JP1648531S - - Google Patents
Info
- Publication number
- JP1648531S JP1648531S JPD2019-1458F JP2019001458F JP1648531S JP 1648531 S JP1648531 S JP 1648531S JP 2019001458 F JP2019001458 F JP 2019001458F JP 1648531 S JP1648531 S JP 1648531S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-1458F JP1648531S (en) | 2019-01-28 | 2019-01-28 | |
| TW108303614F TWD203444S (en) | 2019-01-28 | 2019-06-19 | Gas introduction tube for substrate processing device |
| US29/699,539 USD901564S1 (en) | 2019-01-28 | 2019-07-26 | Gas inlet attachment for wafer processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-1458F JP1648531S (en) | 2019-01-28 | 2019-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1648531S true JP1648531S (en) | 2019-12-23 |
Family
ID=68916739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-1458F Active JP1648531S (en) | 2019-01-28 | 2019-01-28 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD901564S1 (en) |
| JP (1) | JP1648531S (en) |
| TW (1) | TWD203444S (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD964443S1 (en) | 2020-08-18 | 2022-09-20 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1624352S (en) * | 2018-07-19 | 2019-02-12 | ||
| JP1651622S (en) * | 2019-07-17 | 2020-01-27 | ||
| JP1672083S (en) * | 2019-11-13 | 2020-11-09 | ||
| JP1672164S (en) * | 2020-03-25 | 2020-11-09 | ||
| JP1684258S (en) | 2020-07-27 | 2021-04-26 | ||
| USD983151S1 (en) * | 2020-09-09 | 2023-04-11 | Kokusai Electric Corporation | Exhaust liner for reaction tube |
| JP1700780S (en) | 2021-03-22 | 2021-11-29 | ||
| TWD223988S (en) | 2022-03-03 | 2023-03-01 | 家登精密工業股份有限公司 | air box |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD326273S (en) * | 1988-07-25 | 1992-05-19 | Tel Sagami Limited | Heat insulating cylinder for thermal treatment of semiconductor wafers |
| USD326272S (en) * | 1988-07-25 | 1992-05-19 | Tel Sagami Limited | Heat insulating cylinder for thermal treatment of semiconductor wafers |
| KR100500246B1 (en) * | 2003-04-09 | 2005-07-11 | 삼성전자주식회사 | Gas supplying apparatus |
| JP5044931B2 (en) * | 2005-10-31 | 2012-10-10 | 東京エレクトロン株式会社 | Gas supply apparatus and substrate processing apparatus |
| CN100451163C (en) * | 2006-10-18 | 2009-01-14 | 中微半导体设备(上海)有限公司 | Gas distribution device for treating reactor by semiconductor technological element and reactor thereof |
| JP2009239082A (en) * | 2008-03-27 | 2009-10-15 | Tokyo Electron Ltd | Gas feeding device, treating device, and treating method |
| JP5292160B2 (en) * | 2009-03-31 | 2013-09-18 | 東京エレクトロン株式会社 | Gas flow path structure and substrate processing apparatus |
| US10683571B2 (en) * | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
| US20150348755A1 (en) * | 2014-05-29 | 2015-12-03 | Charm Engineering Co., Ltd. | Gas distribution apparatus and substrate processing apparatus including same |
| JP6578243B2 (en) * | 2015-07-17 | 2019-09-18 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | Gas supply nozzle, substrate processing apparatus, semiconductor device manufacturing method and program |
| USD787458S1 (en) * | 2015-11-18 | 2017-05-23 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
| TWD178424S (en) * | 2016-01-08 | 2016-09-21 | ＡＳＭ知識產權私人控股有	 | Gas flow control plate for semiconductor manufacturing apparatus |
| KR102613349B1 (en) * | 2016-08-25 | 2023-12-14 | 에이에스엠 아이피 홀딩 비.브이. | Exhaust apparatus and substrate processing apparatus and thin film fabricating method using the same |
| JP6710134B2 (en) * | 2016-09-27 | 2020-06-17 | 東京エレクトロン株式会社 | Gas introduction mechanism and processing device |
| JP6550029B2 (en) | 2016-09-28 | 2019-07-24 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | Substrate processing apparatus, nozzle base and method of manufacturing semiconductor device |
| JP6737139B2 (en) * | 2016-11-14 | 2020-08-05 | 東京エレクトロン株式会社 | Gas injector and vertical heat treatment equipment |
| KR102546317B1 (en) * | 2016-11-15 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | Gas supply unit and substrate processing apparatus including the same |
-
2019
- 2019-01-28 JP JPD2019-1458F patent/JP1648531S/ja active Active
- 2019-06-19 TW TW108303614F patent/TWD203444S/en unknown
- 2019-07-26 US US29/699,539 patent/USD901564S1/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD964443S1 (en) | 2020-08-18 | 2022-09-20 | Kokusai Electric Corporation | Gas inlet attachment for wafer processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD203444S (en) | 2020-03-21 |
| USD901564S1 (en) | 2020-11-10 |