil |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD954986S1 (en) * | 2019-10-18 | 2022-06-14 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing device |
USD970020S1 (en) | 2019-05-09 | 2022-11-15 | Reza Jalinous | Double coil |
USD971167S1 (en) * | 2019-08-28 | 2022-11-29 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
USD979080S1 (en) | 2019-06-27 | 2023-02-21 | Reza Jalinous | MRI tower coil stand |
USD979524S1 (en) * | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
USD980394S1 (en) * | 2020-04-01 | 2023-03-07 | Watermann Polyworks Gmbh | Sealing apparatus |
USD981459S1 (en) * | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD992615S1 (en) * | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1010135S1 (en) | 2019-05-20 | 2024-01-02 | Reza Jalinous | Coil |
USD1021832S1 (en) | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
USD427570S (en) * | 1997-01-31 | 2000-07-04 | Tokyo Electron Limited | Quartz fin heat retaining tube |
US6495007B2 (en) * | 1998-09-08 | 2002-12-17 | Acm Research, Inc. | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces |
US6663762B2 (en) * | 1996-07-15 | 2003-12-16 | Semitool, Inc. | Plating system workpiece support having workpiece engaging electrode |
USD494552S1 (en) * | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
USD494551S1 (en) * | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
US6843894B2 (en) * | 1997-12-18 | 2005-01-18 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6908540B2 (en) * | 2001-07-13 | 2005-06-21 | Applied Materials, Inc. | Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
US7025862B2 (en) * | 2002-10-22 | 2006-04-11 | Applied Materials | Plating uniformity control by contact ring shaping |
US7087144B2 (en) * | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
US7138039B2 (en) * | 2003-01-21 | 2006-11-21 | Applied Materials, Inc. | Liquid isolation of contact rings |
USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD699200S1 (en) | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
-
2015
- 2015-06-12 JP JPD2015-13037F patent/JP1546800S/ja active Active
- 2015-10-06 TW TW104305550F patent/TWD175854S/en unknown
- 2015-10-30 US US29/544,070 patent/USD770992S1/en active Active
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6663762B2 (en) * | 1996-07-15 | 2003-12-16 | Semitool, Inc. | Plating system workpiece support having workpiece engaging electrode |
USD427570S (en) * | 1997-01-31 | 2000-07-04 | Tokyo Electron Limited | Quartz fin heat retaining tube |
USD404372S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
USD404370S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
US6843894B2 (en) * | 1997-12-18 | 2005-01-18 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US6495007B2 (en) * | 1998-09-08 | 2002-12-17 | Acm Research, Inc. | Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces |
US6908540B2 (en) * | 2001-07-13 | 2005-06-21 | Applied Materials, Inc. | Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
US7025862B2 (en) * | 2002-10-22 | 2006-04-11 | Applied Materials | Plating uniformity control by contact ring shaping |
USD494551S1 (en) * | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
USD494552S1 (en) * | 2002-12-12 | 2004-08-17 | Tokyo Electron Limited | Exhaust ring for manufacturing semiconductors |
US7138039B2 (en) * | 2003-01-21 | 2006-11-21 | Applied Materials, Inc. | Liquid isolation of contact rings |
US7087144B2 (en) * | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
USD559993S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD559994S1 (en) | 2005-03-30 | 2008-01-15 | Tokyo Electron Limited | Cover ring |
USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD699200S1 (en) | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
Cited By (76)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD837755S1 (en) * | 2015-04-16 | 2019-01-08 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD825504S1 (en) | 2015-04-21 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD793572S1 (en) * | 2015-06-10 | 2017-08-01 | Tokyo Electron Limited | Electrode plate for plasma processing apparatus |
USD802790S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD802545S1 (en) * | 2015-06-12 | 2017-11-14 | Hitachi High-Technologies Corporation | Lower chamber for a plasma processing apparatus |
USD803917S1 (en) * | 2015-06-16 | 2017-11-28 | Hitachi Kokusai Electric, Inc. | Heat reflector for substrate processing apparatus |
USD804556S1 (en) * | 2015-06-16 | 2017-12-05 | Hitachi Kokusai Electric Inc. | Heat reflector for substrate processing apparatus |
USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD802472S1 (en) * | 2015-08-06 | 2017-11-14 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
USD799437S1 (en) * | 2015-08-25 | 2017-10-10 | Ebara Corporation | Substrate retaining ring |
USD830435S1 (en) | 2015-12-28 | 2018-10-09 | Ntn Corporation | Inner ring for tapered roller bearing |
USD830434S1 (en) * | 2015-12-28 | 2018-10-09 | Ntn Corporation | Inner ring for tapered roller bearing |
USD861757S1 (en) | 2015-12-28 | 2019-10-01 | Ntn Corporation | Inner ring for tapered roller bearing |
USD847982S1 (en) * | 2016-02-04 | 2019-05-07 | Atos Medical Ab | Heat exchanger base plate |
USD908755S1 (en) | 2016-02-23 | 2021-01-26 | Joy Global Underground Mining Llc | Idler roller |
USD828419S1 (en) * | 2016-02-23 | 2018-09-11 | Joy Global Underground Mining Llc | Idler roller |
USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD869409S1 (en) | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD862404S1 (en) * | 2016-10-25 | 2019-10-08 | Kokusai Electric Corporation | Sealing material ring for a semiconductor manufacturing apparatus |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD913977S1 (en) | 2016-12-12 | 2021-03-23 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
USD907593S1 (en) * | 2017-01-20 | 2021-01-12 | Hitachi High-Tech Corporation | Discharge chamber for a plasma processing apparatus |
USD836573S1 (en) | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
USD840365S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
USD840364S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD827592S1 (en) | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD871609S1 (en) * | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
USD870314S1 (en) * | 2017-08-31 | 2019-12-17 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD851613S1 (en) | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD891923S1 (en) * | 2017-11-12 | 2020-08-04 | Yun Lin | Container lid |
USD946638S1 (en) | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD868124S1 (en) | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD877101S1 (en) | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD902165S1 (en) | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
TWD208176S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
TWD208178S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
TWD208177S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
TWD208175S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
TWD208174S (en) | 2018-07-25 | 2020-11-11 | 日商日本碍子股份有限公司 | Wafer retainer for manufacturing semiconductor |
USD992615S1 (en) * | 2018-12-07 | 2023-07-18 | Tokyo Electron Limited | Focus ring |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
USD933725S1 (en) * | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD904305S1 (en) * | 2019-02-25 | 2020-12-08 | Petram Technologies, Inc. | Electrode cage for a plasma blasting probe |
USD916038S1 (en) * | 2019-03-19 | 2021-04-13 | Hitachi High-Tech Corporation | Grounded electrode for a plasma processing apparatus |
USD920521S1 (en) | 2019-05-08 | 2021-05-25 | Reza Jalinous | Double coil |
USD970020S1 (en) | 2019-05-09 | 2022-11-15 | Reza Jalinous | Double coil |
USD926996S1 (en) | 2019-05-14 | 2021-08-03 | Reza Jalinous | Coil |
USD1010135S1 (en) | 2019-05-20 | 2024-01-02 | Reza Jalinous | Coil |
USD979080S1 (en) | 2019-06-27 | 2023-02-21 | Reza Jalinous | MRI tower coil stand |
USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
USD971167S1 (en) * | 2019-08-28 | 2022-11-29 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
USD954986S1 (en) * | 2019-10-18 | 2022-06-14 | Hitachi High-Tech Corporation | Electrode cover for a plasma processing device |
USD979524S1 (en) * | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
USD986190S1 (en) | 2020-03-19 | 2023-05-16 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
USD934315S1 (en) * | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD970566S1 (en) | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD980394S1 (en) * | 2020-04-01 | 2023-03-07 | Watermann Polyworks Gmbh | Sealing apparatus |
US11581166B2 (en) | 2020-07-31 | 2023-02-14 | Applied Materials, Inc. | Low profile deposition ring for enhanced life |
USD933726S1 (en) * | 2020-07-31 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a semiconductor processing chamber |
USD922589S1 (en) | 2020-09-08 | 2021-06-15 | Reza Jalinous | Coil |
USD1021832S1 (en) | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
USD989012S1 (en) * | 2020-09-17 | 2023-06-13 | Ebara Corporation | Elastic membrane |
USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD966357S1 (en) | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD981459S1 (en) * | 2021-06-16 | 2023-03-21 | Ebara Corporation | Retaining ring for substrate |
Also Published As
Publication number | Publication date |
---|---|
TWD175854S (en) | 2016-05-21 |
JP1546800S (en) | 2016-03-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD770992S1 (en) | Electrode cover for a plasma processing apparatus | |
USD802790S1 (en) | Cover ring for a plasma processing apparatus | |
USD804436S1 (en) | Upper chamber for a plasma processing apparatus | |
USD889844S1 (en) | Electric-toothbrush handle | |
USD812578S1 (en) | Upper chamber for a plasma processing apparatus | |
USD983322S1 (en) | Showerhead | |
USD783351S1 (en) | Gas nozzle substrate processing apparatus | |
USD781588S1 (en) | Cleansing apparatus | |
USD803507S1 (en) | Automated teller machine | |
USD782998S1 (en) | Earphone | |
USD782997S1 (en) | Earphone | |
USD802545S1 (en) | Lower chamber for a plasma processing apparatus | |
USD791420S1 (en) | Electric vacuum cleaner | |
USD699200S1 (en) | Electrode member for a plasma processing apparatus | |
USD776635S1 (en) | Earphone | |
USD786740S1 (en) | Electric wheelchair | |
USD767139S1 (en) | X-ray device | |
USD779148S1 (en) | Automated teller machine | |
USD733840S1 (en) | Electric sprayer | |
USD776177S1 (en) | Air cooled plasma torch electrode | |
USD795806S1 (en) | Current transducer | |
USD757389S1 (en) | Automated teller machine | |
USD782147S1 (en) | Automated teller machine | |
USD801283S1 (en) | Shield | |
USD769439S1 (en) | Inhalation device |