USD913979S1 - Inner shield for a substrate processing chamber - Google Patents

Inner shield for a substrate processing chamber Download PDF

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Publication number
USD913979S1
USD913979S1 US29/703,655 US201929703655F USD913979S US D913979 S1 USD913979 S1 US D913979S1 US 201929703655 F US201929703655 F US 201929703655F US D913979 S USD913979 S US D913979S
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United States
Prior art keywords
processing chamber
substrate processing
inner shield
view
elevation view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/703,655
Inventor
Sarath Babu
Ananthkrishna Jupudi
Yueh Sheng Ow
Junqi Wei
Kelvin Boh
Yuichi Wada
Kang Zhang
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Applied Materials Inc
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Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/703,655 priority Critical patent/USD913979S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WADA, YUICHI
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OW, Yueh Sheng, BOH, Kelvin, JUPUDI, ANANTHKRISHNA, WEI, JUNQI, BABU, Sarath, KANG, ZHANG
Priority to JPD2020-21837F priority patent/JP1683107S/ja
Priority to TW110301539F priority patent/TWD218527S/en
Priority to JPD2020-3692F priority patent/JP1683051S/ja
Priority to TW109300959F priority patent/TWD214316S/en
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR ZHANG KANG PREVIOUSLY RECORDED ON REEL 050866 FRAME 0954. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: OW, Yueh Sheng, BOH, Kelvin, JUPUDI, ANANTHKRISHNA, WEI, JUNQI, BABU, Sarath, ZHANG, KANG
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Publication of USD913979S1 publication Critical patent/USD913979S1/en
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FIG. 1 is a top isometric view of the first embodiment for an inner shield for a substrate processing chamber, according to the new design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof.
FIG. 7 is a left side elevation view thereof.
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2.
FIG. 9 is a top isometric view of the second embodiment for an inner shield for a substrate processing chamber, according to the new design.
FIG. 10 is a top plan view thereof.
FIG. 11 is a bottom plan view thereof.
FIG. 12 is a front elevation view thereof.
FIG. 13 is a back elevation view thereof.
FIG. 14 is a right side elevation view thereof.
FIG. 15 is a left side elevation view thereof; and,
FIG. 16 is a cross-sectional view taken along line 16-16 in FIG. 10.
The broken lines in FIGS. 1-16 show portions of an inner shield for a substrate processing chamber which form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an inner shield for a substrate processing chamber, as shown and described.
US29/703,655 2019-08-28 2019-08-28 Inner shield for a substrate processing chamber Active USD913979S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/703,655 USD913979S1 (en) 2019-08-28 2019-08-28 Inner shield for a substrate processing chamber
TW109300959F TWD214316S (en) 2019-08-28 2020-02-27 Inner shield for a substrate processing chamber
JPD2020-3692F JP1683051S (en) 2019-08-28 2020-02-27
TW110301539F TWD218527S (en) 2019-08-28 2020-02-27 Inner shield for a substrate processing chamber
JPD2020-21837F JP1683107S (en) 2019-08-28 2020-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/703,655 USD913979S1 (en) 2019-08-28 2019-08-28 Inner shield for a substrate processing chamber

Publications (1)

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USD913979S1 true USD913979S1 (en) 2021-03-23

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US29/703,655 Active USD913979S1 (en) 2019-08-28 2019-08-28 Inner shield for a substrate processing chamber

Country Status (3)

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US (1) USD913979S1 (en)
JP (2) JP1683051S (en)
TW (2) TWD214316S (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210066050A1 (en) * 2019-08-28 2021-03-04 Applied Materials, Inc. High conductance inner shield for process chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD969760S1 (en) * 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1733479S (en) 2022-01-20 2022-12-28 Substrate support for substrate processing chamber

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US5762748A (en) 1992-08-27 1998-06-09 Applied Materials, Inc Lid and door for a vacuum chamber and pretreatment therefor
US6583064B2 (en) 1998-03-31 2003-06-24 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
US20040149216A1 (en) 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
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US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
US20130098554A1 (en) 2011-10-25 2013-04-25 Lam Research Corporation Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber
US20130284700A1 (en) 2012-04-26 2013-10-31 Applied Materials, Inc. Proportional and uniform controlled gas flow delivery for dry plasma etch apparatus
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5762748A (en) 1992-08-27 1998-06-09 Applied Materials, Inc Lid and door for a vacuum chamber and pretreatment therefor
US6583064B2 (en) 1998-03-31 2003-06-24 Lam Research Corporation Low contamination high density plasma etch chambers and methods for making the same
US20040149216A1 (en) 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US20100291319A1 (en) 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD655258S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Side wall for reactor for manufacturing semiconductor
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20130098554A1 (en) 2011-10-25 2013-04-25 Lam Research Corporation Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber
US20130284700A1 (en) 2012-04-26 2013-10-31 Applied Materials, Inc. Proportional and uniform controlled gas flow delivery for dry plasma etch apparatus
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
International Search Report and Written Opinion for PCT/US2020/048302 dated Dec. 4, 2020.

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD946638S1 (en) * 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD1012051S1 (en) * 2019-06-17 2024-01-23 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing device
US20210066050A1 (en) * 2019-08-28 2021-03-04 Applied Materials, Inc. High conductance inner shield for process chamber
USD969760S1 (en) * 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD1007449S1 (en) * 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

Also Published As

Publication number Publication date
TWD218527S (en) 2022-05-01
TWD214316S (en) 2021-10-01
JP1683107S (en) 2021-04-12
JP1683051S (en) 2021-04-12

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