USD918848S1 - Retainer of ceiling heater for semiconductor fabrication apparatus - Google Patents
Retainer of ceiling heater for semiconductor fabrication apparatus Download PDFInfo
- Publication number
- USD918848S1 USD918848S1 US29/718,687 US201929718687F USD918848S US D918848 S1 USD918848 S1 US D918848S1 US 201929718687 F US201929718687 F US 201929718687F US D918848 S USD918848 S US D918848S
- Authority
- US
- United States
- Prior art keywords
- retainer
- semiconductor fabrication
- fabrication apparatus
- ceiling heater
- ceiling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a retainer of ceiling heater for semiconductor fabrication apparatus, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-016134 | 2019-01-31 | ||
JPD2019-16134F JP1651623S (en) | 2019-07-18 | 2019-07-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD918848S1 true USD918848S1 (en) | 2021-05-11 |
Family
ID=69183226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/718,687 Active USD918848S1 (en) | 2019-07-18 | 2019-12-27 | Retainer of ceiling heater for semiconductor fabrication apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | USD918848S1 (en) |
JP (1) | JP1651623S (en) |
TW (1) | TWD206653S (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD940131S1 (en) * | 2019-07-29 | 2022-01-04 | Samsung Display Co., Ltd. | Display panel |
USD954567S1 (en) * | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
USD958094S1 (en) | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
USD959393S1 (en) * | 2020-09-24 | 2022-08-02 | Kokusai Electric Corporation | Ceiling heater for substrate processing apparatus |
USD962184S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD962183S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD966276S1 (en) | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
USD980177S1 (en) * | 2020-09-24 | 2023-03-07 | Kokusai Electric Corporation | Ceiling heater for substrate processing apparatus |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
USD1021832S1 (en) * | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
USD1034248S1 (en) | 2019-06-25 | 2024-07-09 | Ebara Corporation | Measurement jig |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD223375S (en) | 2021-03-29 | 2023-02-01 | 大陸商北京北方華創微電子裝備有限公司 | Electrostatic chuck |
Citations (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5533924A (en) * | 1994-09-01 | 1996-07-09 | Micron Technology, Inc. | Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers |
USD405427S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
US6030487A (en) * | 1997-06-19 | 2000-02-29 | International Business Machines Corporation | Wafer carrier assembly |
US6179956B1 (en) * | 1998-01-09 | 2001-01-30 | Lsi Logic Corporation | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
US6390904B1 (en) * | 1998-05-21 | 2002-05-21 | Applied Materials, Inc. | Retainers and non-abrasive liners used in chemical mechanical polishing |
US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
US6602116B1 (en) * | 1997-12-30 | 2003-08-05 | Applied Materials Inc. | Substrate retaining ring |
US6659850B2 (en) * | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US6719874B1 (en) * | 2001-03-30 | 2004-04-13 | Lam Research Corporation | Active retaining ring support |
US6733616B2 (en) * | 2001-05-25 | 2004-05-11 | Benq Corporation | Surface isolation device |
US6913669B2 (en) * | 2002-10-02 | 2005-07-05 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
US7326105B2 (en) * | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces |
US7344434B2 (en) * | 2003-11-13 | 2008-03-18 | Applied Materials, Inc. | Retaining ring with shaped surface |
USD589471S1 (en) * | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
USD600220S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
USD600660S1 (en) * | 2008-03-28 | 2009-09-22 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
USD601521S1 (en) * | 2006-09-28 | 2009-10-06 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
USD615937S1 (en) * | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
US7819723B2 (en) * | 2007-03-22 | 2010-10-26 | Nec Electronics Corporation | Retainer ring and polishing machine |
USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
US8298046B2 (en) * | 2009-10-21 | 2012-10-30 | SPM Technology, Inc. | Retaining rings |
US8517803B2 (en) * | 2009-09-16 | 2013-08-27 | SPM Technology, Inc. | Retaining ring for chemical mechanical polishing |
USD732094S1 (en) * | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
US20160376701A1 (en) * | 2014-03-20 | 2016-12-29 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and ceiling part |
US20170009367A1 (en) * | 2015-07-09 | 2017-01-12 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
JP1581406S (en) | 2016-10-14 | 2017-07-18 | ||
USD794585S1 (en) * | 2015-10-06 | 2017-08-15 | Ebara Corporation | Retainer ring for substrate |
USD797690S1 (en) * | 2015-03-16 | 2017-09-19 | Nuflare Technology, Inc. | Heater for semiconductor manufacturing apparatus |
USD798250S1 (en) * | 2015-12-01 | 2017-09-26 | Nuflare Technology, Inc. | Heater |
USD814432S1 (en) * | 2016-02-09 | 2018-04-03 | Witricity Corporation | Resonator coil |
USD825503S1 (en) * | 2017-06-07 | 2018-08-14 | Witricity Corporation | Resonator coil |
US20190024232A1 (en) * | 2017-07-14 | 2019-01-24 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and substrate retainer |
USD859332S1 (en) * | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
US20190284696A1 (en) * | 2016-12-01 | 2019-09-19 | Kokusai Electric Corporation | Substrate processing apparatus and ceiling heater |
US10500694B2 (en) * | 2013-01-11 | 2019-12-10 | Applied Materials, Inc. | Chemical mechanical polishing apparatus and methods |
USD881126S1 (en) * | 2017-08-04 | 2020-04-14 | Holygo Corporation | Coil for wireless charger |
-
2019
- 2019-07-18 JP JPD2019-16134F patent/JP1651623S/ja active Active
- 2019-11-21 TW TW108307122F patent/TWD206653S/en unknown
- 2019-12-27 US US29/718,687 patent/USD918848S1/en active Active
Patent Citations (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5533924A (en) * | 1994-09-01 | 1996-07-09 | Micron Technology, Inc. | Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers |
USD405427S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
US6030487A (en) * | 1997-06-19 | 2000-02-29 | International Business Machines Corporation | Wafer carrier assembly |
US6602116B1 (en) * | 1997-12-30 | 2003-08-05 | Applied Materials Inc. | Substrate retaining ring |
US6179956B1 (en) * | 1998-01-09 | 2001-01-30 | Lsi Logic Corporation | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
US6436228B1 (en) * | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
US6390904B1 (en) * | 1998-05-21 | 2002-05-21 | Applied Materials, Inc. | Retainers and non-abrasive liners used in chemical mechanical polishing |
US6659850B2 (en) * | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
US6719874B1 (en) * | 2001-03-30 | 2004-04-13 | Lam Research Corporation | Active retaining ring support |
US6733616B2 (en) * | 2001-05-25 | 2004-05-11 | Benq Corporation | Surface isolation device |
US6913669B2 (en) * | 2002-10-02 | 2005-07-05 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
US7344434B2 (en) * | 2003-11-13 | 2008-03-18 | Applied Materials, Inc. | Retaining ring with shaped surface |
US7326105B2 (en) * | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces |
USD589471S1 (en) * | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
USD601521S1 (en) * | 2006-09-28 | 2009-10-06 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
US7819723B2 (en) * | 2007-03-22 | 2010-10-26 | Nec Electronics Corporation | Retainer ring and polishing machine |
USD600220S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
USD600660S1 (en) * | 2008-03-28 | 2009-09-22 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
USD649126S1 (en) * | 2008-10-20 | 2011-11-22 | Ebara Corporation | Vacuum contact pad |
USD615937S1 (en) * | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
USD633452S1 (en) * | 2009-08-27 | 2011-03-01 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
US8517803B2 (en) * | 2009-09-16 | 2013-08-27 | SPM Technology, Inc. | Retaining ring for chemical mechanical polishing |
US8298046B2 (en) * | 2009-10-21 | 2012-10-30 | SPM Technology, Inc. | Retaining rings |
USD732094S1 (en) * | 2012-07-20 | 2015-06-16 | Ivoclar Vivadent Ag | Firing plate for a dental furnace |
US10500694B2 (en) * | 2013-01-11 | 2019-12-10 | Applied Materials, Inc. | Chemical mechanical polishing apparatus and methods |
USD766849S1 (en) * | 2013-05-15 | 2016-09-20 | Ebara Corporation | Substrate retaining ring |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
US20160376701A1 (en) * | 2014-03-20 | 2016-12-29 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and ceiling part |
USD797690S1 (en) * | 2015-03-16 | 2017-09-19 | Nuflare Technology, Inc. | Heater for semiconductor manufacturing apparatus |
US20170009367A1 (en) * | 2015-07-09 | 2017-01-12 | Applied Materials, Inc. | Wafer electroplating chuck assembly |
USD794585S1 (en) * | 2015-10-06 | 2017-08-15 | Ebara Corporation | Retainer ring for substrate |
USD798250S1 (en) * | 2015-12-01 | 2017-09-26 | Nuflare Technology, Inc. | Heater |
USD814432S1 (en) * | 2016-02-09 | 2018-04-03 | Witricity Corporation | Resonator coil |
USD826185S1 (en) * | 2016-10-14 | 2018-08-21 | Hitachi Kokusai Electric Inc. | Ceiling heater for substrate processing apparatus |
JP1581406S (en) | 2016-10-14 | 2017-07-18 | ||
US20190284696A1 (en) * | 2016-12-01 | 2019-09-19 | Kokusai Electric Corporation | Substrate processing apparatus and ceiling heater |
USD825503S1 (en) * | 2017-06-07 | 2018-08-14 | Witricity Corporation | Resonator coil |
USD859332S1 (en) * | 2017-06-29 | 2019-09-10 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
US20190024232A1 (en) * | 2017-07-14 | 2019-01-24 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and substrate retainer |
USD881126S1 (en) * | 2017-08-04 | 2020-04-14 | Holygo Corporation | Coil for wireless charger |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD954567S1 (en) * | 2019-06-25 | 2022-06-14 | Ebara Corporation | Measurement jig |
USD1034248S1 (en) | 2019-06-25 | 2024-07-09 | Ebara Corporation | Measurement jig |
USD962184S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD962183S1 (en) * | 2019-07-11 | 2022-08-30 | Kokusai Electric Corporation | Retainer plate of top heater for wafer processing furnace |
USD940131S1 (en) * | 2019-07-29 | 2022-01-04 | Samsung Display Co., Ltd. | Display panel |
USD958094S1 (en) | 2019-07-29 | 2022-07-19 | Samsung Display Co., Ltd. | Display panel |
USD966276S1 (en) | 2019-07-29 | 2022-10-11 | Samsung Display Co., Ltd. | Display module for wearable device |
USD1021832S1 (en) * | 2020-09-17 | 2024-04-09 | Ebara Corporation | Elastic membrane |
USD959393S1 (en) * | 2020-09-24 | 2022-08-02 | Kokusai Electric Corporation | Ceiling heater for substrate processing apparatus |
USD980177S1 (en) * | 2020-09-24 | 2023-03-07 | Kokusai Electric Corporation | Ceiling heater for substrate processing apparatus |
USD1006768S1 (en) * | 2021-01-07 | 2023-12-05 | Solaero Technologies Corp. | Semiconductor wafer for mosaic solar cell fabrication |
Also Published As
Publication number | Publication date |
---|---|
TWD206653S (en) | 2020-08-21 |
JP1651623S (en) | 2020-01-27 |
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Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |