TWD175855S - Lower chamber for plasma treatment device - Google Patents

Lower chamber for plasma treatment device

Info

Publication number
TWD175855S
TWD175855S TW104305551F TW104305551F TWD175855S TW D175855 S TWD175855 S TW D175855S TW 104305551 F TW104305551 F TW 104305551F TW 104305551 F TW104305551 F TW 104305551F TW D175855 S TWD175855 S TW D175855S
Authority
TW
Taiwan
Prior art keywords
lower chamber
treatment device
plasma treatment
article
processing device
Prior art date
Application number
TW104305551F
Other languages
Chinese (zh)
Inventor
Susumu Tauchi
Takashi Uemura
Kohei Sato
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TWD175855S publication Critical patent/TWD175855S/en

Links

Abstract

【物品用途】;本設計的物品是電漿處理裝置用下腔室，為一種在半導體製造時所使用的電漿處理裝置中，在進行半導體晶圓等之表面處理時，構成真空空間的下腔室。;【設計說明】;立體圖中，未表現在其他六面圖的細線，皆為用來呈現立體表面的形狀。[Use of article] The article of this design is a lower chamber for a plasma processing device. It is a lower chamber that forms a vacuum space in a plasma processing device used in semiconductor manufacturing when surface treatment of semiconductor wafers, etc. Chamber. ;[Design Description];In the three-dimensional drawing, the thin lines that are not shown in other six-sided drawings are used to represent the shape of the three-dimensional surface.

TW104305551F 2015-06-12 2015-10-06 Lower chamber for plasma treatment device TWD175855S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-13038F JP1546801S (en) 2015-06-12 2015-06-12

Publications (1)

Publication Number Publication Date
TWD175855S true TWD175855S (en) 2016-05-21

Family

ID=55539625

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305551F TWD175855S (en) 2015-06-12 2015-10-06 Lower chamber for plasma treatment device

Country Status (3)

Country Link
US (1) USD802545S1 (en)
JP (1) JP1546801S (en)
TW (1) TWD175855S (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

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JP1611626S (en) * 2017-01-20 2018-08-20
JP1584146S (en) * 2017-01-31 2017-08-21
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
JP1638504S (en) * 2018-12-06 2019-08-05
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
JP1704964S (en) * 2021-04-19 2022-01-14 Suceptoring for plasma processing equipment
JP1700629S (en) * 2021-04-26 2021-11-29
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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USD734377S1 (en) * 2013-03-28 2015-07-14 Hirata Corporation Top cover of a load lock chamber
TWD169790S (en) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 Part of the vaporizer for substrate processing equipment
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD947914S1 (en) 2020-11-23 2022-04-05 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD960216S1 (en) 2020-11-23 2022-08-09 Applied Materials, Inc. Base plate for a processing chamber substrate support
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Also Published As

Publication number Publication date
JP1546801S (en) 2016-03-28
USD802545S1 (en) 2017-11-14

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