USD600220S1 - Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers - Google Patents

Description

FIG. 1 is a perspective view;

FIG. 2 is a front view;

FIG. 3 is a rear view;

FIG. 4 is a right side view the left side being a mirror image thereof;

FIG. 5 is a plan view;

FIG. 6 is a bottom view; and,

FIG. 7 is a sectional view thereof along line 7—7 of FIG. 2.

Claims (1)

1. The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

Images