TWD197466S - 基板處理裝置用隔熱板 - Google Patents
基板處理裝置用隔熱板Info
- Publication number
- TWD197466S TWD197466S TW107306663F TW107306663F TWD197466S TW D197466 S TWD197466 S TW D197466S TW 107306663 F TW107306663 F TW 107306663F TW 107306663 F TW107306663 F TW 107306663F TW D197466 S TWD197466 S TW D197466S
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate processing
- processing equipment
- heat shielding
- shielding panels
- article
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 235000012431 wafers Nutrition 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
Abstract
【物品用途】;本設計的物品是基板處理裝置用隔熱板，為一種應用在處理晶圓的基板處理裝置中；本物品是設置在晶舟下方，用以阻擋來自加熱器的輻射熱。;【設計說明】;(無)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-15809F JP1624353S (zh) | 2018-07-19 | 2018-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD197466S true TWD197466S (zh) | 2019-05-11 |
Family
ID=65269381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107306663F TWD197466S (zh) | 2018-07-19 | 2018-11-12 | 基板處理裝置用隔熱板 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD924823S1 (zh) |
| JP (1) | JP1624353S (zh) |
| TW (1) | TWD197466S (zh) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD971192S1 (en) * | 2019-06-03 | 2022-11-29 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD976242S1 (en) | 2019-06-03 | 2023-01-24 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD971900S1 (en) | 2019-06-03 | 2022-12-06 | Space Exploration Technologies Corp. | Antenna apparatus |
| USD966276S1 (en) | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
| USD940131S1 (en) * | 2019-07-29 | 2022-01-04 | Samsung Display Co., Ltd. | Display panel |
| USD958094S1 (en) | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
| TWI735115B (zh) * | 2019-12-24 | 2021-08-01 | 力成科技股份有限公司 | 晶圓儲存裝置及晶圓承載盤 |
| USD962206S1 (en) * | 2020-01-09 | 2022-08-30 | Space Exploration Technologies Corp. | Antenna apparatus |
| JP1700781S (zh) | 2021-03-22 | 2021-11-29 | ||
| JP1730244S (ja) * | 2021-12-21 | 2022-11-21 | フレキシブルプリント基板 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0785919B2 (ja) * | 1990-11-30 | 1995-09-20 | ソマール株式会社 | 断熱板 |
| US5088006A (en) * | 1991-04-25 | 1992-02-11 | International Business Machines Corporation | Liquid film interface cooling system for semiconductor wafer processing |
| USD359476S (en) * | 1993-08-06 | 1995-06-20 | Sankyo Seiki Mfg. Co., Ltd. | Circuit board with mounting flange |
| USD404374S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Fin for use in a semiconductor wafer heat processing apparatus |
| US6783299B2 (en) * | 1999-07-26 | 2004-08-31 | Ovadia Meron | Latch for detachably attaching and mounting a semiconductor wafer to a support ring |
| US6631935B1 (en) * | 2000-08-04 | 2003-10-14 | Tru-Si Technologies, Inc. | Detection and handling of semiconductor wafer and wafer-like objects |
| WO2004049430A1 (ja) * | 2002-11-26 | 2004-06-10 | Disco Corporation | 複数枚の半導体ウエーハを収容するためのカセット |
| US7329947B2 (en) * | 2003-11-07 | 2008-02-12 | Sumitomo Mitsubishi Silicon Corporation | Heat treatment jig for semiconductor substrate |
| USD547147S1 (en) * | 2006-09-01 | 2007-07-24 | Huy Tran | Window tinting tool |
| JP4748193B2 (ja) * | 2008-09-01 | 2011-08-17 | ソニー株式会社 | 非水電解質二次電池の絶縁板、非水電解質二次電池および非水電解質二次電池の絶縁板の製造方法 |
| USD616392S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| JP1441120S (zh) * | 2010-08-17 | 2015-05-11 | ||
| USD654883S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD654884S1 (en) * | 2010-10-21 | 2012-02-28 | Tokyo Electron Limited | Top plate for reactor for manufacturing semiconductor |
| USD720309S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
| TWD174921S (zh) * | 2014-12-17 | 2016-04-11 | 日本碍子股份有限公司 | 複合基板之部分 |
| KR102173376B1 (ko) * | 2015-02-25 | 2020-11-03 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 히터 및 반도체 장치의 제조 방법 |
| JP1568061S (zh) | 2016-03-30 | 2017-01-30 | ||
| USD843184S1 (en) * | 2016-06-02 | 2019-03-19 | David Harold Woodcock | Cutting tool for adhesive tape dispensers |
| USD793352S1 (en) * | 2016-07-11 | 2017-08-01 | Asm Ip Holding B.V. | Getter plate |
| USD804437S1 (en) * | 2016-09-30 | 2017-12-05 | Norton (Waterford) Limited | Circuit board |
| WO2018096684A1 (ja) * | 2016-11-28 | 2018-05-31 | 三菱電機株式会社 | 半導体ウエハ、半導体チップ、および半導体装置の製造方法 |
| US10453713B2 (en) * | 2016-11-29 | 2019-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for controlling temperature of furnace in semiconductor fabrication process |
| JP6770461B2 (ja) * | 2017-02-21 | 2020-10-14 | クアーズテック株式会社 | 縦型ウエハボート |
| JP6916413B2 (ja) * | 2017-04-25 | 2021-08-11 | 株式会社島津製作所 | 電源一体型真空ポンプ |
| USD852763S1 (en) * | 2017-08-31 | 2019-07-02 | ebm-papst Lanshut GmbH | Circuit board |
| US10861727B2 (en) * | 2018-03-13 | 2020-12-08 | Samsung Electronics Co., Ltd. | Segmented vertical wafer boat |
| USD879730S1 (en) * | 2018-12-18 | 2020-03-31 | SiFive, Inc. | Circuit board |
-
2018
- 2018-07-19 JP JPD2018-15809F patent/JP1624353S/ja active Active
- 2018-11-12 TW TW107306663F patent/TWD197466S/zh unknown
- 2018-12-04 US US29/672,222 patent/USD924823S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD924823S1 (en) | 2021-07-13 |
| JP1624353S (zh) | 2019-02-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWD197466S (zh) | 基板處理裝置用隔熱板 | |
| TWD189313S (zh) | 用於半導體製造設備的承載器 | |
| TWD208179S (zh) | 基板處理裝置用晶舟之部分 | |
| TWD183010S (zh) | 基板處理裝置用晶舟 | |
| TWD166332S (zh) | 基板處理裝置用晶舟之部分 | |
| TWD163542S (zh) | 基板處理裝置用晶舟 | |
| JP2015109419A5 (zh) | ||
| TW201613029A (en) | Bearing apparatus and semiconductor processing device | |
| JP1684468S (ja) | 基板処理装置用天井ヒータ | |
| TWD177997S (zh) | 基板處理裝置用隔熱具 | |
| TWD177998S (zh) | 基板處理裝置用隔熱具 | |
| TWD177999S (zh) | 基板處理裝置用隔熱具 | |
| TW201612967A (en) | Polishing method and polishing apparatus | |
| TWD218093S (zh) | 基板處理裝置用晶舟之部分 | |
| TWD183004S (zh) | 半導體製造裝置之隔熱組件 | |
| TWD197467S (zh) | 基板處理裝置用氣體導入管 | |
| JP1684469S (ja) | 基板処理装置用天井ヒータ | |
| TWD177996S (zh) | 基板處理裝置用隔熱具 | |
| TWD183008S (zh) | 基板處理裝置用加熱器 | |
| TWD183009S (zh) | 基板處理裝置用加熱器之部分 | |
| TWD182149S (zh) | 基板處理裝置之溫度測定器之部分 | |
| TWD225036S (zh) | 基板處理裝置用隔熱板 | |
| TWD187000S (zh) | 基板處理裝置用加熱機之部分 | |
| MY188084A (en) | Wafer-like substrate processing method, apparatus and use thereof | |
| JP1643626S (ja) | 基板保持リング |