TWD180288S - Upper chamber for plasma treatment device - Google Patents

Upper chamber for plasma treatment device

Info

Publication number
TWD180288S
TWD180288S TW104305548D01F TW104305548D01F TWD180288S TW D180288 S TWD180288 S TW D180288S TW 104305548D01 F TW104305548D01 F TW 104305548D01F TW 104305548D01 F TW104305548D01 F TW 104305548D01F TW D180288 S TWD180288 S TW D180288S
Authority
TW
Taiwan
Prior art keywords
design
upper chamber
difference
original design
processing device
Prior art date
Application number
TW104305548D01F
Other languages
Chinese (zh)
Inventor
Takashi Uemura
Kohei Sato
Susumu Tauchi
Original Assignee
日立全球先端科技股份有限公司
Hitachi High-Technologies Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司, Hitachi High-Technologies Corporation filed Critical 日立全球先端科技股份有限公司
Publication of TWD180288S publication Critical patent/TWD180288S/en

Links

Abstract

【物品用途】;本設計的物品是電漿處理裝置用上腔室，為一種在半導體製造時所使用的電漿處理裝置中，在進行半導體晶圓等之表面處理時，構成真空空間的上腔室。;【設計說明】;立體圖中，未表現在其他六面圖的細線，皆為用來呈現立體表面的形狀。;本衍生設計與原設計之外觀差異在於：如立體圖及前視圖及左、右側視圖等所示，除了其頂部的直徑段差外，其圓周上具有一道橫長形矩形孔等形狀亦略有所不同，因此本案與原設計案之差異些微，不影響原設計與衍生設計之近似。[Use of article] The article designed is an upper chamber for a plasma processing device. It is an upper chamber that forms a vacuum space in a plasma processing device used in semiconductor manufacturing when surface treatment of semiconductor wafers, etc. Chamber. ;[Design Description];In the three-dimensional drawing, the thin lines that are not shown in other six-sided drawings are used to represent the shape of the three-dimensional surface. ;The difference in appearance between this derivative design and the original design is that, as shown in the perspective view, front view, left and right side views, etc., in addition to the diameter difference at the top, there is also a slightly different shape such as a horizontally long rectangular hole on its circumference. Different, therefore the difference between this case and the original design is slight, which does not affect the similarity between the original design and the derivative design.

TW104305548D01F 2016-02-26 2016-04-29 Upper chamber for plasma treatment device TWD180288S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-4151F JP1564934S (en) 2016-02-26 2016-02-26

Publications (1)

Publication Number Publication Date
TWD180288S true TWD180288S (en) 2016-12-21

Family

ID=57406451

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104305548D01F TWD180288S (en) 2016-02-26 2016-04-29 Upper chamber for plasma treatment device

Country Status (3)

Country Link
US (1) USD812578S1 (en)
JP (1) JP1564934S (en)
TW (1) TWD180288S (en)

Cited By (8)

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USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD875054S1 (en) 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

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USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD818447S1 (en) * 2017-04-28 2018-05-22 Applied Materials, Inc. Plasma feedthrough flange
JP1638504S (en) * 2018-12-06 2019-08-05
JP1646366S (en) * 2019-03-19 2019-11-25
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD1042373S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD875054S1 (en) 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD858468S1 (en) 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

Also Published As

Publication number Publication date
USD812578S1 (en) 2018-03-13
JP1564934S (en) 2016-12-05

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