TWD215400S - Process shield for a substrate processing chamber - Google Patents
Process shield for a substrate processing chamber Download PDFInfo
- Publication number
- TWD215400S TWD215400S TW109305253F TW109305253F TWD215400S TW D215400 S TWD215400 S TW D215400S TW 109305253 F TW109305253 F TW 109305253F TW 109305253 F TW109305253 F TW 109305253F TW D215400 S TWD215400 S TW D215400S
- Authority
- TW
- Taiwan
- Prior art keywords
- processing chamber
- substrate processing
- process shield
- design
- shield
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 title abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 1
Images
Abstract
【物品用途】;本設計所請求之基板處理腔室的製程護罩係用於半導體製程。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。[Use of article]; The process shield of the substrate processing chamber requested by this design is used in the semiconductor process. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.
Description
本設計所請求之基板處理腔室的製程護罩係用於半導體製程。 The process shield of the substrate processing chamber requested by this design is used in the semiconductor process.
圖式所揭露之虛線部分,為本案不主張設計之部分。 The dotted line exposed in the diagram is the part that is not advocated for design in this case.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/728,820 USD941371S1 (en) | 2020-03-20 | 2020-03-20 | Process shield for a substrate processing chamber |
US29/728,820 | 2020-03-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD215400S true TWD215400S (en) | 2021-11-21 |
Family
ID=78000911
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109305253D01F TWD215401S (en) | 2020-03-20 | 2020-09-18 | Process shield for a substrate processing chamber |
TW109305253F TWD215400S (en) | 2020-03-20 | 2020-09-18 | Process shield for a substrate processing chamber |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109305253D01F TWD215401S (en) | 2020-03-20 | 2020-09-18 | Process shield for a substrate processing chamber |
Country Status (3)
Country | Link |
---|---|
US (1) | USD941371S1 (en) |
JP (2) | JP1696666S (en) |
TW (2) | TWD215401S (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
USD973609S1 (en) * | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD980887S1 (en) * | 2021-03-18 | 2023-03-14 | Illinois Tool Works Inc. | Chamber |
USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD990441S1 (en) * | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
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USD351450S (en) * | 1993-05-19 | 1994-10-11 | Riteflite Pty. Limited | Target for shooting |
USD376744S (en) * | 1994-08-03 | 1996-12-24 | Gerd Eisenblatter Gmbh | Support plate |
USD381030S (en) * | 1995-11-21 | 1997-07-15 | Avi Tepman | Sputtering target |
AU129071S (en) * | 1996-06-07 | 1997-01-14 | Riteflite Pty Ltd | Target |
USD403337S (en) * | 1997-08-05 | 1998-12-29 | Applied Materials, Inc. | High conductance low wall deposition upper shield |
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US8371904B2 (en) * | 2008-08-08 | 2013-02-12 | Globalfoundries Singapore Pte. Ltd. | Polishing with enhanced uniformity |
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WO2012142408A2 (en) * | 2011-04-14 | 2012-10-18 | Veeco Instruments Inc. | Substrate holders and methods of substrate mounting |
USD678745S1 (en) * | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
USD665491S1 (en) * | 2012-01-25 | 2012-08-14 | Applied Materials, Inc. | Deposition chamber cover ring |
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TWD169790S (en) * | 2013-07-10 | 2015-08-11 | 日立國際電氣股份有限公司 | Part of the vaporizer for substrate processing equipment |
USD741921S1 (en) * | 2014-04-15 | 2015-10-27 | Q-Linea Ab | Positive mold for manufacturing a sample holding disc |
USD738451S1 (en) * | 2014-11-11 | 2015-09-08 | Mary Olson | Golf ball target for chipping and putting |
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CN107787377A (en) | 2015-07-03 | 2018-03-09 | 应用材料公司 | Processing accessory with high deposition ring and deposition ring fixture |
US10174437B2 (en) * | 2015-07-09 | 2019-01-08 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
JP1549882S (en) * | 2015-08-18 | 2016-05-23 | ||
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USD810705S1 (en) * | 2016-04-01 | 2018-02-20 | Veeco Instruments Inc. | Self-centering wafer carrier for chemical vapor deposition |
USD819580S1 (en) * | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
TWD178424S (en) * | 2016-01-08 | 2016-09-21 | ASM知識產權私人控股有	 | Gas flow control plate for semiconductor manufacturing apparatus |
JP7117300B2 (en) | 2016-11-19 | 2022-08-12 | アプライド マテリアルズ インコーポレイテッド | Process kit with floating shadow ring |
US11158491B2 (en) * | 2017-06-01 | 2021-10-26 | Oerlikon Surface Solutions Ag, Pfäffikon | Target assembly for safe and economic evaporation of brittle materials |
US10998172B2 (en) | 2017-09-22 | 2021-05-04 | Applied Materials, Inc. | Substrate processing chamber having improved process volume sealing |
JP1605779S (en) | 2017-12-19 | 2018-06-04 | ||
USD880437S1 (en) * | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
USD888903S1 (en) * | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
JP1646366S (en) | 2019-03-19 | 2019-11-25 | ||
USD913979S1 (en) * | 2019-08-28 | 2021-03-23 | Applied Materials, Inc. | Inner shield for a substrate processing chamber |
-
2020
- 2020-03-20 US US29/728,820 patent/USD941371S1/en active Active
- 2020-09-14 JP JPD2020-19524F patent/JP1696666S/ja active Active
- 2020-09-14 JP JPD2021-4565F patent/JP1696763S/ja active Active
- 2020-09-18 TW TW109305253D01F patent/TWD215401S/en unknown
- 2020-09-18 TW TW109305253F patent/TWD215400S/en unknown
Also Published As
Publication number | Publication date |
---|---|
USD941371S1 (en) | 2022-01-18 |
JP1696666S (en) | 2021-10-11 |
TWD215401S (en) | 2021-11-21 |
JP1696763S (en) | 2021-10-11 |
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