USD615937S1 - Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers - Google Patents

Description

FIG. 1 is front, top perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a rear, bottom perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof; and,

FIG. 9 is a cross-sectional view taken through line 9—9 of FIG. 7.

Claims (1)

1. The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

Images