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JPH0785919B2
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1990-11-30 |
1995-09-20 |
ソマール株式会社 |
断熱板
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1991-04-25 |
1992-02-11 |
International Business Machines Corporation |
Liquid film interface cooling system for semiconductor wafer processing
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1993-08-06 |
1995-06-20 |
Sankyo Seiki Mfg. Co., Ltd. |
Circuit board with mounting flange
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1997-08-20 |
1999-01-19 |
Tokyo Electron Limited |
Fin for use in a semiconductor wafer heat processing apparatus
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1999-07-26 |
2004-08-31 |
Ovadia Meron |
Latch for detachably attaching and mounting a semiconductor wafer to a support ring
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Tru-Si Technologies, Inc. |
Detection and handling of semiconductor wafer and wafer-like objects
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2004-06-10 |
Disco Corporation |
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2003-11-07 |
2008-02-12 |
Sumitomo Mitsubishi Silicon Corporation |
Heat treatment jig for semiconductor substrate
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2007-07-24 |
Huy Tran |
Window tinting tool
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ソニー株式会社 |
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2009-03-06 |
2010-05-25 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
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2015-05-11 |
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2012-02-28 |
Tokyo Electron Limited |
Top plate for reactor for manufacturing semiconductor
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Tokyo Electron Limited |
Top plate for reactor for manufacturing semiconductor
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Inner tube for process tube for manufacturing semiconductor wafers
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日本碍子股份有限公司 |
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기판 처리 장치, 히터 및 반도체 장치의 제조 방법
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2019-03-19 |
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Cutting tool for adhesive tape dispensers
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Norton (Waterford) Limited |
Circuit board
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三菱電機株式会社 |
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2019-10-22 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Method for controlling temperature of furnace in semiconductor fabrication process
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2020-10-14 |
クアーズテック株式会社 |
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2017-04-25 |
2021-08-11 |
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ebm-papst Lanshut GmbH |
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Samsung Electronics Co., Ltd. |
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Circuit board
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