USD924823S1 - Adiabatic plate for substrate processing apparatus - Google Patents

Adiabatic plate for substrate processing apparatus Download PDF

Info

Publication number
USD924823S1
USD924823S1 US29/672,222 US201829672222F USD924823S US D924823 S1 USD924823 S1 US D924823S1 US 201829672222 F US201829672222 F US 201829672222F US D924823 S USD924823 S US D924823S
Authority
US
United States
Prior art keywords
processing apparatus
substrate processing
adiabatic plate
adiabatic
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/672,222
Inventor
Koji Saiki
Makoto Tsuri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAIKI, KOJI, TSURI, MAKOTO
Application granted granted Critical
Publication of USD924823S1 publication Critical patent/USD924823S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a front, bottom and right side perspective view of an adiabatic plate for substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof; and,
FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 2.

Claims (1)

    CLAIM
  1. We claim the ornamental design for an adiabatic plate for substrate processing apparatus, as shown and described.
US29/672,222 2018-07-19 2018-12-04 Adiabatic plate for substrate processing apparatus Active USD924823S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-015809 2018-07-19
JPD2018-15809F JP1624353S (en) 2018-07-19 2018-07-19

Publications (1)

Publication Number Publication Date
USD924823S1 true USD924823S1 (en) 2021-07-13

Family

ID=65269381

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/672,222 Active USD924823S1 (en) 2018-07-19 2018-12-04 Adiabatic plate for substrate processing apparatus

Country Status (3)

Country Link
US (1) USD924823S1 (en)
JP (1) JP1624353S (en)
TW (1) TWD197466S (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
US11367641B2 (en) * 2019-12-24 2022-06-21 Powertech Technology Inc. Wafer storage device, carrier plate and wafer cassette
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD962206S1 (en) * 2020-01-09 2022-08-30 Space Exploration Technologies Corp. Antenna apparatus
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
USD971192S1 (en) * 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD981972S1 (en) 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
USD1016762S1 (en) * 2021-12-21 2024-03-05 Panasonic Intellectual Property Management Co., Ltd. Flexible printed circuit board

Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
US5358781A (en) * 1990-11-30 1994-10-25 Somar Corporation Heat insulating plate comprising synthetic paper sheets and metal films
USD359476S (en) * 1993-08-06 1995-06-20 Sankyo Seiki Mfg. Co., Ltd. Circuit board with mounting flange
USD404374S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
US20020167122A1 (en) * 1999-07-26 2002-11-14 Ovadia Meron Latch for detachably attaching and mounting a semiconductor wafer to a support ring
US6631935B1 (en) * 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US20040256284A1 (en) * 2002-11-26 2004-12-23 Masatoshi Nanjo Cassette for storing a plurality of semiconductor wafers
USD547147S1 (en) * 2006-09-01 2007-07-24 Huy Tran Window tinting tool
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
US20100055555A1 (en) * 2008-09-01 2010-03-04 Sony Corporation Insulating plate of nonaqueous electrolyte secondary cell, nonaqueous electrolyte secondary cell, and method for producing insulating plate of nonaqueous electrolyte secondary cell
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
JP1568061S (en) 2016-03-30 2017-01-30
USD793352S1 (en) * 2016-07-11 2017-08-01 Asm Ip Holding B.V. Getter plate
US20170335458A1 (en) * 2015-02-25 2017-11-23 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus, Heater and Method of Manufacturing Semiconductor Device
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US10008402B1 (en) * 2017-02-21 2018-06-26 Coorstek Kk Vertical wafer boat
USD843184S1 (en) * 2016-06-02 2019-03-19 David Harold Woodcock Cutting tool for adhesive tape dispensers
USD849422S1 (en) * 2014-12-17 2019-05-28 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
USD852763S1 (en) * 2017-08-31 2019-07-02 ebm-papst Lanshut GmbH Circuit board
US20190287832A1 (en) * 2018-03-13 2019-09-19 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
US20200144053A1 (en) * 2016-11-28 2020-05-07 Mitsubishi Electric Corporation Semiconductor wafer, semiconductor device, and method for producing semiconductor device
USD900044S1 (en) * 2018-12-18 2020-10-27 SiFive, Inc. Circuit board
US10941787B2 (en) * 2017-04-25 2021-03-09 Shimadzu Corporation Power source integrated vacuum pump having a power source with a substrate in contact with and covering a portion of a cooling surface which is also covered by a heat insulating plate

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5358781A (en) * 1990-11-30 1994-10-25 Somar Corporation Heat insulating plate comprising synthetic paper sheets and metal films
US5088006A (en) * 1991-04-25 1992-02-11 International Business Machines Corporation Liquid film interface cooling system for semiconductor wafer processing
USD359476S (en) * 1993-08-06 1995-06-20 Sankyo Seiki Mfg. Co., Ltd. Circuit board with mounting flange
USD404374S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Fin for use in a semiconductor wafer heat processing apparatus
US20020167122A1 (en) * 1999-07-26 2002-11-14 Ovadia Meron Latch for detachably attaching and mounting a semiconductor wafer to a support ring
US6631935B1 (en) * 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US20040256284A1 (en) * 2002-11-26 2004-12-23 Masatoshi Nanjo Cassette for storing a plurality of semiconductor wafers
US7329947B2 (en) * 2003-11-07 2008-02-12 Sumitomo Mitsubishi Silicon Corporation Heat treatment jig for semiconductor substrate
USD547147S1 (en) * 2006-09-01 2007-07-24 Huy Tran Window tinting tool
US20100055555A1 (en) * 2008-09-01 2010-03-04 Sony Corporation Insulating plate of nonaqueous electrolyte secondary cell, nonaqueous electrolyte secondary cell, and method for producing insulating plate of nonaqueous electrolyte secondary cell
USD616392S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD651992S1 (en) * 2010-08-17 2012-01-10 Sumitomo Electric Industries, Ltd. Semiconductor substrate
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD849422S1 (en) * 2014-12-17 2019-05-28 Ngk Insulators, Ltd. Composite substrate for acoustic wave device
US20170335458A1 (en) * 2015-02-25 2017-11-23 Hitachi Kokusai Electric Inc. Substrate Processing Apparatus, Heater and Method of Manufacturing Semiconductor Device
JP1568061S (en) 2016-03-30 2017-01-30
USD843184S1 (en) * 2016-06-02 2019-03-19 David Harold Woodcock Cutting tool for adhesive tape dispensers
USD793352S1 (en) * 2016-07-11 2017-08-01 Asm Ip Holding B.V. Getter plate
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
US20200144053A1 (en) * 2016-11-28 2020-05-07 Mitsubishi Electric Corporation Semiconductor wafer, semiconductor device, and method for producing semiconductor device
US10453713B2 (en) * 2016-11-29 2019-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling temperature of furnace in semiconductor fabrication process
US10008402B1 (en) * 2017-02-21 2018-06-26 Coorstek Kk Vertical wafer boat
US10941787B2 (en) * 2017-04-25 2021-03-09 Shimadzu Corporation Power source integrated vacuum pump having a power source with a substrate in contact with and covering a portion of a cooling surface which is also covered by a heat insulating plate
USD852763S1 (en) * 2017-08-31 2019-07-02 ebm-papst Lanshut GmbH Circuit board
US20190287832A1 (en) * 2018-03-13 2019-09-19 Samsung Electronics Co., Ltd. Segmented vertical wafer boat
USD900044S1 (en) * 2018-12-18 2020-10-27 SiFive, Inc. Circuit board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD971192S1 (en) * 2019-06-03 2022-11-29 Space Exploration Technologies Corp. Antenna apparatus
USD971900S1 (en) 2019-06-03 2022-12-06 Space Exploration Technologies Corp. Antenna apparatus
USD976242S1 (en) 2019-06-03 2023-01-24 Space Exploration Technologies Corp. Antenna apparatus
USD1012070S1 (en) 2019-06-03 2024-01-23 Space Exploration Technologies Corp. Antenna apparatus
USD940131S1 (en) * 2019-07-29 2022-01-04 Samsung Display Co., Ltd. Display panel
USD958094S1 (en) 2019-07-29 2022-07-19 Samsung Display Co., Ltd. Display panel
USD966276S1 (en) 2019-07-29 2022-10-11 Samsung Display Co., Ltd. Display module for wearable device
US11367641B2 (en) * 2019-12-24 2022-06-21 Powertech Technology Inc. Wafer storage device, carrier plate and wafer cassette
USD962206S1 (en) * 2020-01-09 2022-08-30 Space Exploration Technologies Corp. Antenna apparatus
USD981972S1 (en) 2021-03-22 2023-03-28 Kokusai Electric Corporation Adiabatic plate for substrate processing appratus
USD1016762S1 (en) * 2021-12-21 2024-03-05 Panasonic Intellectual Property Management Co., Ltd. Flexible printed circuit board

Also Published As

Publication number Publication date
TWD197466S (en) 2019-05-11
JP1624353S (en) 2019-02-12

Similar Documents

Publication Publication Date Title
USD924823S1 (en) Adiabatic plate for substrate processing apparatus
USD967814S1 (en) Computing device
USD872079S1 (en) Display device
USD896223S1 (en) Display device
USD890346S1 (en) Electrocardiography device
USD861995S1 (en) Pet treat dispensing apparatus
USD860029S1 (en) Doorbell
USD876719S1 (en) Vape device
USD842305S1 (en) Stand for electronic devices
USD851180S1 (en) Base plate
USD868980S1 (en) Electronic face slimming guasha plate
USD856027S1 (en) Mat
USD846514S1 (en) Boat of substrate processing apparatus
USD889456S1 (en) Smart apparatus
USD880000S1 (en) Booth
USD816417S1 (en) Plate
USD890347S1 (en) Electrocardiography device
USD852656S1 (en) Wearable device
USD876402S1 (en) Radar sensor apparatus
USD902920S1 (en) Portable electronic device
USD839219S1 (en) Boat for substrate processing apparatus
USD923498S1 (en) Distance measuring apparatus
USD883596S1 (en) Suction device
USD887278S1 (en) Bottle
USD861458S1 (en) Wall plate adapter

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY