USD941371S1 - Process shield for a substrate processing chamber - Google Patents

Process shield for a substrate processing chamber Download PDF

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Publication number
USD941371S1
USD941371S1 US29/728,820 US202029728820F USD941371S US D941371 S1 USD941371 S1 US D941371S1 US 202029728820 F US202029728820 F US 202029728820F US D941371 S USD941371 S US D941371S
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United States
Prior art keywords
processing chamber
substrate processing
process shield
view
shield
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US29/728,820
Inventor
Ilya Lavitsky
Keith A Miller
Goichi Yoshidome
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/728,820 priority Critical patent/USD941371S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAVITSKY, ILYA, MILLER, KEITH A., YOSHIDOME, GOICHI
Priority to JPD2020-19524F priority patent/JP1696666S/ja
Priority to JPD2021-4565F priority patent/JP1696763S/ja
Priority to TW109305253D01F priority patent/TWD215401S/en
Priority to TW109305253F priority patent/TWD215400S/en
Application granted granted Critical
Publication of USD941371S1 publication Critical patent/USD941371S1/en
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Description

FIG. 1 is a top isometric view of a process shield for a substrate processing chamber, according to the first embodiment of the novel design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a left side elevation view thereof.
FIG. 5 is a right side elevation view thereof.
FIG. 6 is a rear elevation view thereof.
FIG. 7 is a front elevation view thereof.
FIG. 8 is a cross-sectional view taken along line 8-8′ of FIG. 2.
FIG. 9 is a top isometric view of a process shield for a substrate processing chamber, according to the second embodiment of the novel design.
FIG. 10 is a top plan view thereof.
FIG. 11 is a bottom plan view thereof.
FIG. 12 is a left side elevation view thereof.
FIG. 13 is a right side elevation view thereof.
FIG. 14 is a rear elevation view thereof.
FIG. 15 is a front elevation view thereof; and,
FIG. 16 is a cross-sectional view taken along line 16-16′ of FIG. 10.
The dashed lines in FIGS. 1-16 represent unclaimed environment forming no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a process shield for a substrate processing chamber, as shown and described.
US29/728,820 2020-03-20 2020-03-20 Process shield for a substrate processing chamber Active USD941371S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/728,820 USD941371S1 (en) 2020-03-20 2020-03-20 Process shield for a substrate processing chamber
JPD2020-19524F JP1696666S (en) 2020-03-20 2020-09-14
JPD2021-4565F JP1696763S (en) 2020-03-20 2020-09-14
TW109305253D01F TWD215401S (en) 2020-03-20 2020-09-18 Process shield for a substrate processing chamber
TW109305253F TWD215400S (en) 2020-03-20 2020-09-18 Process shield for a substrate processing chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/728,820 USD941371S1 (en) 2020-03-20 2020-03-20 Process shield for a substrate processing chamber

Publications (1)

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USD941371S1 true USD941371S1 (en) 2022-01-18

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US29/728,820 Active USD941371S1 (en) 2020-03-20 2020-03-20 Process shield for a substrate processing chamber

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US (1) USD941371S1 (en)
JP (2) JP1696763S (en)
TW (2) TWD215401S (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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USD351450S (en) * 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) * 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
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USD395483S (en) * 1996-06-07 1998-06-23 Riteflite Pty Limited Design for a target
USD401252S (en) * 1998-01-27 1998-11-17 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
USD403002S (en) * 1998-01-27 1998-12-22 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
USD403334S (en) * 1998-01-27 1998-12-29 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
USD403337S (en) * 1997-08-05 1998-12-29 Applied Materials, Inc. High conductance low wall deposition upper shield
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
US20080178801A1 (en) 2007-01-29 2008-07-31 Applied Materials, Inc. Process kit for substrate processing chamber
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
US8371904B2 (en) * 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD738451S1 (en) * 2014-11-11 2015-09-08 Mary Olson Golf ball target for chipping and putting
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD741921S1 (en) * 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
US20150357169A1 (en) * 2013-01-04 2015-12-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
US20160189938A1 (en) 2014-12-31 2016-06-30 Applied Materials, Inc. One-piece process kit shield
US9475996B2 (en) * 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
US20170002461A1 (en) 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
US20170076924A1 (en) 2015-09-11 2017-03-16 Applied Materials, Inc. One-piece process kit shield for reducing the impact of an electric field near the substrate
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
US20180087147A1 (en) 2010-05-14 2018-03-29 Applied Materials, Inc. Process kit shield for improved particle reduction
US20180142340A1 (en) 2016-11-19 2018-05-24 Applied Materials, Inc. Process kit having a floating shadow ring
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
US20190096638A1 (en) 2017-09-22 2019-03-28 Applied Materials, Inc. Substrate processing chamber having improved process volume sealing
TWD197825S (en) 2017-12-19 2019-06-01 日商華爾卡股份有限公司 Seal member for use in semiconductor production apparatus
US10347475B2 (en) 2005-10-31 2019-07-09 Applied Materials, Inc. Holding assembly for substrate processing chamber
JP1646366S (en) 2019-03-19 2019-11-25
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US20200090915A1 (en) * 2017-06-01 2020-03-19 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD913980S1 (en) * 2018-02-01 2021-03-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber

Patent Citations (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) * 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD351450S (en) * 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) * 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
USD395483S (en) * 1996-06-07 1998-06-23 Riteflite Pty Limited Design for a target
USD403337S (en) * 1997-08-05 1998-12-29 Applied Materials, Inc. High conductance low wall deposition upper shield
USD401252S (en) * 1998-01-27 1998-11-17 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
USD403002S (en) * 1998-01-27 1998-12-22 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
USD403334S (en) * 1998-01-27 1998-12-29 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD592029S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD584591S1 (en) * 2004-10-26 2009-01-13 Jsr Corporation Polishing pad
USD592030S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD600989S1 (en) * 2004-10-26 2009-09-29 Jsr Corporation Polishing pad
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
US10347475B2 (en) 2005-10-31 2019-07-09 Applied Materials, Inc. Holding assembly for substrate processing chamber
US20080178801A1 (en) 2007-01-29 2008-07-31 Applied Materials, Inc. Process kit for substrate processing chamber
US8371904B2 (en) * 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
US20180087147A1 (en) 2010-05-14 2018-03-29 Applied Materials, Inc. Process kit shield for improved particle reduction
US20120263569A1 (en) * 2011-04-14 2012-10-18 Scott Wayne Priddy Substrate holders and methods of substrate mounting
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
US9475996B2 (en) * 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
US20150357169A1 (en) * 2013-01-04 2015-12-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD741921S1 (en) * 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
USD738451S1 (en) * 2014-11-11 2015-09-08 Mary Olson Golf ball target for chipping and putting
US20160189938A1 (en) 2014-12-31 2016-06-30 Applied Materials, Inc. One-piece process kit shield
US20170002461A1 (en) 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
US20170009367A1 (en) * 2015-07-09 2017-01-12 Applied Materials, Inc. Wafer electroplating chuck assembly
USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
US20170076924A1 (en) 2015-09-11 2017-03-16 Applied Materials, Inc. One-piece process kit shield for reducing the impact of an electric field near the substrate
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
US20180142340A1 (en) 2016-11-19 2018-05-24 Applied Materials, Inc. Process kit having a floating shadow ring
US20200090915A1 (en) * 2017-06-01 2020-03-19 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
US20190096638A1 (en) 2017-09-22 2019-03-28 Applied Materials, Inc. Substrate processing chamber having improved process volume sealing
TWD197825S (en) 2017-12-19 2019-06-01 日商華爾卡股份有限公司 Seal member for use in semiconductor production apparatus
USD913980S1 (en) * 2018-02-01 2021-03-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
JP1646366S (en) 2019-03-19 2019-11-25
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber

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* Cited by examiner, † Cited by third party
Title
International Search Report for PCT/US2021/022445. dated Jun. 30, 2021.
Search Report for Taiwan Design Application No. 109305253, dated Jul. 29, 2020.

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD970566S1 (en) * 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD966357S1 (en) * 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JP1696666S (en) 2021-10-11
TWD215401S (en) 2021-11-21
JP1696763S (en) 2021-10-11
TWD215400S (en) 2021-11-21

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