USD901564S1 - Gas inlet attachment for wafer processing apparatus - Google Patents

Gas inlet attachment for wafer processing apparatus Download PDF

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Publication number
USD901564S1
USD901564S1 US29/699,539 US201929699539F USD901564S US D901564 S1 USD901564 S1 US D901564S1 US 201929699539 F US201929699539 F US 201929699539F US D901564 S USD901564 S US D901564S
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United States
Prior art keywords
processing apparatus
gas inlet
wafer processing
inlet attachment
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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US29/699,539
Inventor
Satoru Murata
Shinya Morita
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Kokusai Electric Corp
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Kokusai Electric Corp
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Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MORITA, SHINYA, MURATA, SATORU
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FIG. 1 is a front, top and right side perspective view of a gas inlet attachment for wafer processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2.

Claims (1)

    CLAIM
  1. The ornamental design for a gas inlet attachment for wafer processing apparatus, as shown and described.
US29/699,539 2019-01-28 2019-07-26 Gas inlet attachment for wafer processing apparatus Active USD901564S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-001458 2019-01-28
JPD2019-1458F JP1648531S (en) 2019-01-28 2019-01-28

Publications (1)

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USD901564S1 true USD901564S1 (en) 2020-11-10

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US29/699,539 Active USD901564S1 (en) 2019-01-28 2019-07-26 Gas inlet attachment for wafer processing apparatus

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US (1) USD901564S1 (en)
JP (1) JP1648531S (en)
TW (1) TWD203444S (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD924953S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Gas inlet attachment for substrate processing apparatus
USD944661S1 (en) * 2019-07-17 2022-03-01 Kokusai Electric Corporation Calibrator for wafer handling robots
USD964443S1 (en) 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD967210S1 (en) * 2020-03-25 2022-10-18 SEVENTY EIGHT Co., Ltd. Welding nozzle cleaner
USD973738S1 (en) * 2019-11-13 2022-12-27 SEVENTY EIGHT Co., Ltd. Welding nozzle cleaner
USD983151S1 (en) * 2020-09-09 2023-04-11 Kokusai Electric Corporation Exhaust liner for reaction tube
USD1017561S1 (en) 2021-03-22 2024-03-12 Kokusai Electric Corporation Nozzle holder of substrate processing apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1684258S (en) 2020-07-27 2021-04-26
TWD223988S (en) 2022-03-03 2023-03-01 家登精密工業股份有限公司 air box

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326273S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US20040217217A1 (en) * 2003-04-09 2004-11-04 Samsung Electronics Co., Ltd. Gas supplying apparatus
US20070131168A1 (en) * 2005-10-31 2007-06-14 Hisashi Gomi Gas Supplying unit and substrate processing apparatus
US20080092815A1 (en) * 2006-10-18 2008-04-24 Advanced Micro-Fabrication Equipment, Inc. Asia Gas distribution assembly for use in a semiconductor work piece processing reactor
US20100243166A1 (en) * 2009-03-31 2010-09-30 Tokyo Electron Limited Gas flow path structure and substrate processing apparatus
US20110098841A1 (en) * 2008-03-27 2011-04-28 Tokyo Electron Limited Gas supply device, processing apparatus, processing method, and storage medium
US20150240359A1 (en) * 2014-02-25 2015-08-27 Asm Ip Holding B.V. Gas Supply Manifold And Method Of Supplying Gases To Chamber Using Same
US20150348755A1 (en) * 2014-05-29 2015-12-03 Charm Engineering Co., Ltd. Gas distribution apparatus and substrate processing apparatus including same
US20170051408A1 (en) * 2015-07-17 2017-02-23 Hitachi Kokusai Electric Inc. Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
US20180087152A1 (en) 2016-09-28 2018-03-29 Hitachi Kokusai Electric Inc. Substrate processing apparatus, nozzle base, and manufacturing method for semiconductor device
US20180087156A1 (en) * 2016-09-27 2018-03-29 Tokyo Electron Limited Gas Introduction Mechanism and Processing Apparatus
US20180135179A1 (en) * 2016-11-14 2018-05-17 Tokyo Electron Limited Gas Injector and Vertical Heat Treatment Apparatus
US20180135173A1 (en) * 2016-11-15 2018-05-17 Asm Ip Holding B.V. Gas supply unit and substrate processing apparatus including the gas supply unit
US10364493B2 (en) * 2016-08-25 2019-07-30 Asm Ip Holding B.V. Exhaust apparatus and substrate processing apparatus having an exhaust line with a first ring having at least one hole on a lateral side thereof placed in the exhaust line

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326273S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US20040217217A1 (en) * 2003-04-09 2004-11-04 Samsung Electronics Co., Ltd. Gas supplying apparatus
US20070131168A1 (en) * 2005-10-31 2007-06-14 Hisashi Gomi Gas Supplying unit and substrate processing apparatus
US20080092815A1 (en) * 2006-10-18 2008-04-24 Advanced Micro-Fabrication Equipment, Inc. Asia Gas distribution assembly for use in a semiconductor work piece processing reactor
US20110098841A1 (en) * 2008-03-27 2011-04-28 Tokyo Electron Limited Gas supply device, processing apparatus, processing method, and storage medium
US20100243166A1 (en) * 2009-03-31 2010-09-30 Tokyo Electron Limited Gas flow path structure and substrate processing apparatus
US20150240359A1 (en) * 2014-02-25 2015-08-27 Asm Ip Holding B.V. Gas Supply Manifold And Method Of Supplying Gases To Chamber Using Same
US20150348755A1 (en) * 2014-05-29 2015-12-03 Charm Engineering Co., Ltd. Gas distribution apparatus and substrate processing apparatus including same
US20170051408A1 (en) * 2015-07-17 2017-02-23 Hitachi Kokusai Electric Inc. Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording medium
USD787458S1 (en) * 2015-11-18 2017-05-23 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
USD796458S1 (en) * 2016-01-08 2017-09-05 Asm Ip Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
US10364493B2 (en) * 2016-08-25 2019-07-30 Asm Ip Holding B.V. Exhaust apparatus and substrate processing apparatus having an exhaust line with a first ring having at least one hole on a lateral side thereof placed in the exhaust line
US20180087156A1 (en) * 2016-09-27 2018-03-29 Tokyo Electron Limited Gas Introduction Mechanism and Processing Apparatus
US20180087152A1 (en) 2016-09-28 2018-03-29 Hitachi Kokusai Electric Inc. Substrate processing apparatus, nozzle base, and manufacturing method for semiconductor device
US20180135179A1 (en) * 2016-11-14 2018-05-17 Tokyo Electron Limited Gas Injector and Vertical Heat Treatment Apparatus
US20180135173A1 (en) * 2016-11-15 2018-05-17 Asm Ip Holding B.V. Gas supply unit and substrate processing apparatus including the gas supply unit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD924953S1 (en) * 2018-07-19 2021-07-13 Kokusai Electric Corporation Gas inlet attachment for substrate processing apparatus
USD944661S1 (en) * 2019-07-17 2022-03-01 Kokusai Electric Corporation Calibrator for wafer handling robots
USD973738S1 (en) * 2019-11-13 2022-12-27 SEVENTY EIGHT Co., Ltd. Welding nozzle cleaner
USD967210S1 (en) * 2020-03-25 2022-10-18 SEVENTY EIGHT Co., Ltd. Welding nozzle cleaner
USD964443S1 (en) 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD983151S1 (en) * 2020-09-09 2023-04-11 Kokusai Electric Corporation Exhaust liner for reaction tube
USD1017561S1 (en) 2021-03-22 2024-03-12 Kokusai Electric Corporation Nozzle holder of substrate processing apparatus

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Publication number Publication date
JP1648531S (en) 2019-12-23
TWD203444S (en) 2020-03-21

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