TWD225036S - 基板處理裝置用隔熱板 - Google Patents

基板處理裝置用隔熱板 Download PDF

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Publication number
TWD225036S
TWD225036S TW110305062F TW110305062F TWD225036S TW D225036 S TWD225036 S TW D225036S TW 110305062 F TW110305062 F TW 110305062F TW 110305062 F TW110305062 F TW 110305062F TW D225036 S TWD225036 S TW D225036S
Authority
TW
Taiwan
Prior art keywords
substrate processing
heat shield
processing equipment
article
processing device
Prior art date
Application number
TW110305062F
Other languages
English (en)
Inventor
森田慎也
中嶋誠世
村田慧
Original Assignee
日商國際電氣股份有限公司
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Application filed by 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司
Publication of TWD225036S publication Critical patent/TWD225036S/zh

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Abstract

【物品用途】;本設計的物品是基板處理裝置用隔熱板，為一種應用在處理晶圓的基板處理裝置中，設置在晶舟下方，用以阻擋來自加熱器之輻射熱的隔熱板。;【設計說明】;(無)
TW110305062F 2021-03-22 2021-09-17 基板處理裝置用隔熱板 TWD225036S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-005833 2021-03-22
JP2021005833F JP1700781S (ja) 2021-03-22 2021-03-22 基板処理装置用断熱板

Publications (1)

Publication Number Publication Date
TWD225036S true TWD225036S (zh) 2023-05-01

Family

ID=78766347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110305062F TWD225036S (zh) 2021-03-22 2021-09-17 基板處理裝置用隔熱板

Country Status (3)

Country Link
US (1) USD981972S1 (zh)
JP (1) JP1700781S (zh)
TW (1) TWD225036S (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
JP1733769S (zh) * 2022-08-10 2023-01-06
JP1760960S (zh) * 2023-06-12 2024-01-10

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7325692B2 (en) * 2002-11-26 2008-02-05 Disco Corporation Cassette having separation plates for storing a plurality of semiconductor wafers
USD547147S1 (en) * 2006-09-01 2007-07-24 Huy Tran Window tinting tool
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
JP1624334S (zh) * 2018-05-18 2019-02-12
JP1624353S (zh) 2018-07-19 2019-02-12

Also Published As

Publication number Publication date
USD981972S1 (en) 2023-03-28
JP1700781S (ja) 2021-11-29

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