TWD178424S - Gas flow control plate for semiconductor manufacturing apparatus - Google Patents

Gas flow control plate for semiconductor manufacturing apparatus

Info

Publication number
TWD178424S
TWD178424S TW105301267F TW105301267F TWD178424S TW D178424 S TWD178424 S TW D178424S TW 105301267 F TW105301267 F TW 105301267F TW 105301267 F TW105301267 F TW 105301267F TW D178424 S TWD178424 S TW D178424S
Authority
TW
Taiwan
Prior art keywords
semiconductor manufacturing
flow control
air flow
manufacturing equipment
design
Prior art date
Application number
TW105301267F
Other languages
Chinese (zh)
Inventor
Hyun Soo Jang
Jeong Ho Lee
Young Hoon Kim
Young Hyo Jeon
Original Assignee
ASM知識產權私人控股有&#x9
Asm Ip Holding Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM知識產權私人控股有&#x9, Asm Ip Holding Bv filed Critical ASM知識產權私人控股有&#x9
Publication of TWD178424S publication Critical patent/TWD178424S/en

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Abstract

【物品用途】;本設計係關於一種用於半導體製造設備的氣流控制板。;【設計說明】;本設計之用於半導體製造設備的氣流控制板係安裝在半導體製造設備的反應器內部,用於控制進行操作後所排出氣體的氣流。如各圖式所示,在沿著該氣流控制板之頂表面的側緣部分處延伸並突出有一突出部分,該突出部分形成有一傾斜面,並在沿著該傾斜面等間隔且連續地形成有朝向中心的複數個貫穿孔,使氣體能在進行操作後流入該複數個貫穿孔。此外,在該氣流控制板的中心處設置有一氣體入口及用於使電漿電極棒可置入其中且對稱地設置在該氣體入口周圍的二個孔。;本設計之用於半導體製造設備的氣流控制板的外觀特徵已顯示於各圖式,其中A-A’全剖面視圖係沿著俯視圖中之A-A’剖面線的全剖面立體圖,且該A-A’全剖面視圖中所揭露的斜線部分用於表示A-A’端面之特徵。【Use of article】;This design is about an airflow control panel used in semiconductor manufacturing equipment. ;[Design Description];The air flow control board used in semiconductor manufacturing equipment designed in this design is installed inside the reactor of semiconductor manufacturing equipment and is used to control the air flow of the gas discharged after operation. As shown in each figure, a protruding portion extends and protrudes along the side edge portion of the top surface of the air flow control plate. The protruding portion forms an inclined surface and is formed at equal intervals and continuously along the inclined surface. There are a plurality of through holes toward the center, so that gas can flow into the plurality of through holes after operation. In addition, a gas inlet and two holes for allowing the plasma electrode rod to be placed therein are provided at the center of the gas flow control plate and are symmetrically arranged around the gas inlet. ;The appearance characteristics of the air flow control board for semiconductor manufacturing equipment of this design have been shown in each drawing, in which the full cross-sectional view A-A' is a full cross-sectional perspective view along the cross-sectional line A-A' in the top view, and the The hatched portion disclosed in the AA' full cross-sectional view is used to indicate the characteristics of the AA' end surface.

TW105301267F 2016-01-08 2016-03-11 Gas flow control plate for semiconductor manufacturing apparatus TWD178424S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20160000957 2016-01-08

Publications (1)

Publication Number Publication Date
TWD178424S true TWD178424S (en) 2016-09-21

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Family Applications (1)

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TW105301267F TWD178424S (en) 2016-01-08 2016-03-11 Gas flow control plate for semiconductor manufacturing apparatus

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US (1) USD796458S1 (en)
TW (1) TWD178424S (en)

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