TWD215400S - Process shield for a substrate processing chamber - Google Patents

Process shield for a substrate processing chamber Download PDF

Info

Publication number
TWD215400S
TWD215400S TW109305253F TW109305253F TWD215400S TW D215400 S TWD215400 S TW D215400S TW 109305253 F TW109305253 F TW 109305253F TW 109305253 F TW109305253 F TW 109305253F TW D215400 S TWD215400 S TW D215400S
Authority
TW
Taiwan
Prior art keywords
processing chamber
substrate processing
process shield
design
shield
Prior art date
Application number
TW109305253F
Other languages
Chinese (zh)
Inventor
伊利亞 拉維斯基
凱斯A 米勒
吉留剛一
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD215400S publication Critical patent/TWD215400S/en

Links

Images

Abstract

【物品用途】;本設計所請求之基板處理腔室的製程護罩係用於半導體製程。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。[Use of article]; The process shield of the substrate processing chamber requested by this design is used in the semiconductor process. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design.

Description

基板處理腔室的製程護罩 Process shield of substrate processing chamber

本設計所請求之基板處理腔室的製程護罩係用於半導體製程。 The process shield of the substrate processing chamber requested by this design is used in the semiconductor process.

圖式所揭露之虛線部分,為本案不主張設計之部分。 The dotted line exposed in the diagram is the part that is not advocated for design in this case.

TW109305253F 2020-03-20 2020-09-18 Process shield for a substrate processing chamber TWD215400S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/728,820 USD941371S1 (en) 2020-03-20 2020-03-20 Process shield for a substrate processing chamber
US29/728,820 2020-03-20

Publications (1)

Publication Number Publication Date
TWD215400S true TWD215400S (en) 2021-11-21

Family

ID=78000911

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109305253D01F TWD215401S (en) 2020-03-20 2020-09-18 Process shield for a substrate processing chamber
TW109305253F TWD215400S (en) 2020-03-20 2020-09-18 Process shield for a substrate processing chamber

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109305253D01F TWD215401S (en) 2020-03-20 2020-09-18 Process shield for a substrate processing chamber

Country Status (3)

Country Link
US (1) USD941371S1 (en)
JP (2) JP1696666S (en)
TW (2) TWD215401S (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD937329S1 (en) * 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD973609S1 (en) * 2020-04-22 2022-12-27 Applied Materials, Inc. Upper shield with showerhead for a process chamber
USD940765S1 (en) * 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980887S1 (en) * 2021-03-18 2023-03-14 Illinois Tool Works Inc. Chamber
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD990441S1 (en) * 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5320728A (en) * 1990-03-30 1994-06-14 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
USD351450S (en) * 1993-05-19 1994-10-11 Riteflite Pty. Limited Target for shooting
USD376744S (en) * 1994-08-03 1996-12-24 Gerd Eisenblatter Gmbh Support plate
USD381030S (en) * 1995-11-21 1997-07-15 Avi Tepman Sputtering target
AU129071S (en) * 1996-06-07 1997-01-14 Riteflite Pty Ltd Target
USD403337S (en) * 1997-08-05 1998-12-29 Applied Materials, Inc. High conductance low wall deposition upper shield
USD401252S (en) * 1998-01-27 1998-11-17 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
USD403002S (en) * 1998-01-27 1998-12-22 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
USD403334S (en) * 1998-01-27 1998-12-29 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
USD491963S1 (en) * 2002-11-20 2004-06-22 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US8371904B2 (en) * 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
US9834840B2 (en) 2010-05-14 2017-12-05 Applied Materials, Inc. Process kit shield for improved particle reduction
WO2012142408A2 (en) * 2011-04-14 2012-10-18 Veeco Instruments Inc. Substrate holders and methods of substrate mounting
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
US9475996B2 (en) * 2012-10-17 2016-10-25 Richard Max Mandle Centrifugal fluid ring plasma reactor
US20150357169A1 (en) * 2013-01-04 2015-12-10 Tosoh Smd, Inc. Silicon sputtering target with enhanced surface profile and improved performance and methods of making the same
TWD169790S (en) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 Part of the vaporizer for substrate processing equipment
USD741921S1 (en) * 2014-04-15 2015-10-27 Q-Linea Ab Positive mold for manufacturing a sample holding disc
USD738451S1 (en) * 2014-11-11 2015-09-08 Mary Olson Golf ball target for chipping and putting
US10546733B2 (en) 2014-12-31 2020-01-28 Applied Materials, Inc. One-piece process kit shield
CN107787377A (en) 2015-07-03 2018-03-09 应用材料公司 Processing accessory with high deposition ring and deposition ring fixture
US10174437B2 (en) * 2015-07-09 2019-01-08 Applied Materials, Inc. Wafer electroplating chuck assembly
JP1549882S (en) * 2015-08-18 2016-05-23
US10103012B2 (en) 2015-09-11 2018-10-16 Applied Materials, Inc. One-piece process kit shield for reducing the impact of an electric field near the substrate
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD819580S1 (en) * 2016-04-01 2018-06-05 Veeco Instruments, Inc. Self-centering wafer carrier for chemical vapor deposition
TWD178424S (en) * 2016-01-08 2016-09-21 ASM知識產權私人控股有&#x9 Gas flow control plate for semiconductor manufacturing apparatus
JP7117300B2 (en) 2016-11-19 2022-08-12 アプライド マテリアルズ インコーポレイテッド Process kit with floating shadow ring
US11158491B2 (en) * 2017-06-01 2021-10-26 Oerlikon Surface Solutions Ag, Pfäffikon Target assembly for safe and economic evaporation of brittle materials
US10998172B2 (en) 2017-09-22 2021-05-04 Applied Materials, Inc. Substrate processing chamber having improved process volume sealing
JP1605779S (en) 2017-12-19 2018-06-04
USD880437S1 (en) * 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD888903S1 (en) * 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
JP1646366S (en) 2019-03-19 2019-11-25
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber

Also Published As

Publication number Publication date
USD941371S1 (en) 2022-01-18
JP1696666S (en) 2021-10-11
TWD215401S (en) 2021-11-21
JP1696763S (en) 2021-10-11

Similar Documents

Publication Publication Date Title
TWD215400S (en) Process shield for a substrate processing chamber
TWD207742S (en) Process shield for a substrate processing chamber
TWD215398S (en) Process shield for a substrate processing chamber
TWD215731S (en) Wearable device
TWD210286S (en) Susceptor
TWD212933S (en) Base plate for a processing chamber substrate support
TWD211363S (en) Substrate carrier
TWD214316S (en) Inner shield for a substrate processing chamber
TWD210894S (en) Process shield for a substrate processing chamber
TWD224469S (en) Base plate for a substrate support
TWD215403S (en) Deposition ring for a substrate processing chamber
TWD217686S (en) Deposition ring for a semiconductor processing chamber
TWD202102S (en) A collimator for use in a physical vapor deposition (pvd) chamber
TWD216287S (en) Cover for an electronic device
TWD218475S (en) Earring
TWD222060S (en) Diffuser
TWD217045S (en) Susceptor support
TWD211584S (en) Lower shield for a substrate processing chamber
TWD227498S (en) Gas distribution plate
TWD221372S (en) Part of lipstick
TWD227252S (en) Substrate support for a substrate processing chamber
TWD224341S (en) Adjustable arm
TWD226352S (en) Brooch
TWD226353S (en) Brooch
TWD231193S (en) Part of a substrate holder for a substrate processing device